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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 1A: IC Packaging

Time:

Tuesday, 16/Sept/2025:

11:15am - 12:30pm

Session Chair: Paul Svasta, National University of Science and Technology POLITEHNICA of Bucharest

Location: Auditorium

Presentations

Development of Die Attach Process for Thin Device Using a Novel High Thermal Conductivity Pressure-less Semi-sintering Paste with Capillary Filling Technology

Shogo Nakano¹, Low Shuey Seng¹, Nicoletta Modarelli², Matteo Luca Quattrocchio²

¹Sumitomo Bakelite Co., Ltd.; ²STMicroelectronics

A Novel Package Technology for Better MOSFET Performance

Arnel Taduran, Ilyas Dchar, Ding Yandoc

Nexperia, United Kingdom

Fan Out Wafer Level Packaging – Towards a European Manufacturing Supply Chain

Marc Dreissigacker¹, Daniel Lieske¹, Tanja Braun², Markus Wöhrmann², Aleksandr Keller²

¹AEMtec GmbH, Germany; ²Fraunhofer IZM, Germany

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda