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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 7A: Smart Manufacturing

Time:

Thursday, 18/Sept/2025:

9:40am - 10:55am

Session Chair: Bradford J Factor, ASE

Location: Auditorium

Presentations

Inkjet Printing of Copper Metallization for Silicon Carbide MOSFETs

Xiaojie Tian¹, Golzar Alavi¹, Bernhard Polzinger¹, André Zimmermann²

¹Robert Bosch GmbH, Germany; ²University of Stuttgart

Development of a Novel Pure-ag-sintering Paste for a Jet-dispensing Process to Achieve Highest Possible Conductivity for Miniaturized Electronic Components with a Pressure-less Sintering Process

Battist Rábay, Adrian Stelzer, Julien Hossain

Nano-Join GmbH, Germany

Additive Manufacturing of High-Performance Ceramics for Fabricating Single- and Multi-Material Components

Martin Schwentenwein¹, Josef Schlacher², Serkan Nohut¹, Sebastian Geier¹, Raul Bermejo²

¹Lithoz GmbH, Austria; ²Montanuniversitaet Leoben, Austria

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda