| Author(s) | Organization(s) | Session |
| Aasmundtveit, Knut Eilif | University of South Eastern Norway, Norway | Materials |
| Acharya, Narendra | National Quantum Computing Centre (NQCC), STFC, United Kingdom | Assembly and Manufacturing |
| Adler, Marius | Fraunhofer IZM, Germany | System in Package |
| Agyakwa, Pearl | Department of Electrical and Electronic Engineering, University of Nottingham, Nottingham, United Kingdom | POSTER SESSION #1 |
| Aksoy, Aylin | Siemens AG, Germany | Power Electronics Presenter |
| Alavi, Golzar | Robert Bosch GmbH, Germany | Smart Manufacturing |
| Albertinetti, Andrea | STMicroelectronics, Morocco | Materials |
| Alptekin, John | University of North Texas, United States of America | Materials |
| Antony Jesu Durai, Kevin | University of North Texas, United States of America | Materials |
| Apel, Daniel | Helmholtz-Zentrum Berlin | Assembly and Manufacturing |
| Araki, Noritoshi | Nippon Micrometal Corporation, Japan | POSTER SESSION #1 |
| Ariyathilaka, Pawala | Central Laser Facility (CLF), STFC-RAL, United Kingdom | Assembly and Manufacturing |
| Arora, Manish | Indian Institute of Science, Bengaluru, India | POSTER SESSION #2 |
| Assous, Myriam | Univ. Grenoble Alpes, CEA, Leti, Grenoble, France | Optoelectronics POSTER SESSION #1 |
| Attard, Alastair | UTAC Group, Singapore | Optoelectronics Presenter |
| Aytous, Hicham | Valeo, Sable sur Sarthe, France | Power Electronics |