The 25th European Microelectronics &
Packaging Conference (EMPC 2025)
16 – 18 September 2025
World Trade Center, Grenoble | France
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Monday, 15/Sept/2025 | |||
| 8:30am - 6:00pm |
Pre-Registration |
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| 9:00am - 1:00pm |
SC 1: Short Course Location: Mont Blanc 4 "Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics" Short Course Instructor: John Lau, Unimicron Technology Corporation |
SC 2: Short Course Location: Mont Blanc 3 "Microelectronics Packaging Basics in Practice!" Short Course Instructor: Valérie Volant, STMicroelectronics |
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| 2:00pm - 6:00pm |
SC 3: Short Course Location: Mont Blanc 4 "From Wafer to Panel Level Packaging" Short Course Instructors: Tanja Braun & Markus Wöhrmann, Fraunhofer IZM |
SC 4: Short Course Location: Mont Blanc 3 "Electronic/Photonic Convergence Using Advanced Packaging: A Status" Short Course Instructor: Stéphane Bernabé, CEA LETI |
SC 5: Short Course Location: Mont Blanc 2 "Fundamentals and Advanced Packaging Applications of Substrates and Interposers" Short Course Instructors: Ivan Ndip (Fraunhofer IZM) & Habib Hichri (Ajinomoto Fine-Techno USA Corporation) |
| 5:00pm - 6:00pm |
IEEE EPS Distinguished Lecture Location: Auditorium "Recent Advances and Trends in Packaging" Lecturer: John Lau, Unimicron Technology Corporation |
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| 5:30pm - 7:00pm |
Cocktail Reception for Exhibitors Location: Exhibition Area |
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| Date: Tuesday, 16/Sept/2025 | ||||
| 9:00am - 9:10am |
Welcome and Conference Opening Location: Auditorium Chair: Jean-Marc Yannou, Murata |
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| 9:10am - 9:55am |
Keynote 1 Location: Auditorium Chair: Jean-Marc Yannou, Murata "Propelling AI forward through Advanced Packaging Creativity" by Ingu Yin Chang (Executive Vice President, ASE Inc.) |
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| 9:55am - 10:40am |
Keynote 2 Location: Auditorium Chair: Jean-Marc Yannou, Murata "The Interconnect 'Panelization'" by Laurent Herard (Group VP – Head of Back End Manufacturing & Technology R&D, STMicroelectronics) |
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| 10:40am - 11:15am |
Break – Exhibition |
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| 11:15am - 12:30pm |
S 1A: IC Packaging Location: Auditorium Chair: Paul Svasta, National University of Science and Technology POLITEHNICA of Bucharest |
S 1B: Interconnection Technologies Location: Kilimandjaro Chair: Hiroshi Nishikawa, Osaka University |
S 1C: Quality and Reliability Location: Mont Blanc Chair: Jean-luc Diot, ASSEMBLINNOV |
S 1D: Assembly and Manufacturing Location: Makalu Chair: Jens Müller, TU Ilmenau |
| 12:30pm - 1:50pm |
Lunch – Exhibition |
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| 1:50pm - 3:05pm |
S 2A: Design, Modelling and Simulation Location: Auditorium Chair: Jeffrey Suhling, Auburn University |
S 2B: Interconnection Technologies Location: Kilimandjaro Chair: Pradeep Lall, Auburn University |
S 2C: Special Topics Location: Mont Blanc Chair: Wilfrid Aklamavo, SERMA MICROELECTRONICS |
S 2D: Materials Location: Makalu Chair: Tanja Braun, Fraunhofer IZM |
| 3:05pm - 3:40pm |
Break – Exhibition |
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| 3:40pm - 4:25pm |
Keynote 3 Location: Auditorium Chair: Jean-Charles Souriau, CEA-Leti "Mass Transfer: How the Push for MicroLED Displays Opens New Paths to Heterogeneous Integration" by Dr. Chris Bower (CTO and Co-founder, X Display Company (XDC)., Inc.) |
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| 4:25pm - 4:35pm |
Room Change |
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| 4:35pm - 5:50pm |
S 3A: Materials Location: Auditorium Chair: Luigi Calligarich, Electron Mec srl |
S 3B: Power Electronics Location: Kilimandjaro Chair: Stoyan Stoyanov, University of Greenwich |
S 3C: Quality and Reliability Location: Mont Blanc Chair: Gabor Harsanyi, Budapest University of Technology and Economics |
S 3D: Assembly and Manufacturing Location: Makalu Chair: Laurent Mendizabal, CEA - LETI |
| 6:00pm - 7:30pm |
Dinner: Tasting of Regional Products & Exhibitors' Time (TBC) |
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| Date: Wednesday, 17/Sept/2025 | ||||
| 8:45am - 9:30am |
Keynote 4 Location: Auditorium Chair: Rolf Aschenbrenner, Fraunhofer IZM "Recent Trends in Automotive Power Module Designs and Technology for Traction Inverters" by Dr. Uwe Hansen (VP Power Component Development, Bosch) |
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| 9:30am - 10:15am |
Keynote 5 Location: Auditorium Chair: Rolf Aschenbrenner, Fraunhofer IZM "System Technology Co-optimization for Advanced 3D & Heterogeneous Integration" by Sébastien Dauvé (CEO, CEA-Leti) |
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| 10:15am - 11:00am |
Break – Posters – Exhibition |
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| 11:00am - 12:15pm |
S 4A: Assembly and Manufacturing Location: Auditorium Chair: Valérie Volant, STM |
S 4B: Design, Modelling and Simulation Location: Kilimandjaro Chair: Sung-Uk Zhang, Dong-Eui University |
S 4C: IC Packaging Location: Mont Blanc Chair: Tekfouy Lim, Fraunhofer IZM |
S 4D: POSTER SESSION #1 Location: Makalu Chair: Oliver Krammer, Budapest University of Technology and Economics |
| 12:15pm - 1:35pm |
Lunch Break – Posters – Exhibition |
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| 1:35pm - 3:15pm |
S 5A: Substrate Technologies Location: Auditorium Chair: Pascal Couderc, retired |
S 5B: Optoelectronics Location: Kilimandjaro Chair: Romain Coffy, STMicroelectronics |
S 5C: Emerging Technologies Location: Mont Blanc Chair: Tanja Braun, Fraunhofer IZM |
S 5D: POSTER SESSION #2 Location: Makalu Chair: Stoyan Stoyanov, University of Greenwich |
| 3:15pm - 3:50pm |
Break – Posters – Exhibition |
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| 3:50pm - 5:05pm |
S 6A: System in Package Location: Auditorium Chair: Jean-François Sauty, ASE |
S 6B: Quality and Reliability Location: Kilimandjaro Chair: Tobias Schramm, Amkor Technology Euroservices |
S 6C: Materials Location: Mont Blanc Chair: Oliver Chyan, University of North Texas |
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| 5:30pm - 6:00pm |
Bus transfer: Busses leaving venue for conference dinner |
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| 7:30pm - 10:15pm |
Conference Dinner |
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| Date: Thursday, 18/Sept/2025 | ||||
| 8:45am - 9:30am |
Keynote 6 Location: Auditorium Chair: Alexandre Val, VALEO "Advanced Packaging – The Key Technology for Chiplet Integration" by Prof. Dr.-Ing. Ulrike Ganesh (Managing Director, Fraunhofer IZM) |
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| 9:30am - 9:40am |
Room Change |
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| 9:40am - 10:55am |
S 7A: Smart Manufacturing Location: Auditorium Chair: Bradford J Factor, ASE |
S 7B: IC Packaging Location: Kilimandjaro Chair: Gabriel Kopp, Valeo |
S 7C: Interconnection Technologies Location: Mont Blanc Chair: Juliana Panchenko, Fraunhofer IZM ASSID |
S 7D: Inspection and Test Location: Makalu Chair: Christophe Zinck, ASE Group |
| 10:55am - 11:30am |
Break – Exhibition |
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| 11:30am - 12:45pm |
S 8A: Materials Location: Auditorium Chair: Knut Aasmundtveit, University of South-Eastern Norway |
S 8B: Assembly and Manufacturing Location: Kilimandjaro Chair: Craig Bishop, Deca Technologies |
S 8C: Power Electronics Location: Mont Blanc Chair: Verena Leitgeb, Materials Center Leoben Forschung GmbH |
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| 12:45pm - 2:00pm |
Lunch – Exhibition |
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| 2:00pm - 2:45pm |
Keynote 7 Location: Auditorium Chair: Bradford J Factor, ASE "Charting a Path for the Chiplet Era and Beyond" by Craig Bishop (Chief Technology Officer, Deca Technologies) |
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| 2:45pm - 3:15pm |
Awards and Closing Location: Auditorium Chair: Jean-Marc Yannou, Murata |
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| 3:30pm - 5:30pm |
Workshop: Pre-Brokerage for Lab to Fab Accelerator Projects on Advanced Packaging hosted by the European Association on Smart Systems Integration (EPOSS) |
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