The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S 3A: Materials

Time:

Tuesday, 16/Sept/2025:

4:35pm - 5:50pm

Location: Amphitheatre

Presentations

Exploration of Cu Interfacial Engineering to Enhance Cu Interconnects Reliability

Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, Shyam Muralidharan Nair, Khanh Tran, Shinoj Sridharan Nair, Oliver Chyan

University of North Texas, United States of America

Tailored Polymers for Wafer-level Optics Manufacturing via Nanoimprint Lithography

Patrick Schirmer, Heinrich Trischler, Stephan Prinz

DELO Industrial Adhesives, Germany

Evaluations of Transient Liquid Phase Joints Using In-coated Ag Sheet

Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Hiroshi Nishikawa

Osaka University, Japan

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