The 25th European Microelectronics &
Packaging Conference (EMPC 2025)
16 – 18 September 2025
World Trade Center, Grenoble | France
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Monday, 15/Sept/2025 | |||
| 8:30am - 6:00pm |
Pre-Registration |
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| 9:00am - 1:00pm |
SC 1: Short Course "Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics" Short Course Instructor: John Lau, Unimicron Technology Corporation |
SC 2: Short Course "Microelectronics packaging basics in practice!" Short Course Instructor: Valerie Volant, STMicroelectronics |
SC 3: Short Course Further information will follow shortly. |
| 2:00pm - 6:00pm |
SC 4: Short Course "From Wafer to Panel Level Packaging" Short Course Instructors: Tanja Braun & Markus Wöhrmann, Fraunhofer IZM |
SC 5: Short Course "Electronic/Photonic Convergence Using Advanced Packaging: A Status" Short Course Instructor: Stéphane Bernabé, CEA LETI |
SC 6: Short Course Further information will follow shortly. |
| Date: Tuesday, 16/Sept/2025 | ||||
| 9:00am - 9:10am |
Welcome & Conference Opening |
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| 9:10am - 9:55am |
Keynote 1 Location: Amphitheatre "Propelling AI forward through Advanced Packaging Creativity" by Ingu Yin Chang (Executive Vice President, ASE Inc.) |
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| 9:55am - 10:40am |
Keynote 2 Location: Amphitheatre "The Interconnect 'Panelization'" by Laurent Herard (Group VP – Head of Back End Manufacturing & Technology R&D, STMicroelectronics) |
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| 10:40am - 11:15am |
Break – Exhibition |
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| 11:15am - 12:30pm |
S 1A: IC Packaging Location: Amphitheatre |
S 1B: Intreconnection Technologies Location: Kilimandjaro |
S 1C: Quality and Reliability Location: Mont Blanc |
S 1D: Assembly and Manufacturing Location: Makalu |
| 12:30pm - 1:50pm |
Lunch – Exhibition |
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| 1:50pm - 3:05pm |
S 2A: Interconnection Technologies Location: Amphitheatre |
S 2B: Design, Modelling and Simulation Location: Kilimandjaro |
S 2C: System in Package Location: Mont Blanc |
S 2D: Materials Location: Makalu |
| 3:05pm - 3:40pm |
Break – Exhibition |
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| 3:40pm - 4:25pm |
Keynote 3 Location: Amphitheatre "Mass Transfer: How the Push for MicroLED Displays Opens New Paths to Heterogeneous Integration" by Dr. Chris Bower (CTO and co-founder, X Display Company (XDC)., Inc.) |
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| 4:25pm - 4:35pm |
Room Change |
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| 4:35pm - 5:50pm |
S 3A: Materials Location: Amphitheatre |
S 3B: Power Electronics Location: Kilimandjaro |
S 3C: Qulaity and Reliability Location: Mont Blanc |
S 3D: Assembly and Manufactuirng Location: Makalu |
| 6:00pm - 7:30pm |
Dinner: Tasting of regional products & Exhibitors' time (TBC) |
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| Date: Wednesday, 17/Sept/2025 | ||||
| 9:00am - 9:45am |
Keynote 4 Location: Amphitheatre "Recent Trends in Automotive Power Module Designs and Technology for Traction Inverters" by Dr. Uwe Hansen (VP Power Component Development, Bosch) |
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| 9:45am - 10:30am |
Keynote 5 Location: Amphitheatre "System Technology Co-optimization for Advanced 3D & Heterogeneous Integration" by Sébastien Dauvé (CEO, CEA-Leti) |
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| 10:30am - 11:15am |
Break – Posters – Exhibition |
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| 11:15am - 12:30pm |
S 4A: Assembly and Manufacturing Location: Amphitheatre |
S 4B: Design, Modelling and Simulation Location: Kilimandjaro |
S 4C: IC Packagimg Location: Mont Blanc |
S 4D: POSTER SESSION #1 Location: Makalu |
| 12:30pm - 1:50pm |
Lunch Break – Posters – Exhibition |
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| 1:50pm - 3:30pm |
S 5A: Substrate Technologies Location: Amphitheatre |
S 5B: Optoelectronics Location: Kilimandjaro |
S 5C: Emerging Technologies Location: Mont Blanc |
S 5D: POSTER SESSION #2 Location: Makalu |
| 3:30pm - 4:05pm |
Break – Posters – Exhibition |
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| 4:05pm - 5:20pm |
S 6A: System in Package Location: Amphitheatre |
S 6B: Quality and Reliability Location: Kilimandjaro |
S 6C: Materials Location: Mont Blanc |
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| 5:45pm | Bus transfer: Busses leaving venue for confernce dinner |
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| 7:00pm - 10:00pm |
Conference Dinner |
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| Date: Thursday, 18/Sept/2025 | ||||
| 8:45am - 9:30am |
Keynote 6 Location: Amphitheatre "Advanced Packaging – The Key Technology for Chiplet Integration" by Prof. Dr.-Ing. Ulrike Ganesh (Managing Director, Fraunhofer IZM) |
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| 9:30am - 9:40am |
Room Change |
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| 9:40am - 10:55am |
S 7A: Smart Manufacturing Location: Amphitheatre |
S 7B: IC Packaging Location: Kilimandjaro |
S 7C: Intreconnection Technologies Location: Mont Blanc |
S 7D: Inspection and Test Location: Makalu |
| 10:55am - 11:30am |
Break – Exhibition |
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| 11:30am - 12:45pm |
S 8A: Quality and Reliability Location: Amphitheatre |
S 8B: Assembly and Manufcaturing Location: Kilimandjaro |
S 8C: Power Electronics Location: Mont Blanc |
S 8D: Materials Location: Makalu |
| 12:45pm - 2:00pm |
Lunch – Exhibition |
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| 2:00pm - 2:45pm |
Keynote 7 Location: Amphitheatre "Charting a Path for the Chiplet Era and Beyond" by Craig Bishop (Chief Technology Officer, Deca Technologies) |
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| 2:45pm - 3:15pm |
Awards and Closing Location: Amphitheatre |
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Contact and Legal Notice · Contact Address:  Privacy Statement · Conference: EMPC 2025 |
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