Conference Agenda

Process Development for Cu Metallization on SiC MOSFETs with Inkjet Printing Technology

Xiaojie Tian¹, Golzar Alavi¹, Bernhard Polzinger¹, André Zimmermann²

¹Robert Bosch GmbH, Germany; ²University of Stuttgart

Development of a Novel Pure-ag-sintering Paste for a Jet-dispensing Process to Achieve Highest Possible Conductivity for Miniaturized Electronic Components with a Pressure-less Sintering Process

Battist Rábay, Adrian Stelzer, Julien Hossain

Nano-Join GmbH, Germany

Additive Manufacturing of High-Performance Ceramics for Fabricating Single- and Multi-Material Components

Martin Schwentenwein¹, Josef Schlacher², Serkan Nohut¹, Sebastian Geier¹, Raul Bermejo²

¹Lithoz GmbH, Austria; ²Montanuniversitaet Leoben, Austria