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Conference Time: 7th June 2025, 09:59:43pm CEST
 

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Session
S 1B: Intreconnection Technologies
Time:
Tuesday, 16/Sept/2025:
11:15am - 12:30pm

 Location: Kilimandjaro

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Presentations

Material Strategy and Challenges for Fine Interconnection in Advanced Packages

Kazuyuki Mitsukura

Resonac


Stability of the Superconducting β-Sn Phase at Low Temperatures for 3D Cryogenic Packaging

Meriem Guergour, Feautrier Céline, Patrice Gergaud, Nicolas Vaxelaire, Guillaume Freychet, Maria-luisa Calvo-Munoz, Pierre-Emile Philip, Edouard Deschaseaux, Candice Thomas, Jean Charbonnier

Cea, France


Integration of Photo-imaging Technology and Microvias in LTCC for Enhanced High-frequency Applications and Packaging

Kathrin Reinhardt, Adrian Goldberg, Birgit Manhica, Lynn Ratajczak, Martin Ihle

Fraunhofer IKTS, Germany



 
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