Conference Agenda
Session | ||
S 7A: Smart Manufacturing
| ||
Presentations | ||
Inkjet Printing of Copper Metallization for Silicon Carbide MOSFETs 1Robert Bosch GmbH, Germany; 2University of Stuttgart Development of a Novel Pure-ag-sintering Paste for a Jet-dispensing Process to Achieve Highest Possible Conductivity for Miniaturized Electronic Components with a Pressure-less Sintering Process Nano-Join GmbH, Germany Additive Manufacturing of High-Performance Ceramics for Fabricating Single- and Multi-Material Components 1Lithoz GmbH, Austria; 2Montanuniversitaet Leoben, Austria |