26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session

S5: Reduced Order Modeling for Multi-Physics

Time:

Monday, 07/Apr/2025:

2:50pm - 3:50pm

Session Chair: Mike Feuchter
Session Chair: Roland Niemeier

Location: Eem + Lek

Presentations

2:50pm - 3:10pm

Physics-Based Compact Modeling of an Ultrasonic Modulation MEMS Speaker Concept

Christian Görner Tenorio^1,2, Andreas Bogner¹, Christian Bretthauer¹, Heinrich Heiss¹, Gabriele Schrag²

¹Infineon Technologies AG, Neubiberg, Germany; ²Professorship of Microsensors and Actuators, Technical University of Munich, Germany

3:10pm - 3:30pm

Reduced Shell Model for the Simulation of Surface-Acoustic Waves in Piezoelectric Micromachined Ultrasound Transducer Arrays

Philipp Oliver Möhrle¹, Gabriele Schrag¹, Aleksander Bajt²

¹Technical University Munich, Germany; ²Fraunhofer Institute for Electronic Microsystems and Solid State Technologies, Munich

3:30pm - 3:50pm

Efficient Modelling and Simulation of Large PMUT Arrays for Biomedical Applications

Omer Mohamed Osman Abdalla¹, Michelangelo Gabriele Garroni², Edoardo Moretti¹, Gianluca Massimino¹, Alberto Corigliano¹, Attilio Frangi¹, Nicola Parolini², Ilario Mazzieri², Paola Antonietti², Domenico Giusti³, Alessandro Stuart Savoia⁴

¹Department of Civil and Environmental Engineering, Politecnico di Milano, 20133 Milan, Italy; ²MOX, Dipartimento di Matematica, Politecnico di Milano, Piazza Leonardo da Vinci, 20133 Milano, Italy.; ³STMicroelectronics Agrate, Via Camillo Olivetti 2, Agrate Brianza, 20864, Italy.; ⁴Dipartimento di Ingegneria Industriale, Elettronica e Meccanica, Università degli Studi Roma Tre, 00146 Roma, Italy

Conference Agenda