Conference Agenda

Exploration of Cu Interfacial Engineering to Enhance Cu Interconnects Reliability

Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, Shyam Muralidharan Nair, Khanh Tran, Shinoj Sridharan Nair, Oliver Chyan

University of North Texas, United States of America

Tailored Polymers for Wafer-level Optics Manufacturing via Nanoimprint Lithography

Patrick Schirmer, Heinrich Trischler, Stephan Prinz

DELO Industrial Adhesives, Germany

Evaluations of Transient Liquid Phase Joints Using In-coated Ag Sheet

Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Hiroshi Nishikawa

Osaka University, Japan