Development of Die Attach Process for Thin Device Using a Novel High Thermal Conductivity Pressure-less Semi-sintering Paste with Capillary Filling Technology

Shogo Nakano¹, Low Shuey Seng¹, Nicoletta Modarelli², Matteo Luca Quattrocchio²

¹Sumitomo Bakelite Co., Ltd.; ²STMicroelectronics

A Novel Package Technology for Better MOSFET Performance

Arnel Taduran, Ilyas Dchar, Ding Yandoc

Nexperia, United Kingdom

Fan Out Wafer Level Packaging – Towards a European Manufacturing Supply Chain

Marc Dreissigacker¹, Daniel Lieske¹, Tanja Braun², Markus Wöhrmann²

¹AEMtec GmbH, Germany; ²Fraunhofer IZM, Germany

Material Strategy and Challenges for Fine Interconnection in Advanced Packages

Kazuyuki Mitsukura

Resonac

Stability of the Superconducting β-Sn Phase at Low Temperatures for 3D Cryogenic Packaging

Meriem Guergour, Feautrier Céline, Patrice Gergaud, Nicolas Vaxelaire, Guillaume Freychet, Maria-luisa Calvo-Munoz, Pierre-Emile Philip, Edouard Deschaseaux, Candice Thomas, Jean Charbonnier

Cea, France

Integration of Photo-imaging Technology and Microvias in LTCC for Enhanced High-frequency Applications and Packaging

Kathrin Reinhardt, Adrian Goldberg, Birgit Manhica, Lynn Ratajczak, Martin Ihle

Fraunhofer IKTS, Germany

Study of a Failure of a Compact Ceramic No-lead Package Due to Tinning Induced Thermal Shock and Its Design Improvement

Qiaochu Guo^1,2, Yi Cui^1,2, Sijia Cao^1,2, Jinhua Zhou^1,2, Shuping Meng^1,2

¹Beijing Institute of Precision and Mechatronics and Controls; ²Laboratory of Aerospace Servo Actuation and Transmission

Assessment of QFN Assemblies’ Thermal Strain Characterization and its Evolution Through Thermal Cycling Aging

Vincent Sisomseun^1,3, Olivier Maire¹, Pascal Retailleau¹, Catherine Jephos², Alexandrine Guédon-Gracia³, Hélène Frémont³

¹MBDA France, France; ²DGA MI, France; ³IMS Bordeaux, France

Embedding of components as an effective way to achieve high reliability for special applications products

Marek Koscielski, Wojciech Steplewski, Anna Sitek, Dorota Liszewska, Adam Lipiec, Janusz Borecki

Łukasiewicz Research Network - ITR, Poland

Development of Advanced Screen-printing Technology for Flip-chip Transfer of Electronic Components

David Henry, Daniel Mermin, Rémi Franiatte, Delphine Rolland, Catherine Brunet-Manquat, Thierry Flahaut, Damien Saint-patrice, Bruno Fain, Hélène Lhermet, Jean-Claude Bastien, François Blard, Emmanuel Ollier

CEA, France

Thinning and Dicing Process Integration of High Accuracy Using A Novel Self-assembly Stage for Chip on Wafer

Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu

LINTEC Corporation, Japan

A Study of 355 nm UV Laser Ablation Process for Singulation of Silicon Wafers

Serguei Stoukatch, Francois Dupont, Jean-Michel Redouté

Microsys lab, Department of Electrical Engineering and Computer Science, University of Liège, Belgium

Characterization of Chip-to-wafer Interconnects with Thick Gold Finish for Fan-out Wafer-level Packaging RDL First Integration

Arnaud Garnier, Laetitia Castagné, Guenaëlle Massignac, Rémi Franiatte, Daniel Mermin, Alain Gueugnot, Perceval Coudrain

Univ. Grenoble Alpes, CEA, Leti, Grenoble, France

Fine-pitch Die-to-wafer Bonding Technologies for Chiplet Integration

Juliana Panchenko^1,2, Laura Wenzel^1,2, Steffen Bickel¹, Adil Shehzad¹, Fabian Hopsch³, Sebastian Quednau⁴, Manuela Junghaehnel¹

¹All Silicon System Integration Dresden, Fraunhofer Institute for Reliability and Microintegration IZM, Dresden, Germany; ²Institute of Electronic Packaging Technology, Technische Universität Dresden, Dresden, Germany; ³Institutsteil Entwicklung Adaptiver Systeme EAS, Fraunhofer-Institut für Integrierte Schaltungen IIS, Dresden, Germany; ⁴Nanowired GmbH, Emanuel-Merck-Straße 99, Gernsheim, Germany

Fabrication of Indium Interconnections for Flip-chip Assembly on Single Die

Mel Dehays, Sébastien Renet, Olivier Mailliart, Patrick Peray, Frédéric Berger, Guillaume Lamarache

Commissariat à l'énergie atomique (CEA), France

A Methodology for Modeling Capillary Underfill (CUF) in Advanced Packaging

Dariush Ghaffari Tari¹, Arsia Khanfekr¹, Rong Zhang¹, Jeffrey Grover¹, Ning Liu¹, Kail Shim¹, Manuel Schiel², Matthew Tsai¹, Rossette Guino³

¹Henkel, United States of America; ²Henkel AG & Co. KGaA; ³Henkel Asia Pacific

Simulation-based Analysis of Thermal Effects Induced by RF Interference in MEMS Microphones

Yogesh Babu¹, Sebastian Kisban³, Matthias Winter¹, Matthias Schmidt³, Margarita Chizh², Gregor Feiertag²

¹Rosenheim University of Applied Sciences, Rosenheim, Germany; ²Munich University of Applied Sciences, Munich, Germany; ³TDK Electronics AG, Munich, Germany

Numerical Case Study of Stress and Plastic Strain Distributions in BGA Solder Balls by Comparison of a Novel Inorganic Encapsulation and Conventional Underfill Variants

Alexander Reichel, Falk Naumann, Sandy Klengel

Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle (Saale), Germany

Research on Damage Behaviour of Vertical Interconnection Solder Joints in a RF SiP Module

Hui Xiao, Baojun Qiu, Jiahao Liu, Tao Lu, Xiaodong Chen, Daojun Luo

China Electronic Product Reliability and Environmental Testing Research Institute, China, People's Republic of

A Miniaturized Dual Band (28/39 GHz) AiP Design for Millimeter-Wave 5G Mobile Phone Applications

Sheng-Chi Hsieh

Advanced Semiconductor Engineering, Inc.(ASE group), Taiwan

Development of a 3D Quilt Packaging Method for Implantable Applications

Chloé Bernardoni¹, Ahmad Shah Idil^1,2, Lewis Keeble¹, Timothy Constandinou^1,2

¹Imperial College London, United Kingdom; ²Mint Neurotechnologies Ltd

Bi–in Segregation in Low-temperature SLID Bonding: Au-in-bi System

Gayathry Thampi, Hoang Vu Nguyen, Knut Eilif Aasmundtveit

University of South Eastern Norway, Norway

Large Area (> 2500mm²) Sintering at Sub 220°C With Micro-scale Copper Flakes

Rohan Ghosh¹, Olaf Rämer², Gomathi Varshini Kanthi Natarajan¹, Sri Krishna Bhogaraju¹

¹CuNex GmbH, Ingolstadt, Germany; ²Technische Universität Berlin, Berlin, Germany

Influence of Total Encapsulation of White-light Mid-power LED Packages Over the Correlated Colour Temperature

Edward André Olivera Apaza, Matthias Hien, Mahmoud Beker, Markus Zankl

THD Technologie Campus Cham, Germany

Exploration of Cu Interfacial Engineering to Enhance Cu Interconnects Reliability

Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, Shyam Muralidharan Nair, Khanh Tran, Shinoj Sridharan Nair, Oliver Chyan

University of North Texas, United States of America

Tailored Polymers for Wafer-level Optics Manufacturing via Nanoimprint Lithography

Patrick Schirmer, Heinrich Trischler, Stephan Prinz

DELO Industrial Adhesives, Germany

Evaluations of Transient Liquid Phase Joints Using In-coated Ag Sheet

Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Hiroshi Nishikawa

Osaka University, Japan

Promoting EMC Adhesion to Copper Leadframe Through Oxide Thickness Optimization

Céline Feautrier¹, Benoit Saudet¹, David Henry¹, Christophe Licitra¹, Nicolas Gauthier¹, Paul-Henri Haumesser¹, Ky-Lim Tan², Hicham Aytous³, Jean-Michel Morel²

¹Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France; ²Valeo, Créteil, France; ³Valeo, Sable sur Sarthe, France

Thermal and Structural Analysis of GaN Layers on Foreign Substrates for Vertical Power Devices

Verena Leitgeb¹, Sandra Fischer¹, Lisa Mitterhuber¹, Barbara Kosednar-Legenstein¹, Frank Brunner², Eldad Bahat-Treidel², Elke Kraker¹

¹Materials Center Leoben Forschung GmbH, Austria; ²Ferdinand-Braun-Institut, Germany

The next generation die top system (Ag-only DTS®) for Cu wire bonding on SiC chips

Thorsten Vehoff, Jürgen Scharf, Benjamin Fabian, Steffen Kötter, Vemal Raja Manikam

Heraeus Electronics GmbH & Co KG, Germany

The Effect of Solder Die Attach Voids on the Junction-to-case Thermal Resistance of MOSFET Packages

Tao Lu, Baojun Qiu, Xiaodong Chen, Hui Xiao, Daojun Luo

CEPREI Laboratory, China, People's Republic of

Experimental and Numerical Investigation of the Impact of Surface Roughness of Copper Plated through Holes on Thermomechanical Reliability

Janine Conrad¹, Martin Schneider-Ramelow¹, Olaf Wittler²

¹Technische Universität Berlin, Germany; ²Fraunhofer IZM Berlin, Germany

The Impact of Processing Conditions on Bond Reliability in Pressureless Silver Sintering

Rajrupa Paul, Francesca Vita, Corentin Seibert, Reza Soleimanzadeh, Jean-Yves Loisy, Stephan Wirths

Hitachi Energy Ltd., Switzerland

A New Carrier Tape for Direct Transfer Bonding (DTB) Process with Ultra-thin Chips

Tomoka Kirihata¹, Masanori Yamagishi¹, Yusuke Fumita¹, Ichiro Sano², Jun Kaneyasu², Shinya Takyu¹

¹LINTEC Corporation, Japan; ²TAZMO CO.,LTD., Japan

Ultra-precise Dispensing for High-resolution Redistribution Layers and 3D Interconnects in Advanced Packaging Applications

Filip Granek, Piotr Kowalczewski

XTPL SA, Poland

Plasma Influence for Polymer Uniform Spreading on Heterogeneous Surfaces

Chloé Schubert, Nohora Caicedo, Sylvain Revol, Laurence Capellaro

ST Microelectronis, France

In-situ Plasma Monitoring Study for Wire Bonding Process Improvements

Nohora Caicedo, Patricia Folio, Valentin Ray, Laurence Capellaro, Justin Catania

ST Microelectronis, France

Impact and Control of Residual Stress in Ceramic Packages

Markus Eberstein¹, William Kuhblank¹, Rita Cicconi², Dominique de Ligny², Daniel Apel³, Mirko Boin³

¹ASML Berlin, Germany; ²FAU Erlangen; ³Helmholtz-Zentrum Berlin

Wafer dicing technique for close-butted assemblies

Sarah Renault, Aurélia Plihon, Emerick Lorent, Myriam Tournaire, Nicolas Bresson, Delphine Rolland

CEA Grenoble, France

Intelligent Prediction of Warpage in Molded fcBGA Packages: An Optimization and Modeling Approach

Tang-Yuan Chen

Advanced Semiconductor Engineering, Inc., Taiwan

Comparative FEA Analysis of Cu Clip and Al Wire Bonding in Power Discrete Packages

Na-Yeon Choi, Sung-Uk Zhang

Dong-Eui University, Korea, Republic of (South Korea)

Investigation of thermal performance of various thermal interface materials used in top-side-cooled MOSFETs

Kshitij Anil Kolas¹, Puneet Sharma¹, Roman Boldyrjew-Mast¹, Maurizio Tranchero², Sven Rzepka¹

¹Fraunhofer Institute for Electronic Nano Systems, Germany; ²Ideas & Motion s.r.l, Cherasco, Italy

Impact of PFAS Removal on the Harsh Environment Reliability of Semiconductor Packaging

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan

Auburn University, United States of America

FC-LGA for Power Devices: Peculiarities and Challenges Compared with Digital Products

Stefano Cacciamani, Cristina Somma, Fabrice De Moro, Laurent Figuiere, Lou Roulon, Jerome Lopez, Ludovic Fourneaud

STMicroelectronics

Modular Integration of Sensor-Chiplets using Rapid Prototyping including Interconnects and Protective Waveguide Packaging

Severin Schweiger, Harshitha Karnam, Sören Köble, Matthias Wambold, Nicolas Lange

Fraunhofer Institute for Photonic Microsystems – IPMS, Germany

Thermomechanical Study for Stress-management of Silicon Photonics Interposers

Céline Feautrier, Benoit Saudet, Jean Charbonnier, Edouard Deschaseaux, Damien Saint-Patrice, Rémi Vélard, Myriam Assous

Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France

Study on the Influence of Reflow Soldering on the Reliability of Mixed Solder Joints

Xiaodong Chen, Baojun Qiu, Zengxiong Zheng, Hui Xiao, Jiang Xie, Tao Lu, Daojun Luo

China CEPREI Laboratory, China, People's Republic of

Reusing SMD Components on E-textiles: An Ageing Study by Combination of Corrosive Gases and Washing

Martin Hirman, Jiri Navratil, Andrea Benesova, Frantisek Steiner

University of West Bohemia, Faculty of Electrical Engineering, Czech Republic

A Comparative Study of Silver Sintering Pastes for Die-attach Applications: Microstructure, Mechanical Properties, and Reliability

Jiri Hlina, Martin Hirman, David Michal, Martin Janda

University of West Bohemia, Czech Republic

Design and Evaluation of a Perforated Dielectric Flat Lens Antenna Array for D-band Applications

Yen Ting Wang, Po-An Lin, Huei-Shyong Cho, Shih-wen Lu, Wei-Tung Chang

Advanced Semiconductor Engineering, Inc., Taiwan

A High Gain Antenna-in-Package (AiP) with Horn Structure for D-band Applications

Po-An Lin, Shao-En Hsu, Shih-Wen Lu, Yu-Chang Chen, Jen-Chieh Kao

Advanced Semiconductor Engineering, Inc. (ASE), Taiwan

Fine-pitch Flip-chip Bonding Process with Laser Non-conductive Paste (NCP) and Laser-assisted Bonding (LAB) for High-reliability

Ki-Seok Jang, Yong-Sung Eom, Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Chan-Mi Lee, Ga-Eun Lee, Seong-Cheol Kim, Kwang-Seong Choi

ETRI, Korea, Republic of (South Korea)

Electrochemical Analysis Reveals Effective Grain Refinement in Copper Electroplating

Rui-Zhe Wu, Tzu-Hsing Chiang, Chen-Chao Wang, Chin-Pin Hung

Advanced Semiconductor Engineering, Inc., Taiwan

Indium as the Superconducting Interconnect for Quantum Chiplets

Jowesh Avisheik Goundar¹, Mai Thi Ngoc La², Yugi Otake², Hideo Kosaka¹, Fumihiro Inoue³

¹Institute of Advanced Sciences, Yokohama National University, Japan; ²Graduate School of Engineering, Yokohama National University, Japan; ³Faculty of Engineering, Yokohama National University, Japan

Test Equipment for Sensor Interfaces Emulated by Generic Electronic Control Unit

Nicolae Ioan Gross, Paul Svasta

National University of Sciences and Technologies Politehnica, Bucharest, Romania

Visualizing Vibrations of Electronic Modules in Test

Artem Ivanov

Landshut University of Applied Sciences, Germany

Grain Orientation Analysis for Thermal Cycling Evaluation of Die-attach Solder Joints

Hiroaki Tatsumi¹, Yujiro Hayashi^2,3, Jaemyung Kim², Makina Yabashi^2,3, Hiroshi Nishikawa¹

¹The University of Osaka, Japan; ²RIKEN SPring-8 Center, Japan; ³Japan Synchrotron Radiation Research Institute, Japan

Thermal Fatigue Resistance Improvement of New Al Bonding Wire

Motoki Eto¹, Noritoshi Araki¹, Daizo Oda¹, Sandy Klengel², Robert Klengel², Tomohiro Uno³

¹Nippon Micrometal Corporation, Japan; ²Fraunhofer-Institute for Microstructure of Materials and Systems IMWS; ³Nippon Steel Corporation

Thermal Analysis of Power Electronic Modules with Parametric Model Order Reduction

Sheikh Hassan¹, Mark Sherriff², Pearl Agyakwa², Paul Evans², Stoyan Stoyanov¹

¹School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom; ²Department of Electrical and Electronic Engineering, University of Nottingham, Nottingham, United Kingdom

Approach for Extracting the Relative Permittivity of Sol-gel Using a Ring Resonator Fabricated on an LTCC Substrate

Achraf Sadeddine¹, Norayr Nessimian², Camilla Karnfelt¹, Heike Bartsch², Jens Mueller²

¹IMT atlantique, France; ²Technische Universität Ilmenau

Insulation Layers on Copper Surfaces of Ceramic Circuit Boards for Smart Power Modules

Claudia Feller, Henry Barth, Stefan Körner, Lars Rebenklau

Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany

Optimized Castellated Hole Interconnects for Ceramic-based Modular Millimeter-Wave Applications up to 85 GHz

Paul Perlwitz¹, Christian Tschoban¹, Uwe Krieger², Qaisar Khushi Muhammad², Harald Pötter¹, Martin Schneider-Ramelow¹

¹Fraunhofer IZM, Germany; ²VIA electronic GmbH, Germany

Glasses as substrates for packaging: Remarks on mechanic reliability.

Martin Letz¹, Fabian Wagner¹, Inge Burger¹, Rule Kirchhoff¹, Volker Seibert¹, Ulrich Peuchert²

¹SCHOTT AG, Mainz, Germany; ²SCHOTT Semicon Glass Solutions, Mainz, Germany

Precise Alignment and Laser-assisted Bonding of Multichannel Laser Diode Chips for Silicon Photonics Integration

Aleksandr Vlasov, Joel Salmi, Heidi Tuorila, Santeri Lehtinen, Jukka Viheriälä, Mircea Guina

Optoelectronics Research Centre, ENS Faculty, Tampere University, Finland

Assembly Perspectives on Flip-chip Integration of 1x, 4x and 8x Array InP-SiN Hybrid Laser Devices to Si Photonics Wafers with Sub-500 nm Misalignment

Damien Leech¹, Sulakshna Kumari¹, Huseyin Sar¹, Negin Golshani¹, Dmitry Kazakov¹, Hsiao-Lun Wang¹, Francois Chancerel¹, Geert Langenus¹, Hemant Kumar Tyagi¹, Eirini Sarelli¹, Sebastian Haensch², Hanh Mai², Andreas Ehrl², Aleksandrs Marinins¹, Charles Caer¹, Yannick De Koninck¹, Stuart Smyth³, Andrew McKee³, Olek Kowalski³, Megan McLelland³, Maumita Chakrabarti¹, Dimitrios Velenis¹, Peter Verheyen¹, Alain Phommahaxay¹, Koen Kennes¹, Filippo Ferraro¹, Yoojin Ban¹, Joris van Campenhout¹

¹imec, Belgium; ²ASMPT, Germany; ³Sivers Photonics, Scotland

TSVs Mechanical Stress Measurements on Silicon Wave-guide Using Phase Shift Interferometry

Jean Charbonnier¹, Pierre Tissier², André Myko¹, Stéphane Malhouitre¹, Myriam Assous¹, Rémi Vélard¹, Stéphane Bernabé¹

¹Univ. Grenoble Alpes, CEA, Leti, Grenoble, France; ²STMicroelectronics Crolles, France

Package and Process Development of Molded Image Sensor Package

Alastair Attard

UTAC Group, Singapore

TBM-free Plasma Etch Die Singulation

Partia Naghibi, Aidan Knab

HRL Laboratories, United States of America

Anti-counterfeit Semiconductor Package Using a Unique Identification Mark

Ken Takano¹, Tadatomo Yamada¹, Toshiaki Menjo¹, Sayaka Matsuno¹, Shinya Takyu¹, Naoki Yoshida², Iwaki Miyamoto², Tsutomu Matsumoto³

¹LINTEC corporation; ²Yokohama National University; ³National Institute of Advanced Industrial Science and Technology

Metal Oxide Reduction Using Inline Openair-plasma Process to Enhance Adhesion and Improve Durability in Electronics

Shirisha Kulkarni¹, Yaser Hamedi¹, Nico Coenen¹, Daphne Pappas², Dhia Bensalem¹

¹Plasmatreat GmbH, Steinhagen, Germany; ²Plasmatreat USA, Haward, USA

Surface Conditioning of LTCC Substrates for Improved RF Signal Propagation

Norayr Nessimian¹, Achraf Sadeddine², Jens Müller¹, Heike Bartsch¹

¹TU Ilmenau, Germany; ²Institut Mines-Télécom, France

Microelectronic Packaging Challenges for Stacked Superconducting Qubit Chips Using Indium Bump Bonding

Andreas Schneider¹, Aswathi Koorikkat¹, John D. Lipp¹, Marcus J. French¹, Narendra Acharya², Kitti Ratter², Vivek Chidambaram², Pawala Ariyathilaka³

¹Technology, STFC-RAL, United Kingdom; ²National Quantum Computing Centre (NQCC), STFC, United Kingdom; ³Central Laser Facility (CLF), STFC-RAL, United Kingdom

Flip-chip Bonded Hybrid Germanium X-ray Detectors Suitable for Operating with Thermal Gradient Between Sensor and ASIC

Andreas Schneider¹, James Hollingham¹, Alexander Dainty¹, Toby G. Brookes¹, John David Lipp¹, Matthew David Wilson¹, Marcus Julian French¹, Marcello Borri², Konrad Sutowski², Daniel Thacker², Matthew Buckland², Andrew Hill², William Helsby²

¹STFC-RAL, United Kingdom; ²STFC-DL, United Kingdom

Thermal Management of an Electronic Module Made by a Solderless Assembly Method

Gaudentiu Varzaru¹, Roxana Tulea¹, Madalin Moise², Mihai Branzei³, Paul Svasta²

¹Syswin Solutions, Romania; ²Electronic Technology & Reliability Department, National University of Science and Technology Politehnica Bucharest, Romania; ³Department of Metallic Materials Sciences, Physical Metallurgy, Faculty of Materials Science and Engineering, National University of Science and Technology Politehnica Bucharest, Romania

Selective Micro Laser Melting: Influence of Scan Speed and Laser Power on Interconnect Morphology and Performance

Arun Kumar Sivakumar, Manish Arora

Indian Institute of Science, Bengaluru, India

Flip Chip Bonding of PMUT Using Adhesives and their Effect on Electrical Performance

Muhammad Hassan Malik, Zhou Da, Rodrigo Tumolin Rocha, Chunlei Xu

Silicon Austria Labs,

Automated Non-destructive Mechanical Testing of Fine Pitch Wirebond Arrays

Lyle Alexander Menk

Sandia National Laboratories, United States of America

Advanced Underfill Developments Enabling Complex AI and HPC Package Designs

Ruud De Wit

Henkel Nederland BV, Netherlands, The

Advanced Dielectric Films for Fusion Bonded 3D Integration

Taisuke Yamamoto, Hayato Kitagawa, Ryosuke Sato, Ryota Ogata, Fumihiro Inoue

Yokohama National University, Japan

Printable non-volatile and volatile memristors based on Lead-Free Perovskites for artificial synapses and neurons emulation

Michalis Loizos, Konstantinos Chatzimanolis, Konstantinos Rogdakis, Emmanuel Kymakis

Hellenic Mediterranean University, Greece

Power modules: Crack and shrinkage phenomenon

Adeline Liger, Vincent Charlot, Jean-Christophe Leroux

PROTAVIC, France

Void inspection using stress field imaging in densely patterned bonded wafers

Zsolt Kovács, Csenge Dobos, Gábor Molnár, Zsolt Kovács, György Nádudvari, Zoltán Kiss

Semilab Co. Ltd., Hungary

Photoresist/polymer removal optimized chemistry with adding hydrogen radical in MEMS process fabrication and other applications with HDRF®

Marc Segers, Giovanni Terenziani, Safia Benkoula

Plasma-Therm Europe, France

Innovative deposition solution for TSV integration and conformal deposition of oxide, nitride, and metal layer with dual frequency pulsed equipment, application of low temperature deposition of dielectric layer

Marc Segers, Pierre-David Szkutnik, Safia Benkoula

Plasma-Therm Europe, France

Temperature Profile Optimization for Vacuum Soldering of Components on Heat Sink

František Steiner¹, Martin Hirman¹, Pavel Rous¹, Václav Wirth²

¹University of West Bohemia, Czech Republic; ²Rohde & Schwarz závod Vimperk, s.r.o., Czech Republic

Investigating the Dynamic Bending Behaviour of Biodegradable Printed Circuit Boards

Oliver Krammer, Patrik Kovács, Attila Géczy

Budapest University of Technology and Economics, Hungary

Stacked and Staggered Vias in FR4 laminate for special application

Aneta Cholaj, Krzysztof Lipiec, Andrzej Kiernich, Dariusz Ostaszewski, Miroslaw Kozlowski, Marek Koscielski, Adam Lipiec, Janusz Borecki

Łukasiewicz Research Network - ITR, Poland

Engineering Dual Alloy Solder Paste Systems to Achieve High Reliability, Energy Savings, Withstand High Junction Temperatures

Karthik Vijay

Indium Corporation

Warpage Reduction of Laminate Substrates Through Metamodel-based Optimization of Material Properties

Fredy John Porathur^1,2, Fabian Huber¹, Eduard Stadler¹, Peter Filipp Fuchs³, Dieter Paul Gruber^2,4

¹CSA R&D ET Packaging Development, Materials and Simulation- ams OSRAM AG, Premstaetten, Austria; ²Institute of Materials Science and Testing of Polymers- Montanuniversität Leoben, Leoben, Austria; ³Simulation and Modeling- Polymer Competence Centre Leoben (PCCL) GmbH, Leoben, Austria; ⁴Surface Testing, Robot Vision and Artificial Intelligence- Polymer Competence Centre Leoben (PCCL) GmbH, Leoben, Austria

Highly Integrated Low Power Wireless Sensor Node

Luca Maggi¹, Marco Del Sarto¹, Amedeo Maierna¹, Alex Gritti¹, Claudio Porzi², Gaspare Santaera², Filippo Scotti², Marc Sorel², Cesare Stefanini², Antonella Bogoni², Piero Castoldi², Marco Chiesa³, Aina Serrano Rodrigo³, Davide Rotta³

¹STMicroelectronics, Italy; ²Scuola Superiore Sant'Anna, Italy; ³CamGraPhIC, Italy

Advancing Fan-Out Wafer-Level Packaging for III-V/CMOS Optoelectronic Transceiver SiP Integration

Perceval Coudrain, Laetitia Castagné, Arnaud Garnier, Raphaël Eleouet, Emmeline Tomas, Rémi Franiatte, Rémi Vélard, Nadia Miloud-Ali, Thierry Mourier

Univ. Grenoble Alpes, CEA, Leti

RF Characterization of Microscale Transmission Lines on Polymer-based Silicon Interposers for HPC Applications

Alexander Gaebler¹, Uwe Maaß¹, Ivan Ndip^1,2, Kai Zoschke¹, Marius Adler¹

¹Fraunhofer IZM, Germany; ²Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Cottbus, Germany

Advanced Defects Repair Techniques for Enhancing Yield in Packaging Architectures

Adam Ginsburg

KLA, Israel

Prognostics and Health Monitoring: Case Study of a Light Rail Vehicle Power Converter Assembly

Darshankumnar Bhat, Stefan Muench, Mathias Kaeso, Mike Roellig, Constanze Tschoepe

Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany

Optimizing Ag Paste Thickness for Reliable Power Module Packaging

Ran Liu¹, Chuantong Chen¹, Yang Liu¹, Koji S. Nakayama¹, Masahiko Nishijima¹, Minoru Ueshima², Katsuaki Suganuma¹

¹Osaka University, Japan; ²Daicel Corporation, Japan

Ag-nodule Mediated Bonding Using Liquid Quenched Ag-Si Alloy

Koji S. Nakayama¹, Masahiko Nishijima¹, Yicheng Zhang¹, Chuantong Chen¹, Minoru Ueshima², Katsuaki Suganuma¹

¹Osaka University, Japan; ²Daicel Corporation, Japan

Thermal Characterization of Electrically Conductive Adhesives and Pressureless Sinter Pastes – Comparison of Data Sheet and Real Application

Antje Steller¹, Moritz Schwengber¹, Ömer Faruk Yildiz², Jörg Franke³

¹Baker Hughes Inteq GmbH, Germany; ²Novicos GmbH; ³Faculty of Electrical Engineering and Information Technology, Technical University Chemnitz

Characterisation and Modelling of Sintered Joints Used in Power Electronics

Laurent Vivet

Valeo, France

Process Development for Cu Metallization on SiC MOSFETs with Inkjet Printing Technology

Xiaojie Tian¹, Golzar Alavi¹, Bernhard Polzinger¹, André Zimmermann²

¹Robert Bosch GmbH, Germany; ²University of Stuttgart

Development of a Novel Pure-ag-sintering Paste for a Jet-dispensing Process to Achieve Highest Possible Conductivity for Miniaturized Electronic Components with a Pressure-less Sintering Process

Battist Rábay, Adrian Stelzer, Julien Hossain

Nano-Join GmbH, Germany

Additive Manufacturing of High-Performance Ceramics for Fabricating Single- and Multi-Material Components

Martin Schwentenwein¹, Josef Schlacher², Serkan Nohut¹, Sebastian Geier¹, Raul Bermejo²

¹Lithoz GmbH, Austria; ²Montanuniversitaet Leoben, Austria

"Advanced Packaging" — A must for the Next-Gen AI and HPC Hardware ! And not Only !

M.Bilal Hachemi

Yole Group, France

Advancing IC Substrate Manufacturing: Overcoming Challenges and Exploring Opportunities with 10µm Line/Space Technology

Stephan Trautweiler

GS Swiss PCB AG, Switzerland

Heterogeneous Integration and Wafer-level Packaging by Micro-transfer-printing

Sebastian Wicht, Sandra Gozdzik, Kavana Mandya Sreenivasa Setty, Tino Jäger

X-FAB MEMS Foundry GmbH, Germany

A Novel Photo-patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-chip Interconnections

Gwang-Mun Choi¹, Jiho Joo¹, Jungho Shin¹, Jin-Hyuk Oh¹, Ki-Seok Jang¹, Chanmi Lee¹, Gyeongmin Park², Hyemi Lee², Hyeryeon Hwang², Ga-Eun Lee¹, Seong-Cheol Kim¹, Jaejun Lee², Kwang-Seong Choi¹, Yong-Sung Eom¹

¹Electronics and Telecommunications Research Institute, Korea, Republic of (South Korea); ²Pusan National University, Korea, Republic of (South Korea)

Femtosecond Laser Drilling Technologies for Through Glass Via (TGV) Fabrication in Customised Glass Interposers

Dimitris Karnakis

Oxford Lasers Ltd, United Kingdom

Integration Technology Development of Chip-Antenna Interface for Short Range mmWave Wireless Communication

Ran Yin¹, Tilo Meister², Mojtaba Sohrabi³, Krzysztof Nieweglowski¹, Franz Alwin Dürrwald², Christian Hoyer², Frank Ellinger², Dirk Plettemeier³, Karlheinz Bock¹

¹Institute of Electronic Packaging Technology, Technische Universität Dresden, Germany; ²Chair for Circuit Design and Network Theory, Technische Universität Dresden, Germany; ³Chair for RF and Photonics Engineering, Technische Universität Dresden, Germany

Key Technologies and Design Aspects for Advanced FOCoS Packaging

Cheng Hsin Liu, Yi-Sheng Lin, Yu-Jen Chang, Chen-Chao Wang, Chin-Pin Hung

Advanced Semiconductor Engineering, Taiwan

Lensless Through-silicon Microscopy System for Precise Alignment in Photonic Integration Processes

Aleksandr Vlasov¹, Igor Shevkunov², Karen Egiazarian², Andrei Gurovich^1,4, Denis Rozhkov⁵, Mikko Närhi³, Jukka Viheriälä¹, Mircea Guina¹

¹Optoelectronic Research Centre, ENS Faculty, Tampere University, Finland; ²Computational Imaging Group, ITC Faculty, Tampere University, FInland; ³Photonics Group, Tampere University, FInland; ⁴Ampliconyx Oy, Finland; ⁵TU Ilmenau, Germany

Investigating the Role of Thermal Effects in RF Immunity of MEMS Microphones

Margarita Chizh¹, Matthias Schmidt², Sebastian Kisban², Bogdan Tanc², Yogesh Babu³, Gregor Feiertag¹, Matthias Winter³, Sushil Bharatan⁴

¹Department of Electrical Engineering, Munich University of Applied Sciences, Munich, Germany; ²TDK Electronics AG, Munich, Germany; ³Centre for Research and Development, Rosenheim University of Applied Sciences, Rosenheim, Germany; ⁴TDK InvenSense, Boston, USA

Defining a Scalable Test Methodology to Deliver High Quality AI Products

Soumya Padmanabha, Gautam Nayak, Zhenxuan Zhang

Meta Platforms Inc., United States of America

Microstructural Characterization for the Joining Interface of Ag@Si Composite Sinter Joining for SiC Power Device by Scanning Transmission Electron Microscopy

Masahiko Nishijima¹, Ran Liu¹, Yang Liu¹, Koji. S Nakayama¹, Cuantong Chen¹, Minoru Ueshima², Katsuaki Suganuma¹

¹F3D system Integration Lab, SANKEN, Osaka University, Japan; ²Daicel Corporation

SACN doped solder balls alloys aging impact on BGA's reliability performance

Edwin Wakem Tangui, Laurence Capellaro, Nohora Caicedo

STMicroelectronics, France

High density 3D interconnections for high performance CdTe based X-rays detectors

Jean-Michel Guinet¹, Aline Meuris², Olivier Limousin², David Baudin³, Jeremy Chauveau¹, Denis Chesnais¹, Eric Tan¹, Fabrice Soufflet¹, Olivier Garel¹

¹3D PLUS, France; ²Université Paris-Saclay, Université Paris Cité, CEA, CNRS, AIM; ³IRFU, CEA, Université Paris-Saclay

Atmospheric Plasma Cleaning of Copper Oxide and Tin Oxide for Flux-Free Interconnect Bonding

Daniel Pascual

Ontos Equipment Systems (OES), United States of America

A single step process for Die-attach and substrate-attach with pressure assisted sintering to face harsh conditions

Anne-Marie Laügt¹, Mael Boland¹, Melanie Mathon¹, Battist Rabay², Adrian Stelzer², Julien Hossain²

¹Inventec Preformance Chemicals, France; ²NANO-JOIN

Measurements at High Temperature for Thermal Resistance of MOSFETs

Corina Ruxandra Mitulescu (Sandulescu), Norocel Codreanu, Ciprian Ionescu, Paul Svasta, Mihai Branzei

National University of Science and Technology POLITEHNICA Bucharest, Romania

Influence of Uneven Chip Solder Layer Thickness on the Reliability of Power Modules

Aylin Aksoy, Florian Wagner, Marcel Sippel

Siemens AG, Germany

Reliability Evaluation of Direct Bonding for SiC Power Devices by Power Cycling Test

Marius Köhler¹, Jens Müller², Ansgar Ramesohl¹, Kurt-Georg Besendörfer², Nicolas Heuck¹

¹Hamm-Lippstadt University of Applied Sciences, Germany; ²Semikron Danfoss Elektronik GmbH & Co. KG, Nuremberg, Germany

Understanding Solder Creepage in Thin Si Devices Through Advanced Traceability Systems

Andrea Albertinetti¹, Reiner Maghirang¹, Chaimaa El Mazyani¹, Abderrahim Kourimy¹, Ismael Tahri²

¹STMicroelectronics, Morocco; ²STMicroelectronics, France

Enhancing the Reliability of Harsh Environment Electronics Through PFAS-free Multilayer ALD + Parylene Coatings

Rakesh Kumar

Specialty Coating Systems, Inc., United States of America

Insulation Materials for Advanced Packaging Applications

Reki Nakano

Ajinomoto Co., Inc., Japan