Conference Time: 27th July 2025, 12:05:05am CEST
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S 1B: Intreconnection Technologies
Time:
Tuesday, 16/Sept/2025:
11:15am - 12:30pm
Location: Kilimandjaro
Presentations
Material Strategy and Challenges for Fine Interconnection in Advanced Packages
Kazuyuki Mitsukura , Kazue Hirano
Resonac
Stability of the Superconducting β-Sn Phase at Low Temperatures for 3D Cryogenic Packaging
Meriem Guergour , Feautrier Céline, Patrice Gergaud, Nicolas Vaxelaire, Guillaume Freychet, Maria-Luisa Calvo-Munoz, Pierre-Emile Philip, Edouard Deschaseaux, Candice Thomas, Jean Charbonnier
Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France
Integration of Photo-imaging Technology and Microvias in LTCC for Enhanced High-frequency Applications and Packaging
Kathrin Reinhardt2 , Adrian Goldberg1 , Birgit Manhica 1 , Lynn Möhring1 , Martin Ihle1
1 Fraunhofer IKTS, Germany; 2 Fraunhofer IZM, Germany
