Conference Agenda

"Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics"
Short Course Instructor: John Lau, Unimicron Technology Corporation

"Microelectronics packaging basics in practice!"
Short Course Instructor: Valerie Volant, STMicroelectronics

Further information will follow shortly.

"From Wafer to Panel Level Packaging"
Short Course Instructors: Tanja Braun & Markus Wöhrmann, Fraunhofer IZM

"Electronic/Photonic Convergence Using Advanced Packaging: A Status"
Short Course Instructor: Stéphane Bernabé, CEA LETI

Further information will follow shortly.

"Propelling AI forward through Advanced Packaging Creativity"
by Ingu Yin Chang (Executive Vice President, ASE Inc.)

"The Interconnect 'Panelization'"
by Laurent Herard (Group VP – Head of Back End Manufacturing & Technology R&D, STMicroelectronics)

"Mass Transfer: How the Push for MicroLED Displays Opens New Paths to Heterogeneous Integration"
by Dr. Chris Bower (CTO and co-founder, X Display Company (XDC)., Inc.)

"Recent Trends in Automotive Power Module Designs and Technology for Traction Inverters"
by Dr. Uwe Hansen (VP Power Component Development, Bosch)

"System Technology Co-optimization for Advanced 3D & Heterogeneous Integration"
by Sébastien Dauvé (CEO, CEA-Leti)

"Advanced Packaging – The Key Technology for Chiplet Integration"
by Prof. Dr.-Ing. Ulrike Ganesh (Managing Director, Fraunhofer IZM)

"Charting a Path for the Chiplet Era and Beyond"
by Craig Bishop (Chief Technology Officer, Deca Technologies)