Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
Mon 15 Sept Tue 16 Sept Wed 17 Sept Thu 18 Sept
Mon15Sept
Auditorium
Exhibition Area
Mont Blanc 4
Mont Blanc 3
Mont Blanc 2
No specific location / location unknown
08:00
09:00
10:00
11:00
12:00
13:00
14:00
15:00
16:00
17:00
18:00
19:00
20:00
21:00
22:00
IEEE EPS Distinguished Lecture
5:00pm - 6:00pm
Auditorium
Location: Auditorium
"Recent Advances and Trends in Packaging"
Lecturer: John Lau, Unimicron Technology Corporation
Cocktail Reception for Exhibitors
5:30pm - 7:00pm
Exhibition Area
Location: Exhibition Area
SC 1: Short Course
9:00am - 1:00pm
Mont Blanc 4
Location: Mont Blanc 4
"Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics"Short Course Instructor: John Lau, Unimicron Technology Corporation
SC 3: Short Course
2:00pm - 6:00pm
Mont Blanc 4
Location: Mont Blanc 4
"From Wafer to Panel Level Packaging"Short Course Instructors: Tanja Braun & Markus Wöhrmann, Fraunhofer IZM
SC 2: Short Course
9:00am - 1:00pm
Mont Blanc 3
Location: Mont Blanc 3
"Microelectronics Packaging Basics in Practice!"Short Course Instructor: Valérie Volant, STMicroelectronics
SC 4: Short Course
2:00pm - 6:00pm
Mont Blanc 3
Location: Mont Blanc 3
"Electronic/Photonic Convergence Using Advanced Packaging: A Status"Short Course Instructor: Stéphane Bernabé, CEA LETI
SC 5: Short Course
2:00pm - 6:00pm
Mont Blanc 2
Location: Mont Blanc 2
"Fundamentals and Advanced Packaging Applications of Substrates and Interposers"Short Course Instructors: Ivan Ndip (Fraunhofer IZM) & Habib Hichri (Ajinomoto Fine-Techno USA Corporation)
Pre-Registration
8:30am - 6:00pm