Conference Time: 27th July 2025, 12:06:52am CEST
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S 3A: Materials
Time:
Tuesday, 16/Sept/2025:
4:35pm - 5:50pm
Location: Amphitheatre
Presentations
Exploration of Cu Interfacial Engineering to Enhance Cu Interconnects Reliability
Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, Shyam Muralidharan Nair, Khanh Tran, John Alptekin, Ashish Shivaji Salunke, Shinoj Sridharan Nair, Oliver Chyan
University of North Texas, United States of America
Tailored Polymers for Wafer-level Optics Manufacturing via Nanoimprint Lithography
Patrick Schirmer , Heinrich Trischler, Stephan Prinz
DELO Industrial Adhesives, Germany
Evaluations of Transient Liquid Phase Joints Using In-coated Ag Sheet
Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Hiroshi Nishikawa
The University of Osaka, Japan
