The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S 8A: Quality and Reliability

Time:

Thursday, 18/Sept/2025:

11:30am - 12:45pm

Location: Amphitheatre

Presentations

Defining a Scalable Test Methodology to Deliver High Quality AI Products

Soumya Padmanabha, Gautam Nayak, Zhenxuan Zhang

Meta Platforms Inc., United States of America

Microstructural Characterization for the Joining Interface of Ag@Si Composite Sinter Joining for SiC Power Device by Scanning Transmission Electron Microscopy

Masahiko Nishijima¹, Ran Liu¹, Yang Liu¹, Koji. S Nakayama¹, Cuantong Chen¹, Minoru Ueshima², Katsuaki Suganuma¹

¹F3D system Integration Lab, SANKEN, Osaka University, Japan; ²Daicel Corporation

SACN doped solder balls alloys aging impact on BGA's reliability performance

Edwin Wakem Tangui, Laurence Capellaro, Nohora Caicedo

STMicroelectronics, France

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The 25th European Microelectronics & Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)