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Conference Time: 7th June 2025, 03:27:12pm CEST
 

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Session
S 1A: IC Packaging
Time:
Tuesday, 16/Sept/2025:
11:15am - 12:30pm

 Location: Amphitheatre

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Presentations

Development of Die Attach Process for Thin Device Using a Novel High Thermal Conductivity Pressure-less Semi-sintering Paste with Capillary Filling Technology

Shogo Nakano1, Low Shuey Seng1, Nicoletta Modarelli2, Matteo Luca Quattrocchio2

1Sumitomo Bakelite Co., Ltd.; 2STMicroelectronics


A Novel Package Technology for Better MOSFET Performance

Arnel Taduran, Ilyas Dchar, Ding Yandoc

Nexperia, United Kingdom


Fan Out Wafer Level Packaging – Towards a European Manufacturing Supply Chain

Marc Dreissigacker1, Daniel Lieske1, Tanja Braun2, Markus Wöhrmann2

1AEMtec GmbH, Germany; 2Fraunhofer IZM, Germany



 
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