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Conference Time: 7th June 2025, 09:25:37pm CEST
 

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Date: Monday, 15/Sept/2025
8:30am - 6:00pmPre-Registration
9:00am - 1:00pmSC 1: Short Course

"Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics"
Short Course Instructor: John Lau, Unimicron Technology Corporation
9:00am - 1:00pmSC 2: Short Course

"Microelectronics packaging basics in practice!"
Short Course Instructor: Valerie Volant, STMicroelectronics
9:00am - 1:00pmSC 3: Short Course

Further information will follow shortly.
2:00pm - 6:00pmSC 4: Short Course

"From Wafer to Panel Level Packaging"
Short Course Instructors: Tanja Braun & Markus Wöhrmann, Fraunhofer IZM
2:00pm - 6:00pmSC 5: Short Course

"Electronic/Photonic Convergence Using Advanced Packaging: A Status"
Short Course Instructor: Stéphane Bernabé, CEA LETI
2:00pm - 6:00pmSC 6: Short Course

Further information will follow shortly.
Date: Tuesday, 16/Sept/2025
9:00am - 9:10amWelcome & Conference Opening
9:10am - 9:55amKeynote 1
Location: Amphitheatre

"Propelling AI forward through Advanced Packaging Creativity"
by Ingu Yin Chang (Executive Vice President, ASE Inc.)
9:55am - 10:40amKeynote 2
Location: Amphitheatre

"The Interconnect 'Panelization'"
by Laurent Herard (Group VP – Head of Back End Manufacturing & Technology R&D, STMicroelectronics)
10:40am - 11:15amBreak – Exhibition
11:15am - 12:30pmS 1A: IC Packaging
Location: Amphitheatre
11:15am - 12:30pmS 1B: Intreconnection Technologies
Location: Kilimandjaro
11:15am - 12:30pmS 1C: Quality and Reliability
Location: Mont Blanc
11:15am - 12:30pmS 1D: Assembly and Manufacturing
Location: Makalu
12:30pm - 1:50pmLunch – Exhibition
1:50pm - 3:05pmS 2A: Interconnection Technologies
Location: Amphitheatre
1:50pm - 3:05pmS 2B: Design, Modelling and Simulation
Location: Kilimandjaro
1:50pm - 3:05pmS 2C: System in Package
Location: Mont Blanc
1:50pm - 3:05pmS 2D: Materials
Location: Makalu
3:05pm - 3:40pmBreak – Exhibition
3:40pm - 4:25pmKeynote 3
Location: Amphitheatre

"Mass Transfer: How the Push for MicroLED Displays Opens New Paths to Heterogeneous Integration"
by Dr. Chris Bower (CTO and co-founder, X Display Company (XDC)., Inc.)
4:25pm - 4:35pmRoom Change
4:35pm - 5:50pmS 3A: Materials
Location: Amphitheatre
4:35pm - 5:50pmS 3B: Power Electronics
Location: Kilimandjaro
4:35pm - 5:50pmS 3C: Qulaity and Reliability
Location: Mont Blanc
4:35pm - 5:50pmS 3D: Assembly and Manufactuirng
Location: Makalu
6:00pm - 7:30pmDinner: Tasting of regional products & Exhibitors' time (TBC)
Date: Wednesday, 17/Sept/2025
9:00am - 9:45amKeynote 4
Location: Amphitheatre

"Recent Trends in Automotive Power Module Designs and Technology for Traction Inverters"
by Dr. Uwe Hansen (VP Power Component Development, Bosch)
9:45am - 10:30amKeynote 5
Location: Amphitheatre

"System Technology Co-optimization for Advanced 3D & Heterogeneous Integration"
by Sébastien Dauvé (CEO, CEA-Leti)
10:30am - 11:15amBreak – Posters – Exhibition
11:15am - 12:30pmS 4A: Assembly and Manufacturing
Location: Amphitheatre
11:15am - 12:30pmS 4B: Design, Modelling and Simulation
Location: Kilimandjaro
11:15am - 12:30pmS 4C: IC Packagimg
Location: Mont Blanc
11:15am - 12:30pmS 4D: POSTER SESSION #1
Location: Makalu
12:30pm - 1:50pmLunch Break – Posters – Exhibition
1:50pm - 3:30pmS 5A: Substrate Technologies
Location: Amphitheatre
1:50pm - 3:30pmS 5B: Optoelectronics
Location: Kilimandjaro
1:50pm - 3:30pmS 5C: Emerging Technologies
Location: Mont Blanc
1:50pm - 3:30pmS 5D: POSTER SESSION #2
Location: Makalu
3:30pm - 4:05pmBreak – Posters – Exhibition
4:05pm - 5:20pmS 6A: System in Package
Location: Amphitheatre
4:05pm - 5:20pmS 6B: Quality and Reliability
Location: Kilimandjaro
4:05pm - 5:20pmS 6C: Materials
Location: Mont Blanc
5:45pmBus transfer: Busses leaving venue for confernce dinner
7:00pm - 10:00pmConference Dinner
Date: Thursday, 18/Sept/2025
8:45am - 9:30amKeynote 6
Location: Amphitheatre

"Advanced Packaging – The Key Technology for Chiplet Integration"
by Prof. Dr.-Ing. Ulrike Ganesh (Managing Director, Fraunhofer IZM)
9:30am - 9:40amRoom Change
9:40am - 10:55amS 7A: Smart Manufacturing
Location: Amphitheatre
9:40am - 10:55amS 7B: IC Packaging
Location: Kilimandjaro
9:40am - 10:55amS 7C: Intreconnection Technologies
Location: Mont Blanc
9:40am - 10:55amS 7D: Inspection and Test
Location: Makalu
10:55am - 11:30amBreak – Exhibition
11:30am - 12:45pmS 8A: Quality and Reliability
Location: Amphitheatre
11:30am - 12:45pmS 8B: Assembly and Manufcaturing
Location: Kilimandjaro
11:30am - 12:45pmS 8C: Power Electronics
Location: Mont Blanc
11:30am - 12:45pmS 8D: Materials
Location: Makalu
12:45pm - 2:00pmLunch – Exhibition
2:00pm - 2:45pmKeynote 7
Location: Amphitheatre

"Charting a Path for the Chiplet Era and Beyond"
by Craig Bishop (Chief Technology Officer, Deca Technologies)
2:45pm - 3:15pmAwards and Closing
Location: Amphitheatre

 
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