Material Challenges for Fine Interconnection in Advanced Packages

Kazuyuki Mitsukura, Kazue Hirano

Resonac

Stability of the Superconducting β-Sn Phase at Low Temperatures for 3D Cryogenic Packaging

Meriem Guergour, Feautrier Céline, Patrice Gergaud, Nicolas Vaxelaire, Guillaume Freychet, Maria-Luisa Calvo-Munoz, Pierre-Emile Philip, Edouard Deschaseaux, Candice Thomas, Jean Charbonnier

Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France

Integration of Photo-imaging Technology and Microvias in LTCC for Enhanced High-frequency Applications and Packaging

Kathrin Reinhardt², Adrian Goldberg¹, Birgit Manhica¹, Lynn Möhring¹, Martin Ihle¹

¹Fraunhofer IKTS, Germany; ²Fraunhofer IZM, Germany