Development of Die Attach Process for Thin Device Using a Novel High Thermal Conductivity Pressure-less Semi-sintering Paste with Capillary Filling Technology

Shogo Nakano, Low Shuey Seng, Nicoletta Modarelli, Matteo Luca Quattrocchio

A Novel Package Technology for Better MOSFET Performance

Arnel Taduran, Ilyas Dchar, Ding Yandoc

Fan Out Wafer Level Packaging – Towards a European Manufacturing Supply Chain

Marc Dreissigacker, Daniel Lieske, Tanja Braun, Markus Wöhrmann

Material Strategy and Challenges for Fine Interconnection in Advanced Packages

Kazuyuki Mitsukura

Stability of the Superconducting β-Sn Phase at Low Temperatures for 3D Cryogenic Packaging

Meriem Guergour, Feautrier Céline, Patrice Gergaud, Nicolas Vaxelaire, Guillaume Freychet, Maria-luisa Calvo-Munoz, Pierre-Emile Philip, Edouard Deschaseaux, Candice Thomas, Jean Charbonnier

Integration of Photo-imaging Technology and Microvias in LTCC for Enhanced High-frequency Applications and Packaging

Kathrin Reinhardt, Adrian Goldberg, Birgit Manhica, Lynn Ratajczak, Martin Ihle

Study of a Failure of a Compact Ceramic No-lead Package Due to Tinning Induced Thermal Shock and Its Design Improvement

Qiaochu Guo, Yi Cui, Sijia Cao, Jinhua Zhou, Shuping Meng

Assessment of QFN Assemblies’ Thermal Strain Characterization and its Evolution Through Thermal Cycling Aging

Vincent Sisomseun, Olivier Maire, Pascal Retailleau, Catherine Jephos, Alexandrine Guédon-Gracia, Hélène Frémont

Embedding of components as an effective way to achieve high reliability for special applications products

Marek Koscielski, Wojciech Steplewski, Anna Sitek, Dorota Liszewska, Adam Lipiec, Janusz Borecki

Development of Advanced Screen-printing Technology for Flip-chip Transfer of Electronic Components

David Henry, Daniel Mermin, Rémi Franiatte, Delphine Rolland, Catherine Brunet-Manquat, Thierry Flahaut, Damien Saint-patrice, Bruno Fain, Hélène Lhermet, Jean-Claude Bastien, François Blard, Emmanuel Ollier

Thinning and Dicing Process Integration of High Accuracy Using A Novel Self-assembly Stage for Chip on Wafer

Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu

A Study of 355 nm UV Laser Ablation Process for Singulation of Silicon Wafers

Serguei Stoukatch, Francois Dupont, Jean-Michel Redouté

Characterization of Chip-to-wafer Interconnects with Thick Gold Finish for Fan-out Wafer-level Packaging RDL First Integration

Arnaud Garnier, Laetitia Castagné, Guenaëlle Massignac, Rémi Franiatte, Daniel Mermin, Alain Gueugnot, Perceval Coudrain

Fine-pitch Die-to-wafer Bonding Technologies for Chiplet Integration

Juliana Panchenko, Laura Wenzel, Steffen Bickel, Adil Shehzad, Fabian Hopsch, Sebastian Quednau, Manuela Junghaehnel

Fabrication of Indium Interconnections for Flip-chip Assembly on Single Die

Mel Dehays, Sébastien Renet, Olivier Mailliart, Patrick Peray, Frédéric Berger, Guillaume Lamarache

A Methodology for Modeling Capillary Underfill (CUF) in Advanced Packaging

Dariush Ghaffari Tari, Arsia Khanfekr, Rong Zhang, Jeffrey Grover, Ning Liu, Kail Shim, Manuel Schiel, Matthew Tsai, Rossette Guino

Simulation-based Analysis of Thermal Effects Induced by RF Interference in MEMS Microphones

Yogesh Babu, Sebastian Kisban, Matthias Winter, Matthias Schmidt, Margarita Chizh, Gregor Feiertag

Numerical Case Study of Stress and Plastic Strain Distributions in BGA Solder Balls by Comparison of a Novel Inorganic Encapsulation and Conventional Underfill Variants

Alexander Reichel, Falk Naumann, Sandy Klengel

Research on Damage Behaviour of Vertical Interconnection Solder Joints in a RF SiP Module

Hui Xiao, Baojun Qiu, Jiahao Liu, Tao Lu, Xiaodong Chen, Daojun Luo

A Miniaturized Dual Band (28/39 GHz) AiP Design for Millimeter-Wave 5G Mobile Phone Applications

Sheng-Chi Hsieh

Development of a 3D Quilt Packaging Method for Implantable Applications

Chloé Bernardoni, Ahmad Shah Idil, Lewis Keeble, Timothy Constandinou

Bi–in Segregation in Low-temperature SLID Bonding: Au-in-bi System

Gayathry Thampi, Hoang Vu Nguyen, Knut Eilif Aasmundtveit

Large Area (> 2500mm²) Sintering at Sub 220°C With Micro-scale Copper Flakes

Rohan Ghosh, Olaf Rämer, Gomathi Varshini Kanthi Natarajan, Sri Krishna Bhogaraju

Influence of Total Encapsulation of White-light Mid-power LED Packages Over the Correlated Colour Temperature

Edward André Olivera Apaza, Matthias Hien, Mahmoud Beker, Markus Zankl

Exploration of Cu Interfacial Engineering to Enhance Cu Interconnects Reliability

Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, Shyam Muralidharan Nair, Khanh Tran, Shinoj Sridharan Nair, Oliver Chyan

Tailored Polymers for Wafer-level Optics Manufacturing via Nanoimprint Lithography

Patrick Schirmer, Heinrich Trischler, Stephan Prinz

Evaluations of Transient Liquid Phase Joints Using In-coated Ag Sheet

Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Hiroshi Nishikawa

Promoting EMC Adhesion to Copper Leadframe Through Oxide Thickness Optimization

Céline Feautrier, Benoit Saudet, David Henry, Christophe Licitra, Nicolas Gauthier, Paul-Henri Haumesser, Ky-Lim Tan, Hicham Aytous, Jean-Michel Morel

Thermal and Structural Analysis of GaN Layers on Foreign Substrates for Vertical Power Devices

Verena Leitgeb, Sandra Fischer, Lisa Mitterhuber, Barbara Kosednar-Legenstein, Frank Brunner, Eldad Bahat-Treidel, Elke Kraker

The next generation die top system (Ag-only DTS®) for Cu wire bonding on SiC chips

Thorsten Vehoff, Jürgen Scharf, Benjamin Fabian, Steffen Kötter, Vemal Raja Manikam

The Effect of Solder Die Attach Voids on the Junction-to-case Thermal Resistance of MOSFET Packages

Tao Lu, Baojun Qiu, Xiaodong Chen, Hui Xiao, Daojun Luo

Experimental and Numerical Investigation of the Impact of Surface Roughness of Copper Plated through Holes on Thermomechanical Reliability

Janine Conrad, Martin Schneider-Ramelow, Olaf Wittler

The Impact of Processing Conditions on Bond Reliability in Pressureless Silver Sintering

Rajrupa Paul, Francesca Vita, Corentin Seibert, Reza Soleimanzadeh, Jean-Yves Loisy, Stephan Wirths

A New Carrier Tape for Direct Transfer Bonding (DTB) Process with Ultra-thin Chips

Tomoka Kirihata, Masanori Yamagishi, Yusuke Fumita, Ichiro Sano, Jun Kaneyasu, Shinya Takyu

Ultra-precise Dispensing for High-resolution Redistribution Layers and 3D Interconnects in Advanced Packaging Applications

Filip Granek, Piotr Kowalczewski

Plasma Influence for Polymer Uniform Spreading on Heterogeneous Surfaces

Chloé Schubert, Nohora Caicedo, Sylvain Revol, Laurence Capellaro

In-situ Plasma Monitoring Study for Wire Bonding Process Improvements

Nohora Caicedo, Patricia Folio, Valentin Ray, Laurence Capellaro, Justin Catania

Impact and Control of Residual Stress in Ceramic Packages

Markus Eberstein, William Kuhblank, Rita Cicconi, Dominique de Ligny, Daniel Apel, Mirko Boin

Wafer dicing technique for close-butted assemblies

Sarah Renault, Aurélia Plihon, Emerick Lorent, Myriam Tournaire, Nicolas Bresson, Delphine Rolland

Intelligent Prediction of Warpage in Molded fcBGA Packages: An Optimization and Modeling Approach

Tang-Yuan Chen

Comparative FEA Analysis of Cu Clip and Al Wire Bonding in Power Discrete Packages

Na-Yeon Choi, Sung-Uk Zhang

Investigation of thermal performance of various thermal interface materials used in top-side-cooled MOSFETs

Kshitij Anil Kolas, Puneet Sharma, Roman Boldyrjew-Mast, Maurizio Tranchero, Sven Rzepka

Impact of PFAS Removal on the Harsh Environment Reliability of Semiconductor Packaging

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan

FC-LGA for Power Devices: Peculiarities and Challenges Compared with Digital Products

Stefano Cacciamani, Cristina Somma, Fabrice De Moro, Laurent Figuiere, Lou Roulon, Jerome Lopez, Ludovic Fourneaud

Modular Integration of Sensor-Chiplets using Rapid Prototyping including Interconnects and Protective Waveguide Packaging

Severin Schweiger, Harshitha Karnam, Sören Köble, Matthias Wambold, Nicolas Lange

Thermomechanical Study for Stress-management of Silicon Photonics Interposers

Céline Feautrier, Benoit Saudet, Jean Charbonnier, Edouard Deschaseaux, Damien Saint-Patrice, Rémi Vélard, Myriam Assous

Study on the Influence of Reflow Soldering on the Reliability of Mixed Solder Joints

Xiaodong Chen, Baojun Qiu, Zengxiong Zheng, Hui Xiao, Jiang Xie, Tao Lu, Daojun Luo

Reusing SMD Components on E-textiles: An Ageing Study by Combination of Corrosive Gases and Washing

Martin Hirman, Jiri Navratil, Andrea Benesova, Frantisek Steiner

A Comparative Study of Silver Sintering Pastes for Die-attach Applications: Microstructure, Mechanical Properties, and Reliability

Jiri Hlina, Martin Hirman, David Michal, Martin Janda

Design and Evaluation of a Perforated Dielectric Flat Lens Antenna Array for D-band Applications

Yen Ting Wang, Po-An Lin, Huei-Shyong Cho, Shih-wen Lu, Wei-Tung Chang

A High Gain Antenna-in-Package (AiP) with Horn Structure for D-band Applications

Po-An Lin, Shao-En Hsu, Shih-Wen Lu, Yu-Chang Chen, Jen-Chieh Kao

Fine-pitch Flip-chip Bonding Process with Laser Non-conductive Paste (NCP) and Laser-assisted Bonding (LAB) for High-reliability

Ki-Seok Jang, Yong-Sung Eom, Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Chan-Mi Lee, Ga-Eun Lee, Seong-Cheol Kim, Kwang-Seong Choi

Electrochemical Analysis Reveals Effective Grain Refinement in Copper Electroplating

Rui-Zhe Wu, Tzu-Hsing Chiang, Chen-Chao Wang, Chin-Pin Hung

Indium as the Superconducting Interconnect for Quantum Chiplets

Jowesh Avisheik Goundar, Mai Thi Ngoc La, Yugi Otake, Hideo Kosaka, Fumihiro Inoue

Test Equipment for Sensor Interfaces Emulated by Generic Electronic Control Unit

Nicolae Ioan Gross, Paul Svasta

Visualizing Vibrations of Electronic Modules in Test

Artem Ivanov

Grain Orientation Analysis for Thermal Cycling Evaluation of Die-attach Solder Joints

Hiroaki Tatsumi, Yujiro Hayashi, Jaemyung Kim, Makina Yabashi, Hiroshi Nishikawa

Thermal Fatigue Resistance Improvement of New Al Bonding Wire

Motoki Eto, Noritoshi Araki, Daizo Oda, Sandy Klengel, Robert Klengel, Tomohiro Uno

Thermal Analysis of Power Electronic Modules with Parametric Model Order Reduction

Sheikh Hassan, Mark Sherriff, Pearl Agyakwa, Paul Evans, Stoyan Stoyanov

Approach for Extracting the Relative Permittivity of Sol-gel Using a Ring Resonator Fabricated on an LTCC Substrate

Achraf Sadeddine, Norayr Nessimian, Camilla Karnfelt, Heike Bartsch, Jens Mueller

Insulation Layers on Copper Surfaces of Ceramic Circuit Boards for Smart Power Modules

Claudia Feller, Henry Barth, Stefan Körner, Lars Rebenklau

Optimized Castellated Hole Interconnects for Ceramic-based Modular Millimeter-Wave Applications up to 85 GHz

Paul Perlwitz, Christian Tschoban, Uwe Krieger, Qaisar Khushi Muhammad, Harald Pötter, Martin Schneider-Ramelow

Glasses as substrates for packaging: Remarks on mechanic reliability.

Martin Letz, Fabian Wagner, Inge Burger, Rule Kirchhoff, Volker Seibert, Ulrich Peuchert

Precise Alignment and Laser-assisted Bonding of Multichannel Laser Diode Chips for Silicon Photonics Integration

Aleksandr Vlasov, Joel Salmi, Heidi Tuorila, Santeri Lehtinen, Jukka Viheriälä, Mircea Guina

Assembly Perspectives on Flip-chip Integration of 1x, 4x and 8x Array InP-SiN Hybrid Laser Devices to Si Photonics Wafers with Sub-500 nm Misalignment

Damien Leech, Sulakshna Kumari, Huseyin Sar, Negin Golshani, Dmitry Kazakov, Hsiao-Lun Wang, Francois Chancerel, Geert Langenus, Hemant Kumar Tyagi, Eirini Sarelli, Sebastian Haensch, Hanh Mai, Andreas Ehrl, Aleksandrs Marinins, Charles Caer, Yannick De Koninck, Stuart Smyth, Andrew McKee, Olek Kowalski, Megan McLelland, Maumita Chakrabarti, Dimitrios Velenis, Peter Verheyen, Alain Phommahaxay, Koen Kennes, Filippo Ferraro, Yoojin Ban, Joris van Campenhout

TSVs Mechanical Stress Measurements on Silicon Wave-guide Using Phase Shift Interferometry

Jean Charbonnier, Pierre Tissier, André Myko, Stéphane Malhouitre, Myriam Assous, Rémi Vélard, Stéphane Bernabé

Package and Process Development of Molded Image Sensor Package

Alastair Attard

TBM-free Plasma Etch Die Singulation

Partia Naghibi, Aidan Knab

Anti-counterfeit Semiconductor Package Using a Unique Identification Mark

Ken Takano, Tadatomo Yamada, Toshiaki Menjo, Sayaka Matsuno, Shinya Takyu, Naoki Yoshida, Iwaki Miyamoto, Tsutomu Matsumoto

Metal Oxide Reduction Using Inline Openair-plasma Process to Enhance Adhesion and Improve Durability in Electronics

Shirisha Kulkarni, Yaser Hamedi, Nico Coenen, Daphne Pappas, Dhia Bensalem

Surface Conditioning of LTCC Substrates for Improved RF Signal Propagation

Norayr Nessimian, Achraf Sadeddine, Jens Müller, Heike Bartsch

Microelectronic Packaging Challenges for Stacked Superconducting Qubit Chips Using Indium Bump Bonding

Andreas Schneider, Aswathi Koorikkat, John D. Lipp, Marcus J. French, Narendra Acharya, Kitti Ratter, Vivek Chidambaram, Pawala Ariyathilaka

Flip-chip Bonded Hybrid Germanium X-ray Detectors Suitable for Operating with Thermal Gradient Between Sensor and ASIC

Andreas Schneider, James Hollingham, Alexander Dainty, Toby G. Brookes, John David Lipp, Matthew David Wilson, Marcus Julian French, Marcello Borri, Konrad Sutowski, Daniel Thacker, Matthew Buckland, Andrew Hill, William Helsby

Thermal Management of an Electronic Module Made by a Solderless Assembly Method

Gaudentiu Varzaru, Roxana Tulea, Madalin Moise, Mihai Branzei, Paul Svasta

Selective Micro Laser Melting: Influence of Scan Speed and Laser Power on Interconnect Morphology and Performance

Arun Kumar Sivakumar, Manish Arora

Flip Chip Bonding of PMUT Using Adhesives and their Effect on Electrical Performance

Muhammad Hassan Malik, Zhou Da, Rodrigo Tumolin Rocha, Chunlei Xu

Automated Non-destructive Mechanical Testing of Fine Pitch Wirebond Arrays

Lyle Alexander Menk

Advanced Underfill Developments Enabling Complex AI and HPC Package Designs

Ruud De Wit

Advanced Dielectric Films for Fusion Bonded 3D Integration

Taisuke Yamamoto, Hayato Kitagawa, Ryosuke Sato, Ryota Ogata, Fumihiro Inoue

Printable non-volatile and volatile memristors based on Lead-Free Perovskites for artificial synapses and neurons emulation

Michalis Loizos, Konstantinos Chatzimanolis, Konstantinos Rogdakis, Emmanuel Kymakis

Power modules: Crack and shrinkage phenomenon

Adeline Liger, Vincent Charlot, Jean-Christophe Leroux

Void inspection using stress field imaging in densely patterned bonded wafers

Zsolt Kovács, Csenge Dobos, Gábor Molnár, Zsolt Kovács, György Nádudvari, Zoltán Kiss

Photoresist/polymer removal optimized chemistry with adding hydrogen radical in MEMS process fabrication and other applications with HDRF®

Marc Segers, Giovanni Terenziani, Safia Benkoula

Innovative deposition solution for TSV integration and conformal deposition of oxide, nitride, and metal layer with dual frequency pulsed equipment, application of low temperature deposition of dielectric layer

Marc Segers, Pierre-David Szkutnik, Safia Benkoula

Temperature Profile Optimization for Vacuum Soldering of Components on Heat Sink

František Steiner, Martin Hirman, Pavel Rous, Václav Wirth

Investigating the Dynamic Bending Behaviour of Biodegradable Printed Circuit Boards

Oliver Krammer, Patrik Kovács, Attila Géczy

Stacked and Staggered Vias in FR4 laminate for special application

Aneta Cholaj, Krzysztof Lipiec, Andrzej Kiernich, Dariusz Ostaszewski, Miroslaw Kozlowski, Marek Koscielski, Adam Lipiec, Janusz Borecki

Engineering Dual Alloy Solder Paste Systems to Achieve High Reliability, Energy Savings, Withstand High Junction Temperatures

Karthik Vijay

Warpage Reduction of Laminate Substrates Through Metamodel-based Optimization of Material Properties

Fredy John Porathur, Fabian Huber, Eduard Stadler, Peter Filipp Fuchs, Dieter Paul Gruber

Highly Integrated Low Power Wireless Sensor Node

Luca Maggi, Marco Del Sarto, Amedeo Maierna, Alex Gritti, Claudio Porzi, Gaspare Santaera, Filippo Scotti, Marc Sorel, Cesare Stefanini, Antonella Bogoni, Piero Castoldi, Marco Chiesa, Aina Serrano Rodrigo, Davide Rotta

Advancing Fan-Out Wafer-Level Packaging for III-V/CMOS Optoelectronic Transceiver SiP Integration

Perceval Coudrain, Laetitia Castagné, Arnaud Garnier, Raphaël Eleouet, Emmeline Tomas, Rémi Franiatte, Rémi Vélard, Nadia Miloud-Ali, Thierry Mourier

RF Characterization of Microscale Transmission Lines on Polymer-based Silicon Interposers for HPC Applications

Alexander Gaebler, Uwe Maaß, Ivan Ndip, Kai Zoschke, Marius Adler

Advanced Defects Repair Techniques for Enhancing Yield in Packaging Architectures

Adam Ginsburg

Prognostics and Health Monitoring: Case Study of a Light Rail Vehicle Power Converter Assembly

Darshankumnar Bhat, Stefan Muench, Mathias Kaeso, Mike Roellig, Constanze Tschoepe

Optimizing Ag Paste Thickness for Reliable Power Module Packaging

Ran Liu, Chuantong Chen, Yang Liu, Koji S. Nakayama, Masahiko Nishijima, Minoru Ueshima, Katsuaki Suganuma

Ag-nodule Mediated Bonding Using Liquid Quenched Ag-Si Alloy

Koji S. Nakayama, Masahiko Nishijima, Yicheng Zhang, Chuantong Chen, Minoru Ueshima, Katsuaki Suganuma

Thermal Characterization of Electrically Conductive Adhesives and Pressureless Sinter Pastes – Comparison of Data Sheet and Real Application

Antje Steller, Moritz Schwengber, Ömer Faruk Yildiz, Jörg Franke

Characterisation and Modelling of Sintered Joints Used in Power Electronics

Laurent Vivet

Process Development for Cu Metallization on SiC MOSFETs with Inkjet Printing Technology

Xiaojie Tian, Golzar Alavi, Bernhard Polzinger, André Zimmermann

Development of a Novel Pure-ag-sintering Paste for a Jet-dispensing Process to Achieve Highest Possible Conductivity for Miniaturized Electronic Components with a Pressure-less Sintering Process

Battist Rábay, Adrian Stelzer, Julien Hossain

Additive Manufacturing of High-Performance Ceramics for Fabricating Single- and Multi-Material Components

Martin Schwentenwein, Josef Schlacher, Serkan Nohut, Sebastian Geier, Raul Bermejo

"Advanced Packaging" — A must for the Next-Gen AI and HPC Hardware ! And not Only !

M.Bilal Hachemi

Advancing IC Substrate Manufacturing: Overcoming Challenges and Exploring Opportunities with 10µm Line/Space Technology

Stephan Trautweiler

Heterogeneous Integration and Wafer-level Packaging by Micro-transfer-printing

Sebastian Wicht, Sandra Gozdzik, Kavana Mandya Sreenivasa Setty, Tino Jäger

A Novel Photo-patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-chip Interconnections

Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Ki-Seok Jang, Chanmi Lee, Gyeongmin Park, Hyemi Lee, Hyeryeon Hwang, Ga-Eun Lee, Seong-Cheol Kim, Jaejun Lee, Kwang-Seong Choi, Yong-Sung Eom

Femtosecond Laser Drilling Technologies for Through Glass Via (TGV) Fabrication in Customised Glass Interposers

Dimitris Karnakis

Integration Technology Development of Chip-Antenna Interface for Short Range mmWave Wireless Communication

Ran Yin, Tilo Meister, Mojtaba Sohrabi, Krzysztof Nieweglowski, Franz Alwin Dürrwald, Christian Hoyer, Frank Ellinger, Dirk Plettemeier, Karlheinz Bock

Key Technologies and Design Aspects for Advanced FOCoS Packaging

Cheng Hsin Liu, Yi-Sheng Lin, Yu-Jen Chang, Chen-Chao Wang, Chin-Pin Hung

Lensless Through-silicon Microscopy System for Precise Alignment in Photonic Integration Processes

Aleksandr Vlasov, Igor Shevkunov, Karen Egiazarian, Andrei Gurovich, Denis Rozhkov, Mikko Närhi, Jukka Viheriälä, Mircea Guina

Investigating the Role of Thermal Effects in RF Immunity of MEMS Microphones

Margarita Chizh, Matthias Schmidt, Sebastian Kisban, Bogdan Tanc, Yogesh Babu, Gregor Feiertag, Matthias Winter, Sushil Bharatan

Defining a Scalable Test Methodology to Deliver High Quality AI Products

Soumya Padmanabha, Gautam Nayak, Zhenxuan Zhang

Microstructural Characterization for the Joining Interface of Ag@Si Composite Sinter Joining for SiC Power Device by Scanning Transmission Electron Microscopy

Masahiko Nishijima, Ran Liu, Yang Liu, Koji. S Nakayama, Cuantong Chen, Minoru Ueshima, Katsuaki Suganuma

SACN doped solder balls alloys aging impact on BGA's reliability performance

Edwin Wakem Tangui, Laurence Capellaro, Nohora Caicedo

High density 3D interconnections for high performance CdTe based X-rays detectors

Jean-Michel Guinet, Aline Meuris, Olivier Limousin, David Baudin, Jeremy Chauveau, Denis Chesnais, Eric Tan, Fabrice Soufflet, Olivier Garel

Atmospheric Plasma Cleaning of Copper Oxide and Tin Oxide for Flux-Free Interconnect Bonding

Daniel Pascual

A single step process for Die-attach and substrate-attach with pressure assisted sintering to face harsh conditions

Anne-Marie Laügt, Mael Boland, Melanie Mathon, Battist Rabay, Adrian Stelzer, Julien Hossain

Measurements at High Temperature for Thermal Resistance of MOSFETs

Corina Ruxandra Mitulescu, Norocel Codreanu, Ciprian Ionescu, Paul Svasta, Mihai Branzei

Influence of Uneven Chip Solder Layer Thickness on the Reliability of Power Modules

Aylin Aksoy, Florian Wagner, Marcel Sippel

Reliability Evaluation of Direct Bonding for SiC Power Devices by Power Cycling Test

Marius Köhler, Jens Müller, Ansgar Ramesohl, Kurt-Georg Besendörfer, Nicolas Heuck

Understanding Solder Creepage in Thin Si Devices Through Advanced Traceability Systems

Andrea Albertinetti, Reiner Maghirang, Chaimaa El Mazyani, Abderrahim Kourimy, Ismael Tahri

Enhancing the Reliability of Harsh Environment Electronics Through PFAS-free Multilayer ALD + Parylene Coatings

Rakesh Kumar

Insulation Materials for Advanced Packaging Applications

Reki Nakano