Index of Authors

A list of all persons who contribute to the sessions of this conference. Please select a letter below to list all persons with the corresponding last name. Select the presentation in the right-hand column to access session and presentation details.

Session Overview
 
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Author(s) Organization(s) Session
Aasmundtveit, Knut EilifUniversity of South Eastern Norway, NorwayMaterials
Acharya, NarendraNational Quantum Computing Centre (NQCC), STFC, United KingdomPOSTER SESSION #2
Adler, MariusFraunhofer IZM, GermanySystem in Package
Agyakwa, PearlDepartment of Electrical and Electronic Engineering, University of Nottingham, Nottingham, United KingdomPOSTER SESSION #1
Aksoy, AylinSiemens AG, GermanyPower Electronics  Presenter
Alavi, GolzarRobert Bosch GmbH, GermanySmart Manufacturing
Albertinetti, AndreaSTMicroelectronics, MoroccoMaterials
Antony Jesu Durai, KevinUniversity of North Texas, United States of AmericaMaterials
Apel, DanielHelmholtz-Zentrum BerlinAssembly and Manufacturing
Araki, NoritoshiNippon Micrometal Corporation, JapanPOSTER SESSION #1
Ariyathilaka, PawalaCentral Laser Facility (CLF), STFC-RAL, United KingdomPOSTER SESSION #2
Arora, ManishIndian Institute of Science, Bengaluru, IndiaPOSTER SESSION #2
Assous, MyriamUniv. Grenoble Alpes, CEA, Leti, Grenoble, FranceOptoelectronics
POSTER SESSION #1
Attard, AlastairUTAC Group, SingaporeOptoelectronics  Presenter
Aytous, HichamValeo, Sable sur Sarthe, FrancePower Electronics
Babu, YogeshRosenheim University of Applied Sciences, Rosenheim, GermanyDesign, Modelling and Simulation  Presenter
Inspection and Test
Bahat-Treidel, EldadFerdinand-Braun-Institut, GermanyPower Electronics
Ban, Yoojinimec, BelgiumOptoelectronics
Barth, HenryFraunhofer Institute for Ceramic Technologies and Systems IKTS, GermanySubstrate Technologies
Bartsch, HeikeTU Ilmenau, Germany;
Technische Universität Ilmenau		Emerging Technologies
Substrate Technologies
Bastien, Jean-ClaudeCEA, FranceAssembly and Manufacturing
Baudin, DavidIRFU, CEA, Université Paris-SaclayAssembly and Manufcaturing
Beker, MahmoudTHD Technologie Campus Cham, GermanyMaterials
Benesova, AndreaUniversity of West Bohemia, Faculty of Electrical Engineering, Czech RepublicPOSTER SESSION #1
Benkoula, SafiaPlasma-Therm Europe, FrancePOSTER SESSION #2
POSTER SESSION #2
Bensalem, DhiaPlasmatreat GmbH, Steinhagen, GermanyEmerging Technologies
Berger, FrédéricCommissariat à l'énergie atomique (CEA), FranceInterconnection Technologies
Bermejo, RaulMontanuniversitaet Leoben, AustriaSmart Manufacturing
Bernabé, StéphaneUniv. Grenoble Alpes, CEA, Leti, Grenoble, FranceOptoelectronics
Bernardoni, ChloéImperial College London, United KingdomSystem in Package  Presenter
Besendörfer, Kurt-GeorgSemikron Danfoss Elektronik GmbH & Co. KG, Nuremberg, GermanyPower Electronics
Bharatan, SushilTDK InvenSense, Boston, USAInspection and Test
Bhat, DarshankumnarFraunhofer Institute for Ceramic Technologies and Systems IKTS, GermanyQuality and Reliability
Bhogaraju, Sri KrishnaCuNex GmbH, Ingolstadt, GermanyMaterials
Bickel, SteffenAll Silicon System Integration Dresden, Fraunhofer Institute for Reliability and Microintegration IZM, Dresden, GermanyInterconnection Technologies
Blard, FrançoisCEA, FranceAssembly and Manufacturing
Bock, KarlheinzInstitute of Electronic Packaging Technology, Technische Universität Dresden, GermanyIntreconnection Technologies
Bogoni, AntonellaScuola Superiore Sant'Anna, ItalySystem in Package
Boin, MirkoHelmholtz-Zentrum BerlinAssembly and Manufacturing
Boland, MaelInventec Preformance Chemicals, FranceAssembly and Manufcaturing
Boldyrjew-Mast, RomanFraunhofer Institute for Electronic Nano Systems, GermanyDesign, Modelling and Simulation
Borecki, JanuszŁukasiewicz Research Network - ITR, PolandPOSTER SESSION #2
Quality and Reliability
Borri, MarcelloSTFC-DL, United KingdomPOSTER SESSION #2
Branzei, MihaiDepartment of Metallic Materials Sciences, Physical Metallurgy, Faculty of Materials Science and Engineering, National University of Science and Technology Politehnica Bucharest, Romania;
National University of Science and Technology POLITEHNICA Bucharest, Romania		POSTER SESSION #2
Power Electronics
Braun, TanjaFraunhofer IZM, GermanyIC Packaging
Bresson, NicolasCEA Grenoble, FranceAssembly and Manufacturing
Brookes, Toby G.STFC-RAL, United KingdomPOSTER SESSION #2
Brunet-Manquat, CatherineCEA, FranceAssembly and Manufacturing
Brunner, FrankFerdinand-Braun-Institut, GermanyPower Electronics
Buckland, MatthewSTFC-DL, United KingdomPOSTER SESSION #2
Burger, IngeSCHOTT AG, Mainz, GermanySubstrate Technologies
Cacciamani, StefanoSTMicroelectronicsIC Packagimg  Presenter
Caer, Charlesimec, BelgiumOptoelectronics
Caicedo, NohoraST Microelectronis, FranceAssembly and Manufactuirng
Assembly and Manufacturing  Presenter
Quality and Reliability
Calvo-Munoz, Maria-luisaCea, FranceIntreconnection Technologies
Cao, SijiaBeijing Institute of Precision and Mechatronics and Controls;
Laboratory of Aerospace Servo Actuation and Transmission		Quality and Reliability
Capellaro, LaurenceST Microelectronis, FranceAssembly and Manufactuirng
Assembly and Manufacturing
Quality and Reliability
Castagné, LaetitiaUniv. Grenoble Alpes, CEA, Leti, Grenoble, FranceInterconnection Technologies
System in Package
Castoldi, PieroScuola Superiore Sant'Anna, ItalySystem in Package
Catania, JustinST Microelectronis, FranceAssembly and Manufacturing
Céline, FeautrierCea, FranceIntreconnection Technologies
Chakrabarti, Maumitaimec, BelgiumOptoelectronics
Chancerel, Francoisimec, BelgiumOptoelectronics
Chang, Wei-TungAdvanced Semiconductor Engineering, Inc., TaiwanPOSTER SESSION #1
Chang, Yu-JenAdvanced Semiconductor Engineering, TaiwanInspection and Test
Charbonnier, JeanCea, France;
Univ. Grenoble Alpes, CEA, Leti, Grenoble, France		Intreconnection Technologies
Optoelectronics  Presenter
POSTER SESSION #1
Charlot, VincentPROTAVIC, FrancePOSTER SESSION #2
Chatzimanolis, KonstantinosHellenic Mediterranean University, GreecePOSTER SESSION #2
Chauveau, Jeremy3D PLUS, FranceAssembly and Manufcaturing
Chen, ChuantongOsaka University, JapanMaterials
Quality and Reliability
Quality and Reliability
Chen, Tang-YuanAdvanced Semiconductor Engineering, Inc., TaiwanDesign, Modelling and Simulation
Chen, XiaodongChina CEPREI Laboratory, China, People's Republic of;
China Electronic Product Reliability and Environmental Testing Research Institute, China, People's Republic of		POSTER SESSION #1  Presenter
Qulaity and Reliability
System in Package
Chen, Yu-ChangAdvanced Semiconductor Engineering, Inc. (ASE), TaiwanPOSTER SESSION #1
Chesnais, Denis3D PLUS, FranceAssembly and Manufcaturing
Chiang, Tzu-HsingAdvanced Semiconductor Engineering, Inc., TaiwanPOSTER SESSION #1
Chidambaram, VivekNational Quantum Computing Centre (NQCC), STFC, United KingdomPOSTER SESSION #2
Chiesa, MarcoCamGraPhIC, ItalySystem in Package
Chizh, MargaritaMunich University of Applied Sciences, Munich, GermanyDesign, Modelling and Simulation
Inspection and Test  Presenter
Cho, Huei-ShyongAdvanced Semiconductor Engineering, Inc., TaiwanPOSTER SESSION #1
Choi, Gwang-MunElectronics and Telecommunications Research Institute, Korea, Republic of (South Korea);
ETRI, Korea, Republic of (South Korea)		Intreconnection Technologies  Presenter
POSTER SESSION #1
Choi, Kwang-SeongElectronics and Telecommunications Research Institute, Korea, Republic of (South Korea);
ETRI, Korea, Republic of (South Korea)		Intreconnection Technologies
POSTER SESSION #1
Choi, Na-YeonDong-Eui University, Korea, Republic of (South Korea)Design, Modelling and Simulation
Cholaj, AnetaŁukasiewicz Research Network - ITR, PolandPOSTER SESSION #2
Choudhury, PadmanavaAuburn University, United States of AmericaIC Packagimg
Chyan, OliverUniversity of North Texas, United States of AmericaMaterials
Cicconi, RitaFAU ErlangenAssembly and Manufacturing
Codreanu, NorocelNational University of Science and Technology POLITEHNICA Bucharest, RomaniaPower Electronics
Coenen, NicoPlasmatreat GmbH, Steinhagen, GermanyEmerging Technologies
Conrad, JanineTechnische Universität Berlin, GermanyQulaity and Reliability  Presenter
Constandinou, TimothyImperial College London, United Kingdom;
Mint Neurotechnologies Ltd		System in Package
Coudrain, PercevalUniv. Grenoble Alpes, CEA, Leti, Grenoble, FranceInterconnection Technologies
System in Package
Cui, YiBeijing Institute of Precision and Mechatronics and Controls;
Laboratory of Aerospace Servo Actuation and Transmission		Quality and Reliability
Da, ZhouSilicon Austria Labs,POSTER SESSION #2
Dainty, AlexanderSTFC-RAL, United KingdomPOSTER SESSION #2
Dchar, IlyasNexperia, United KingdomIC Packaging  Presenter
De Koninck, Yannickimec, BelgiumOptoelectronics
de Ligny, DominiqueFAU ErlangenAssembly and Manufacturing
De Moro, FabriceSTMicroelectronicsIC Packagimg
De Wit, RuudHenkel Nederland BV, Netherlands, ThePOSTER SESSION #2  Presenter
Dehays, MelCommissariat à l'énergie atomique (CEA), FranceInterconnection Technologies  Presenter
Del Sarto, MarcoSTMicroelectronics, ItalySystem in Package
Deschaseaux, EdouardCea, France;
Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France		Intreconnection Technologies
POSTER SESSION #1
Dobos, CsengeSemilab Co. Ltd., HungaryPOSTER SESSION #2
Dreissigacker, MarcAEMtec GmbH, GermanyIC Packaging
Dupont, FrancoisMicrosys lab, Department of Electrical Engineering and Computer Science, University of Liège, BelgiumAssembly and Manufacturing
Dürrwald, Franz AlwinChair for Circuit Design and Network Theory, Technische Universität Dresden, GermanyIntreconnection Technologies
Eberstein, MarkusASML Berlin, GermanyAssembly and Manufacturing
Egiazarian, KarenComputational Imaging Group, ITC Faculty, Tampere University, FInlandInspection and Test
Ehrl, AndreasASMPT, GermanyOptoelectronics
El Mazyani, ChaimaaSTMicroelectronics, MoroccoMaterials  Presenter
Eleouet, RaphaëlUniv. Grenoble Alpes, CEA, LetiSystem in Package
Ellinger, FrankChair for Circuit Design and Network Theory, Technische Universität Dresden, GermanyIntreconnection Technologies
Eom, Yong-SungElectronics and Telecommunications Research Institute, Korea, Republic of (South Korea);
ETRI, Korea, Republic of (South Korea)		Intreconnection Technologies
POSTER SESSION #1
Eto, MotokiNippon Micrometal Corporation, JapanPOSTER SESSION #1  Presenter
Evans, PaulDepartment of Electrical and Electronic Engineering, University of Nottingham, Nottingham, United KingdomPOSTER SESSION #1
Fabian, BenjaminHeraeus Electronics GmbH & Co KG, GermanyPower Electronics
Fain, BrunoCEA, FranceAssembly and Manufacturing
Feautrier, CélineUniv. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, FrancePOSTER SESSION #1  Presenter
Power Electronics  Presenter
Feiertag, GregorMunich University of Applied Sciences, Munich, GermanyDesign, Modelling and Simulation
Inspection and Test
Feller, ClaudiaFraunhofer Institute for Ceramic Technologies and Systems IKTS, GermanySubstrate Technologies  Presenter
Ferraro, Filippoimec, BelgiumOptoelectronics
Figuiere, LaurentSTMicroelectronicsIC Packagimg
Fischer, SandraMaterials Center Leoben Forschung GmbH, AustriaPower Electronics
Flahaut, ThierryCEA, FranceAssembly and Manufacturing
Folio, PatriciaST Microelectronis, FranceAssembly and Manufacturing
Fourneaud, LudovicSTMicroelectronicsIC Packagimg
Franiatte, RémiCEA, France;
Univ. Grenoble Alpes, CEA, Leti, Grenoble, France		Assembly and Manufacturing
Interconnection Technologies
System in Package
Franke, JörgFaculty of Electrical Engineering and Information Technology, Technical University ChemnitzMaterials
Frémont, HélèneIMS Bordeaux, FranceQuality and Reliability
French, Marcus JulianTechnology, STFC-RAL, United KingdomPOSTER SESSION #2
POSTER SESSION #2
Freychet, GuillaumeCea, FranceIntreconnection Technologies
Fuchs, Peter FilippSimulation and Modeling- Polymer Competence Centre Leoben (PCCL) GmbH, Leoben, AustriaPOSTER SESSION #2
Fumita, YusukeLINTEC Corporation, JapanAssembly and Manufactuirng
Gaebler, AlexanderFraunhofer IZM, GermanySystem in Package
Garel, Olivier3D PLUS, FranceAssembly and Manufcaturing
Garnier, ArnaudUniv. Grenoble Alpes, CEA, Leti, Grenoble, FranceInterconnection Technologies  Presenter
System in Package
Gauthier, NicolasUniv. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, FrancePower Electronics
Géczy, AttilaBudapest University of Technology and Economics, HungaryPOSTER SESSION #2
Geier, SebastianLithoz GmbH, AustriaSmart Manufacturing
Gergaud, PatriceCea, FranceIntreconnection Technologies
Ghaffari Tari, DariushHenkel, United States of AmericaDesign, Modelling and Simulation
Ghosh, RohanCuNex GmbH, Ingolstadt, GermanyMaterials  Presenter
Ginsburg, AdamKLA, IsraelQuality and Reliability
Goldberg, AdrianFraunhofer IKTS, GermanyIntreconnection Technologies
Golshani, Neginimec, BelgiumOptoelectronics
Goundar, Jowesh AvisheikInstitute of Advanced Sciences, Yokohama National University, JapanPOSTER SESSION #1  Presenter
Gozdzik, SandraX-FAB MEMS Foundry GmbH, GermanyIC Packaging
Granek, FilipXTPL SA, PolandAssembly and Manufactuirng  Presenter
Gritti, AlexSTMicroelectronics, ItalySystem in Package
Gross, Nicolae IoanNational University of Sciences and Technologies Politehnica, Bucharest, RomaniaPOSTER SESSION #1
Grover, JeffreyHenkel, United States of AmericaDesign, Modelling and Simulation
Gruber, Dieter PaulInstitute of Materials Science and Testing of Polymers- Montanuniversität Leoben, Leoben, Austria;
Surface Testing, Robot Vision and Artificial Intelligence- Polymer Competence Centre Leoben (PCCL) GmbH, Leoben, Austria		POSTER SESSION #2
Guédon-Gracia, AlexandrineIMS Bordeaux, FranceQuality and Reliability
Guergour, MeriemCea, FranceIntreconnection Technologies
Gueugnot, AlainUniv. Grenoble Alpes, CEA, Leti, Grenoble, FranceInterconnection Technologies
Guina, MirceaOptoelectronic Research Centre, ENS Faculty, Tampere University, FinlandInspection and Test
Optoelectronics
Guinet, Jean-Michel3D PLUS, FranceAssembly and Manufcaturing  Presenter
Guino, RossetteHenkel Asia PacificDesign, Modelling and Simulation
Guo, QiaochuBeijing Institute of Precision and Mechatronics and Controls;
Laboratory of Aerospace Servo Actuation and Transmission		Quality and Reliability  Presenter
Gurovich, AndreiOptoelectronic Research Centre, ENS Faculty, Tampere University, Finland;
Ampliconyx Oy, Finland		Inspection and Test
Hachemi, M.BilalYole Group, FranceIC Packaging
Haensch, SebastianASMPT, GermanyOptoelectronics
Hamedi, YaserPlasmatreat GmbH, Steinhagen, GermanyEmerging Technologies
Hassan, SheikhSchool of Computing and Mathematical Sciences, University of Greenwich, London, United KingdomPOSTER SESSION #1
Haumesser, Paul-HenriUniv. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, FrancePower Electronics
Hayashi, YujiroRIKEN SPring-8 Center, Japan;
Japan Synchrotron Radiation Research Institute, Japan		POSTER SESSION #1
Helsby, WilliamSTFC-DL, United KingdomPOSTER SESSION #2
Henry, DavidCEA, France;
Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France		Assembly and Manufacturing  Presenter
Power Electronics
Heuck, NicolasHamm-Lippstadt University of Applied Sciences, GermanyPower Electronics
Hien, MatthiasTHD Technologie Campus Cham, GermanyMaterials
Hill, AndrewSTFC-DL, United KingdomPOSTER SESSION #2
Hirman, MartinUniversity of West Bohemia, Faculty of Electrical Engineering, Czech Republic;
University of West Bohemia, Czech Republic		POSTER SESSION #1  Presenter
POSTER SESSION #1
POSTER SESSION #2
Hlina, JiriUniversity of West Bohemia, Czech RepublicPOSTER SESSION #1  Presenter
Hollingham, JamesSTFC-RAL, United KingdomPOSTER SESSION #2
Hopsch, FabianInstitutsteil Entwicklung Adaptiver Systeme EAS, Fraunhofer-Institut für Integrierte Schaltungen IIS, Dresden, GermanyInterconnection Technologies
Hossain, JulienNANO-JOIN;
Nano-Join GmbH, Germany		Assembly and Manufcaturing
Smart Manufacturing
Hoyer, ChristianChair for Circuit Design and Network Theory, Technische Universität Dresden, GermanyIntreconnection Technologies
Hsieh, Sheng-ChiAdvanced Semiconductor Engineering, Inc.(ASE group), TaiwanSystem in Package
Hsu, Shao-EnAdvanced Semiconductor Engineering, Inc. (ASE), TaiwanPOSTER SESSION #1
Huber, FabianCSA R&D ET Packaging Development, Materials and Simulation- ams OSRAM AG, Premstaetten, AustriaPOSTER SESSION #2
Hung, Chin-PinAdvanced Semiconductor Engineering, TaiwanInspection and Test
POSTER SESSION #1
Hwang, HyeryeonPusan National University, Korea, Republic of (South Korea)Intreconnection Technologies
Ihle, MartinFraunhofer IKTS, GermanyIntreconnection Technologies
Inoue, FumihiroFaculty of Engineering, Yokohama National University, JapanPOSTER SESSION #1
POSTER SESSION #2
Ionescu, CiprianNational University of Science and Technology POLITEHNICA Bucharest, RomaniaPower Electronics
Ivanov, ArtemLandshut University of Applied Sciences, GermanyPOSTER SESSION #1  Presenter
Jäger, TinoX-FAB MEMS Foundry GmbH, GermanyIC Packaging
Janda, MartinUniversity of West Bohemia, Czech RepublicPOSTER SESSION #1
Jang, Ki-SeokElectronics and Telecommunications Research Institute, Korea, Republic of (South Korea);
ETRI, Korea, Republic of (South Korea)		Intreconnection Technologies
POSTER SESSION #1  Presenter
Jephos, CatherineDGA MI, FranceQuality and Reliability
Jin, ZhiOsaka University, JapanMaterials
Joo, JihoElectronics and Telecommunications Research Institute, Korea, Republic of (South Korea);
ETRI, Korea, Republic of (South Korea)		Intreconnection Technologies
POSTER SESSION #1
Junghaehnel, ManuelaAll Silicon System Integration Dresden, Fraunhofer Institute for Reliability and Microintegration IZM, Dresden, GermanyInterconnection Technologies
Kaeso, MathiasFraunhofer Institute for Ceramic Technologies and Systems IKTS, GermanyQuality and Reliability
Kaneyasu, JunTAZMO CO.,LTD., JapanAssembly and Manufactuirng
Kanthi Natarajan, Gomathi VarshiniCuNex GmbH, Ingolstadt, GermanyMaterials
Kao, Jen-ChiehAdvanced Semiconductor Engineering, Inc. (ASE), TaiwanPOSTER SESSION #1
Karnakis, DimitrisOxford Lasers Ltd, United KingdomIntreconnection Technologies
Karnam, HarshithaFraunhofer Institute for Photonic Microsystems – IPMS, GermanyIC Packagimg
Karnfelt, CamillaIMT atlantique, FranceSubstrate Technologies
Kazakov, Dmitryimec, BelgiumOptoelectronics
Keeble, LewisImperial College London, United KingdomSystem in Package
Kennes, Koenimec, BelgiumOptoelectronics
Khanfekr, ArsiaHenkel, United States of AmericaDesign, Modelling and Simulation  Presenter
Kiernich, AndrzejŁukasiewicz Research Network - ITR, PolandPOSTER SESSION #2
Kim, JaemyungRIKEN SPring-8 Center, JapanPOSTER SESSION #1
Kim, Seong-CheolElectronics and Telecommunications Research Institute, Korea, Republic of (South Korea);
ETRI, Korea, Republic of (South Korea)		Intreconnection Technologies
POSTER SESSION #1
Kirchhoff, RuleSCHOTT AG, Mainz, GermanySubstrate Technologies
Kirihata, TomokaLINTEC Corporation, JapanAssembly and Manufactuirng  Presenter
Kisban, SebastianTDK Electronics AG, Munich, GermanyDesign, Modelling and Simulation
Inspection and Test
Kiss, ZoltánSemilab Co. Ltd., HungaryPOSTER SESSION #2
Kitagawa, HayatoYokohama National University, JapanPOSTER SESSION #2
Klengel, RobertFraunhofer-Institute for Microstructure of Materials and Systems IMWSPOSTER SESSION #1
Klengel, SandyFraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle (Saale), GermanyDesign, Modelling and Simulation
POSTER SESSION #1
Knab, AidanHRL Laboratories, United States of AmericaEmerging Technologies
Köble, SörenFraunhofer Institute for Photonic Microsystems – IPMS, GermanyIC Packagimg
Köhler, MariusHamm-Lippstadt University of Applied Sciences, GermanyPower Electronics  Presenter
Kolas, Kshitij AnilFraunhofer Institute for Electronic Nano Systems, GermanyDesign, Modelling and Simulation
Koorikkat, AswathiTechnology, STFC-RAL, United KingdomPOSTER SESSION #2
Körner, StefanFraunhofer Institute for Ceramic Technologies and Systems IKTS, GermanySubstrate Technologies
Kosaka, HideoInstitute of Advanced Sciences, Yokohama National University, JapanPOSTER SESSION #1
Koscielski, MarekŁukasiewicz Research Network - ITR, PolandPOSTER SESSION #2  Presenter
Quality and Reliability  Presenter
Kosednar-Legenstein, BarbaraMaterials Center Leoben Forschung GmbH, AustriaPower Electronics
Kötter, SteffenHeraeus Electronics GmbH & Co KG, GermanyPower Electronics
Kourimy, AbderrahimSTMicroelectronics, MoroccoMaterials
Kovács, PatrikBudapest University of Technology and Economics, HungaryPOSTER SESSION #2
Kovács, ZsoltSemilab Co. Ltd., HungaryPOSTER SESSION #2
POSTER SESSION #2  Presenter
Kowalczewski, PiotrXTPL SA, PolandAssembly and Manufactuirng
Kowalski, OlekSivers Photonics, ScotlandOptoelectronics
Kozlowski, MiroslawŁukasiewicz Research Network - ITR, PolandPOSTER SESSION #2
Kraker, ElkeMaterials Center Leoben Forschung GmbH, AustriaPower Electronics
Krammer, OliverBudapest University of Technology and Economics, HungaryPOSTER SESSION #2
Krieger, UweVIA electronic GmbH, GermanySubstrate Technologies
Kuhblank, WilliamASML Berlin, GermanyAssembly and Manufacturing
Kulkarni, ShirishaPlasmatreat GmbH, Steinhagen, GermanyEmerging Technologies  Presenter
Kumar, RakeshSpecialty Coating Systems, Inc., United States of AmericaMaterials  Presenter
Kumar Tyagi, Hemantimec, BelgiumOptoelectronics
Kumaravel, Dinesh KumarUniversity of North Texas, United States of AmericaMaterials
Kumari, Sulakshnaimec, BelgiumOptoelectronics
Kymakis, EmmanuelHellenic Mediterranean University, GreecePOSTER SESSION #2
La, Mai Thi NgocGraduate School of Engineering, Yokohama National University, JapanPOSTER SESSION #1
Lall, PradeepAuburn University, United States of AmericaIC Packagimg
Lamarache, GuillaumeCommissariat à l'énergie atomique (CEA), FranceInterconnection Technologies
Lange, NicolasFraunhofer Institute for Photonic Microsystems – IPMS, GermanyIC Packagimg
Langenus, Geertimec, BelgiumOptoelectronics
Laügt, Anne-MarieInventec Preformance Chemicals, FranceAssembly and Manufcaturing
Lee, Chan-MiETRI, Korea, Republic of (South Korea);
Electronics and Telecommunications Research Institute, Korea, Republic of (South Korea)		POSTER SESSION #1
Intreconnection Technologies
Lee, Ga-EunElectronics and Telecommunications Research Institute, Korea, Republic of (South Korea);
ETRI, Korea, Republic of (South Korea)		Intreconnection Technologies
POSTER SESSION #1
Lee, HyemiPusan National University, Korea, Republic of (South Korea)Intreconnection Technologies
Lee, JaejunPusan National University, Korea, Republic of (South Korea)Intreconnection Technologies
Leech, Damienimec, BelgiumOptoelectronics  Presenter
Lehtinen, SanteriOptoelectronics Research Centre, ENS Faculty, Tampere University, FinlandOptoelectronics
Leitgeb, VerenaMaterials Center Leoben Forschung GmbH, AustriaPower Electronics  Presenter
Leroux, Jean-ChristophePROTAVIC, FrancePOSTER SESSION #2
Letz, MartinSCHOTT AG, Mainz, GermanySubstrate Technologies
Lhermet, HélèneCEA, FranceAssembly and Manufacturing
Licitra, ChristopheUniv. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, FrancePower Electronics
Lieske, DanielAEMtec GmbH, GermanyIC Packaging
Liger, AdelinePROTAVIC, FrancePOSTER SESSION #2  Presenter
Limousin, OlivierUniversité Paris-Saclay, Université Paris Cité, CEA, CNRS, AIMAssembly and Manufcaturing
Lin, Po-AnAdvanced Semiconductor Engineering, Inc., TaiwanPOSTER SESSION #1
POSTER SESSION #1  Presenter
Lin, Yi-ShengAdvanced Semiconductor Engineering, TaiwanInspection and Test
Lipiec, AdamŁukasiewicz Research Network - ITR, PolandPOSTER SESSION #2
Quality and Reliability
Lipiec, KrzysztofŁukasiewicz Research Network - ITR, PolandPOSTER SESSION #2
Lipp, John DavidTechnology, STFC-RAL, United KingdomPOSTER SESSION #2
POSTER SESSION #2
Liszewska, DorotaŁukasiewicz Research Network - ITR, PolandQuality and Reliability
Liu, Cheng HsinAdvanced Semiconductor Engineering, TaiwanInspection and Test  Presenter
Liu, JiahaoChina Electronic Product Reliability and Environmental Testing Research Institute, China, People's Republic ofSystem in Package
Liu, NingHenkel, United States of AmericaDesign, Modelling and Simulation
Liu, RanOsaka University, JapanQuality and Reliability  Presenter
Quality and Reliability
Liu, XundaOsaka University, JapanMaterials  Presenter
Liu, YangOsaka University, JapanQuality and Reliability
Quality and Reliability
Loisy, Jean-YvesHitachi Energy Ltd., SwitzerlandQulaity and Reliability
Loizos, MichalisHellenic Mediterranean University, GreecePOSTER SESSION #2
Lopez, JeromeSTMicroelectronicsIC Packagimg
Lorent, EmerickCEA Grenoble, FranceAssembly and Manufacturing
Lu, Shih-wenAdvanced Semiconductor Engineering, Inc., TaiwanPOSTER SESSION #1
POSTER SESSION #1
Lu, TaoChina CEPREI Laboratory, China, People's Republic of;
China Electronic Product Reliability and Environmental Testing Research Institute, China, People's Republic of		POSTER SESSION #1
Qulaity and Reliability
System in Package
Luo, DaojunChina CEPREI Laboratory, China, People's Republic of;
China Electronic Product Reliability and Environmental Testing Research Institute, China, People's Republic of		POSTER SESSION #1
Qulaity and Reliability
System in Package
Maaß, UweFraunhofer IZM, GermanySystem in Package
Maggi, LucaSTMicroelectronics, ItalySystem in Package  Presenter
Maghirang, ReinerSTMicroelectronics, MoroccoMaterials
Mai, HanhASMPT, GermanyOptoelectronics
Maierna, AmedeoSTMicroelectronics, ItalySystem in Package
Mailliart, OlivierCommissariat à l'énergie atomique (CEA), FranceInterconnection Technologies
Maire, OlivierMBDA France, FranceQuality and Reliability
Malhouitre, StéphaneUniv. Grenoble Alpes, CEA, Leti, Grenoble, FranceOptoelectronics
Malik, Muhammad HassanSilicon Austria Labs,POSTER SESSION #2  Presenter
Manhica, BirgitFraunhofer IKTS, GermanyIntreconnection Technologies
Marinins, Aleksandrsimec, BelgiumOptoelectronics
Massignac, GuenaëlleUniv. Grenoble Alpes, CEA, Leti, Grenoble, FranceInterconnection Technologies
Mathon, MelanieInventec Preformance Chemicals, FranceAssembly and Manufcaturing
Matsumoto, TsutomuNational Institute of Advanced Industrial Science and TechnologyEmerging Technologies
Matsuno, SayakaLINTEC corporationEmerging Technologies
McKee, AndrewSivers Photonics, ScotlandOptoelectronics
McLelland, MeganSivers Photonics, ScotlandOptoelectronics
Meister, TiloChair for Circuit Design and Network Theory, Technische Universität Dresden, GermanyIntreconnection Technologies
Meng, ShupingBeijing Institute of Precision and Mechatronics and Controls;
Laboratory of Aerospace Servo Actuation and Transmission		Quality and Reliability
Menjo, ToshiakiLINTEC Corporation, JapanAssembly and Manufacturing
Emerging Technologies
Menk, Lyle AlexanderSandia National Laboratories, United States of AmericaPOSTER SESSION #2  Presenter
Mermin, DanielCEA, France;
Univ. Grenoble Alpes, CEA, Leti, Grenoble, France		Assembly and Manufacturing
Interconnection Technologies
Meuris, AlineUniversité Paris-Saclay, Université Paris Cité, CEA, CNRS, AIMAssembly and Manufcaturing
Michal, DavidUniversity of West Bohemia, Czech RepublicPOSTER SESSION #1
Miloud-Ali, NadiaUniv. Grenoble Alpes, CEA, LetiSystem in Package
Mitsukura, KazuyukiResonacIntreconnection Technologies
Mitterhuber, LisaMaterials Center Leoben Forschung GmbH, AustriaPower Electronics
Mitulescu (Sandulescu), Corina RuxandraNational University of Science and Technology POLITEHNICA Bucharest, RomaniaPower Electronics  Presenter
Miyamoto, IwakiYokohama National UniversityEmerging Technologies
Modarelli, NicolettaSTMicroelectronicsIC Packaging
Moise, MadalinElectronic Technology & Reliability Department, National University of Science and Technology Politehnica Bucharest, RomaniaPOSTER SESSION #2
Molnár, GáborSemilab Co. Ltd., HungaryPOSTER SESSION #2
Morel, Jean-MichelValeo, Créteil, FrancePower Electronics
Mourier, ThierryUniv. Grenoble Alpes, CEA, LetiSystem in Package
Mueller, JensTechnische Universität IlmenauSubstrate Technologies
Muench, StefanFraunhofer Institute for Ceramic Technologies and Systems IKTS, GermanyQuality and Reliability
Muhammad, Qaisar KhushiVIA electronic GmbH, GermanySubstrate Technologies
Müller, JensSemikron Danfoss Elektronik GmbH & Co. KG, Nuremberg, GermanyPower Electronics
Müller, JensTU Ilmenau, GermanyEmerging Technologies
Myko, AndréUniv. Grenoble Alpes, CEA, Leti, Grenoble, FranceOptoelectronics
Nádudvari, GyörgySemilab Co. Ltd., HungaryPOSTER SESSION #2
Naghibi, PartiaHRL Laboratories, United States of AmericaEmerging Technologies  Presenter
Nair, Shyam MuralidharanUniversity of North Texas, United States of AmericaMaterials
Nakano, RekiAjinomoto Co., Inc., JapanMaterials  Presenter
Nakano, ShogoSumitomo Bakelite Co., Ltd.IC Packaging  Presenter
Nakayama, Koji S.Osaka University, JapanMaterials  Presenter
Quality and Reliability
Quality and Reliability
Närhi, MikkoPhotonics Group, Tampere University, FInlandInspection and Test
Naumann, FalkFraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle (Saale), GermanyDesign, Modelling and Simulation
Navratil, JiriUniversity of West Bohemia, Faculty of Electrical Engineering, Czech RepublicPOSTER SESSION #1
Nayak, GautamMeta Platforms Inc., United States of AmericaQuality and Reliability
Ndip, IvanFraunhofer IZM, Germany;
Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Cottbus, Germany		System in Package
Nessimian, NorayrTU Ilmenau, Germany;
Technische Universität Ilmenau		Emerging Technologies  Presenter
Substrate Technologies
Nguyen, Hoang VuUniversity of South Eastern Norway, NorwayMaterials
Nieweglowski, KrzysztofInstitute of Electronic Packaging Technology, Technische Universität Dresden, GermanyIntreconnection Technologies
Nishijima, MasahikoOsaka University, JapanMaterials
Quality and Reliability
Quality and Reliability  Presenter
Nishikawa, HiroshiOsaka University, Japan;
The University of Osaka, Japan		Materials
POSTER SESSION #1
Nohut, SerkanLithoz GmbH, AustriaSmart Manufacturing
Oda, DaizoNippon Micrometal Corporation, JapanPOSTER SESSION #1
Ogata, RyotaYokohama National University, JapanPOSTER SESSION #2
Oh, Jin-HyukElectronics and Telecommunications Research Institute, Korea, Republic of (South Korea);
ETRI, Korea, Republic of (South Korea)		Intreconnection Technologies
POSTER SESSION #1
Olivera Apaza, Edward AndréTHD Technologie Campus Cham, GermanyMaterials  Presenter
Ollier, EmmanuelCEA, FranceAssembly and Manufacturing
Ostaszewski, DariuszŁukasiewicz Research Network - ITR, PolandPOSTER SESSION #2
Otake, YugiGraduate School of Engineering, Yokohama National University, JapanPOSTER SESSION #1
Padmanabha, SoumyaMeta Platforms Inc., United States of AmericaQuality and Reliability  Presenter
Panchenko, JulianaAll Silicon System Integration Dresden, Fraunhofer Institute for Reliability and Microintegration IZM, Dresden, Germany;
Institute of Electronic Packaging Technology, Technische Universität Dresden, Dresden, Germany		Interconnection Technologies  Presenter
Pandurangan, AathiAuburn University, United States of AmericaIC Packagimg
Pappas, DaphnePlasmatreat USA, Haward, USAEmerging Technologies
Park, GyeongminPusan National University, Korea, Republic of (South Korea)Intreconnection Technologies
Pascual, DanielOntos Equipment Systems (OES), United States of AmericaAssembly and Manufcaturing
Paul, RajrupaHitachi Energy Ltd., SwitzerlandQulaity and Reliability  Presenter
Peray, PatrickCommissariat à l'énergie atomique (CEA), FranceInterconnection Technologies
Perlwitz, PaulFraunhofer IZM, GermanySubstrate Technologies
Peuchert, UlrichSCHOTT Semicon Glass Solutions, Mainz, GermanySubstrate Technologies
Philip, Pierre-EmileCea, FranceIntreconnection Technologies
Phommahaxay, Alainimec, BelgiumOptoelectronics
Plettemeier, DirkChair for RF and Photonics Engineering, Technische Universität Dresden, GermanyIntreconnection Technologies
Plihon, AuréliaCEA Grenoble, FranceAssembly and Manufacturing
Polzinger, BernhardRobert Bosch GmbH, GermanySmart Manufacturing
Porathur, Fredy JohnCSA R&D ET Packaging Development, Materials and Simulation- ams OSRAM AG, Premstaetten, Austria;
Institute of Materials Science and Testing of Polymers- Montanuniversität Leoben, Leoben, Austria		POSTER SESSION #2
Porzi, ClaudioScuola Superiore Sant'Anna, ItalySystem in Package
Pötter, HaraldFraunhofer IZM, GermanySubstrate Technologies
Prinz, StephanDELO Industrial Adhesives, GermanyMaterials
Qiu, BaojunChina CEPREI Laboratory, China, People's Republic ofPOSTER SESSION #1
Qulaity and Reliability
Qiu, BaojunChina Electronic Product Reliability and Environmental Testing Research Institute, China, People's Republic ofSystem in Package
Quattrocchio, Matteo LucaSTMicroelectronicsIC Packaging
Quednau, SebastianNanowired GmbH, Emanuel-Merck-Straße 99, Gernsheim, GermanyInterconnection Technologies
Rabay, BattistNANO-JOINAssembly and Manufcaturing
Rábay, BattistNano-Join GmbH, GermanySmart Manufacturing  Presenter
Raja Manikam, VemalHeraeus Electronics GmbH & Co KG, GermanyPower Electronics
Rämer, OlafTechnische Universität Berlin, Berlin, GermanyMaterials
Ramesohl, AnsgarHamm-Lippstadt University of Applied Sciences, GermanyPower Electronics
Ratajczak, LynnFraunhofer IKTS, GermanyIntreconnection Technologies
Ratter, KittiNational Quantum Computing Centre (NQCC), STFC, United KingdomPOSTER SESSION #2
Ray, ValentinST Microelectronis, FranceAssembly and Manufacturing
Rebenklau, LarsFraunhofer Institute for Ceramic Technologies and Systems IKTS, GermanySubstrate Technologies
Redouté, Jean-MichelMicrosys lab, Department of Electrical Engineering and Computer Science, University of Liège, BelgiumAssembly and Manufacturing
Reichel, AlexanderFraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle (Saale), GermanyDesign, Modelling and Simulation
Reinhardt, KathrinFraunhofer IKTS, GermanyIntreconnection Technologies  Presenter
Renault, SarahCEA Grenoble, FranceAssembly and Manufacturing  Presenter
Renet, SébastienCommissariat à l'énergie atomique (CEA), FranceInterconnection Technologies
Retailleau, PascalMBDA France, FranceQuality and Reliability
Revol, SylvainST Microelectronis, FranceAssembly and Manufactuirng
Rocha, Rodrigo TumolinSilicon Austria Labs,POSTER SESSION #2
Roellig, MikeFraunhofer Institute for Ceramic Technologies and Systems IKTS, GermanyQuality and Reliability
Rogdakis, KonstantinosHellenic Mediterranean University, GreecePOSTER SESSION #2
Rolland, DelphineCEA, France;
CEA Grenoble, France		Assembly and Manufacturing
Assembly and Manufacturing
Rotta, DavideCamGraPhIC, ItalySystem in Package
Roulon, LouSTMicroelectronicsIC Packagimg
Rous, PavelUniversity of West Bohemia, Czech RepublicPOSTER SESSION #2
Rozhkov, DenisTU Ilmenau, GermanyInspection and Test
Rzepka, SvenFraunhofer Institute for Electronic Nano Systems, GermanyDesign, Modelling and Simulation
Sadeddine, AchrafInstitut Mines-Télécom, France;
IMT atlantique, France		Emerging Technologies
Substrate Technologies  Presenter
Saint-patrice, DamienCEA, France;
Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France		Assembly and Manufacturing
POSTER SESSION #1
Salmi, JoelOptoelectronics Research Centre, ENS Faculty, Tampere University, FinlandOptoelectronics
Sano, IchiroTAZMO CO.,LTD., JapanAssembly and Manufactuirng
Santaera, GaspareScuola Superiore Sant'Anna, ItalySystem in Package
Sar, Huseyinimec, BelgiumOptoelectronics
Sarelli, Eiriniimec, BelgiumOptoelectronics
Sato, RyosukeYokohama National University, JapanPOSTER SESSION #2
Saudet, BenoitUniv. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, FrancePOSTER SESSION #1
Power Electronics
Scharf, JürgenHeraeus Electronics GmbH & Co KG, GermanyPower Electronics
Schiel, ManuelHenkel AG & Co. KGaADesign, Modelling and Simulation
Schirmer, PatrickDELO Industrial Adhesives, GermanyMaterials  Presenter
Schlacher, JosefMontanuniversitaet Leoben, AustriaSmart Manufacturing
Schmidt, MatthiasTDK Electronics AG, Munich, GermanyDesign, Modelling and Simulation
Inspection and Test
Schneider, AndreasTechnology, STFC-RAL, United KingdomPOSTER SESSION #2  Presenter
POSTER SESSION #2  Presenter
Schneider-Ramelow, MartinFraunhofer IZM, GermanySubstrate Technologies
Schneider-Ramelow, MartinTechnische Universität Berlin, GermanyQulaity and Reliability
Schubert, ChloéST Microelectronis, FranceAssembly and Manufactuirng  Presenter
Schweiger, SeverinFraunhofer Institute for Photonic Microsystems – IPMS, GermanyIC Packagimg  Presenter
Schwengber, MoritzBaker Hughes Inteq GmbH, GermanyMaterials
Schwentenwein, MartinLithoz GmbH, AustriaSmart Manufacturing  Presenter
Scotti, FilippoScuola Superiore Sant'Anna, ItalySystem in Package
Segers, MarcPlasma-Therm Europe, FrancePOSTER SESSION #2
POSTER SESSION #2
Seibert, CorentinHitachi Energy Ltd., SwitzerlandQulaity and Reliability
Seibert, VolkerSCHOTT AG, Mainz, GermanySubstrate Technologies
Seng, Low ShueySumitomo Bakelite Co., Ltd.IC Packaging
Serrano Rodrigo, AinaCamGraPhIC, ItalySystem in Package
Setty, Kavana Mandya SreenivasaX-FAB MEMS Foundry GmbH, GermanyIC Packaging
Shah Idil, AhmadImperial College London, United Kingdom;
Mint Neurotechnologies Ltd		System in Package
Sharma, PuneetFraunhofer Institute for Electronic Nano Systems, GermanyDesign, Modelling and Simulation
Shehzad, AdilAll Silicon System Integration Dresden, Fraunhofer Institute for Reliability and Microintegration IZM, Dresden, GermanyInterconnection Technologies
Sherriff, MarkDepartment of Electrical and Electronic Engineering, University of Nottingham, Nottingham, United KingdomPOSTER SESSION #1
Shevkunov, IgorComputational Imaging Group, ITC Faculty, Tampere University, FInlandInspection and Test
Shim, KailHenkel, United States of AmericaDesign, Modelling and Simulation
Shin, JunghoElectronics and Telecommunications Research Institute, Korea, Republic of (South Korea);
ETRI, Korea, Republic of (South Korea)		Intreconnection Technologies
POSTER SESSION #1
Sippel, MarcelSiemens AG, GermanyPower Electronics
Sisomseun, VincentMBDA France, France;
IMS Bordeaux, France		Quality and Reliability  Presenter
Sitek, AnnaŁukasiewicz Research Network - ITR, PolandQuality and Reliability
Sivakumar, Arun KumarIndian Institute of Science, Bengaluru, IndiaPOSTER SESSION #2  Presenter
Smyth, StuartSivers Photonics, ScotlandOptoelectronics
Sohrabi, MojtabaChair for RF and Photonics Engineering, Technische Universität Dresden, GermanyIntreconnection Technologies
Soleimanzadeh, RezaHitachi Energy Ltd., SwitzerlandQulaity and Reliability
Somma, CristinaSTMicroelectronicsIC Packagimg
Sorel, MarcScuola Superiore Sant'Anna, ItalySystem in Package
Soufflet, Fabrice3D PLUS, FranceAssembly and Manufcaturing
Sridharan Nair, ShinojUniversity of North Texas, United States of AmericaMaterials
Stadler, EduardCSA R&D ET Packaging Development, Materials and Simulation- ams OSRAM AG, Premstaetten, AustriaPOSTER SESSION #2
Stefanini, CesareScuola Superiore Sant'Anna, ItalySystem in Package
Steiner, FrantisekUniversity of West Bohemia, Faculty of Electrical Engineering, Czech Republic;
University of West Bohemia, Czech Republic		POSTER SESSION #1
POSTER SESSION #2
Steller, AntjeBaker Hughes Inteq GmbH, GermanyMaterials  Presenter
Stelzer, AdrianNANO-JOIN;
Nano-Join GmbH, Germany		Assembly and Manufcaturing
Smart Manufacturing
Steplewski, WojciechŁukasiewicz Research Network - ITR, PolandQuality and Reliability
Stoukatch, SergueiMicrosys lab, Department of Electrical Engineering and Computer Science, University of Liège, BelgiumAssembly and Manufacturing  Presenter
Stoyanov, StoyanSchool of Computing and Mathematical Sciences, University of Greenwich, London, United KingdomPOSTER SESSION #1
Suganuma, KatsuakiOsaka University, JapanMaterials
Quality and Reliability
Quality and Reliability
Sutowski, KonradSTFC-DL, United KingdomPOSTER SESSION #2
Svasta, PaulNational University of Sciences and Technologies Politehnica, Bucharest, Romania;
Electronic Technology & Reliability Department, National University of Science and Technology Politehnica Bucharest, Romania		POSTER SESSION #1
POSTER SESSION #2
Power Electronics
Szkutnik, Pierre-DavidPlasma-Therm Europe, FrancePOSTER SESSION #2
Taduran, ArnelNexperia, United KingdomIC Packaging
Tahri, IsmaelSTMicroelectronics, FranceMaterials
Takano, KenLINTEC Corporation, JapanAssembly and Manufacturing
Emerging Technologies  Presenter
Takyu, ShinyaLINTEC Corporation, JapanAssembly and Manufactuirng
Assembly and Manufacturing
Emerging Technologies
Tan, Eric3D PLUS, FranceAssembly and Manufcaturing
Tan, Ky-LimValeo, Créteil, FrancePower Electronics
Tanc, BogdanTDK Electronics AG, Munich, GermanyInspection and Test
Tatsumi, HiroakiOsaka University, Japan;
The University of Osaka, Japan		Materials
POSTER SESSION #1  Presenter
Terenziani, GiovanniPlasma-Therm Europe, FrancePOSTER SESSION #2
Thacker, DanielSTFC-DL, United KingdomPOSTER SESSION #2
Thampi, GayathryUniversity of South Eastern Norway, NorwayMaterials  Presenter
Thomas, CandiceCea, FranceIntreconnection Technologies
Tian, XiaojieRobert Bosch GmbH, GermanySmart Manufacturing  Presenter
Tissier, PierreSTMicroelectronics Crolles, FranceOptoelectronics
Tomas, EmmelineUniv. Grenoble Alpes, CEA, LetiSystem in Package
Tournaire, MyriamCEA Grenoble, FranceAssembly and Manufacturing
Tran, KhanhUniversity of North Texas, United States of AmericaMaterials
Tranchero, MaurizioIdeas & Motion s.r.l, Cherasco, ItalyDesign, Modelling and Simulation
Trautweiler, StephanGS Swiss PCB AG, SwitzerlandIC Packaging
Trischler, HeinrichDELO Industrial Adhesives, GermanyMaterials
Tsai, MatthewHenkel, United States of AmericaDesign, Modelling and Simulation
Tschoban, ChristianFraunhofer IZM, GermanySubstrate Technologies
Tschoepe, ConstanzeFraunhofer Institute for Ceramic Technologies and Systems IKTS, GermanyQuality and Reliability
Tulea, RoxanaSyswin Solutions, RomaniaPOSTER SESSION #2
Tuorila, HeidiOptoelectronics Research Centre, ENS Faculty, Tampere University, FinlandOptoelectronics
Ueshima, MinoruDaicel Corporation, JapanMaterials
Quality and Reliability
Quality and Reliability
Uno, TomohiroNippon Steel CorporationPOSTER SESSION #1
van Campenhout, Jorisimec, BelgiumOptoelectronics
Varzaru, GaudentiuSyswin Solutions, RomaniaPOSTER SESSION #2
Vaxelaire, NicolasCea, FranceIntreconnection Technologies
Vehoff, ThorstenHeraeus Electronics GmbH & Co KG, GermanyPower Electronics  Presenter
Vélard, RémiUniv. Grenoble Alpes, CEA, Leti, Grenoble, FranceOptoelectronics
POSTER SESSION #1
System in Package
Velenis, Dimitriosimec, BelgiumOptoelectronics
Verheyen, Peterimec, BelgiumOptoelectronics
Viheriälä, JukkaOptoelectronic Research Centre, ENS Faculty, Tampere University, FinlandInspection and Test
Optoelectronics
Vijay, KarthikIndium CorporationPOSTER SESSION #2
Vita, FrancescaHitachi Energy Ltd., SwitzerlandQulaity and Reliability
Vivet, LaurentValeo, FranceMaterials  Presenter
Vlasov, AleksandrOptoelectronic Research Centre, ENS Faculty, Tampere University, FinlandInspection and Test  Presenter
Optoelectronics  Presenter
Wagner, FabianSCHOTT AG, Mainz, GermanySubstrate Technologies
Wagner, FlorianSiemens AG, GermanyPower Electronics
Wakem Tangui, EdwinSTMicroelectronics, FranceQuality and Reliability
Wambold, MatthiasFraunhofer Institute for Photonic Microsystems – IPMS, GermanyIC Packagimg
Wang, Chen-ChaoAdvanced Semiconductor Engineering, TaiwanInspection and Test
POSTER SESSION #1
Wang, Hsiao-Lunimec, BelgiumOptoelectronics
Wang, Yen TingAdvanced Semiconductor Engineering, Inc., TaiwanPOSTER SESSION #1  Presenter
Wenzel, LauraAll Silicon System Integration Dresden, Fraunhofer Institute for Reliability and Microintegration IZM, Dresden, Germany;
Institute of Electronic Packaging Technology, Technische Universität Dresden, Dresden, Germany		Interconnection Technologies
Wicht, SebastianX-FAB MEMS Foundry GmbH, GermanyIC Packaging  Presenter
Wilson, Matthew DavidSTFC-RAL, United KingdomPOSTER SESSION #2
Winter, MatthiasRosenheim University of Applied Sciences, Rosenheim, GermanyDesign, Modelling and Simulation
Inspection and Test
Wirth, VáclavRohde & Schwarz závod Vimperk, s.r.o., Czech RepublicPOSTER SESSION #2
Wirths, StephanHitachi Energy Ltd., SwitzerlandQulaity and Reliability
Wittler, OlafFraunhofer IZM Berlin, GermanyQulaity and Reliability
Wöhrmann, MarkusFraunhofer IZM, GermanyIC Packaging
Wu, Rui-ZheAdvanced Semiconductor Engineering, Inc., TaiwanPOSTER SESSION #1
Xiao, HuiChina CEPREI Laboratory, China, People's Republic of;
China Electronic Product Reliability and Environmental Testing Research Institute, China, People's Republic of		POSTER SESSION #1
Qulaity and Reliability
System in Package  Presenter
Xie, JiangChina CEPREI Laboratory, China, People's Republic ofPOSTER SESSION #1
Xu, ChunleiSilicon Austria Labs,POSTER SESSION #2
Yabashi, MakinaRIKEN SPring-8 Center, Japan;
Japan Synchrotron Radiation Research Institute, Japan		POSTER SESSION #1
Yamada, TadatomoLINTEC Corporation, JapanAssembly and Manufacturing  Presenter
Emerging Technologies
Yamagishi, MasanoriLINTEC Corporation, JapanAssembly and Manufactuirng
Yamamoto, TaisukeYokohama National University, JapanPOSTER SESSION #2  Presenter
Yandoc, DingNexperia, United KingdomIC Packaging
Yildiz, Ömer FarukNovicos GmbHMaterials
Yin, RanInstitute of Electronic Packaging Technology, Technische Universität Dresden, GermanyIntreconnection Technologies
Yoshida, NaokiYokohama National UniversityEmerging Technologies
Zankl, MarkusTHD Technologie Campus Cham, GermanyMaterials
Zhang, RongHenkel, United States of AmericaDesign, Modelling and Simulation
Zhang, Sung-UkDong-Eui University, Korea, Republic of (South Korea)Design, Modelling and Simulation
Zhang, YichengOsaka University, JapanMaterials
Zhang, ZhenxuanMeta Platforms Inc., United States of AmericaQuality and Reliability
Zheng, ZengxiongChina CEPREI Laboratory, China, People's Republic ofPOSTER SESSION #1
Zhou, JinhuaBeijing Institute of Precision and Mechatronics and Controls;
Laboratory of Aerospace Servo Actuation and Transmission		Quality and Reliability
Zimmermann, AndréUniversity of StuttgartSmart Manufacturing
Zoschke, KaiFraunhofer IZM, GermanySystem in Package