Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Process Development for Cu Metallization on SiC MOSFETs with Inkjet Printing Technology
Xiaojie Tian1, Golzar Alavi1, Bernhard Polzinger1, André Zimmermann2
1Robert Bosch GmbH, Germany; 2University of Stuttgart
Development of a Novel Pure-ag-sintering Paste for a Jet-dispensing Process to Achieve Highest Possible Conductivity for Miniaturized Electronic Components with a Pressure-less Sintering Process
Battist Rábay, Adrian Stelzer, Julien Hossain
Nano-Join GmbH, Germany
Additive Manufacturing of High-Performance Ceramics for Fabricating Single- and Multi-Material Components
Martin Schwentenwein1, Josef Schlacher2, Serkan Nohut1, Sebastian Geier1, Raul Bermejo2
1Lithoz GmbH, Austria; 2Montanuniversitaet Leoben, Austria
