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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 1B: Interconnection Technologies

Time:

Tuesday, 16/Sept/2025:

11:15am - 12:30pm

Session Chair: Hiroshi Nishikawa, Osaka University

Location: Kilimandjaro

Presentations

Material Challenges for Fine Interconnection in Advanced Packages

Kazuyuki Mitsukura, Kazue Hirano

Resonac

Stability of the Superconducting β-Sn Phase at Low Temperatures for 3D Cryogenic Packaging

Meriem Guergour, Feautrier Céline, Patrice Gergaud, Nicolas Vaxelaire, Guillaume Freychet, Maria-Luisa Calvo-Munoz, Pierre-Emile Philip, Edouard Deschaseaux, Candice Thomas, Jean Charbonnier

Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France

Integration of Photo-imaging Technology and Microvias in LTCC for Enhanced High-frequency Applications and Packaging

Kathrin Reinhardt², Adrian Goldberg¹, Birgit Manhica¹, Lynn Möhring¹, Martin Ihle¹

¹Fraunhofer IKTS, Germany; ²Fraunhofer IZM, Germany

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda