Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Session
S 6B: Quality and Reliability
Time:
Wednesday, 17/Sept/2025:
3:50pm - 5:05pm

Location: Kilimandjaro


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Presentations

Advanced Defects Repair Techniques for Enhancing Yield in Packaging Architectures

Adam Ginsburg, Dmitri Burshtyn, Nava Shpaisman

KLA, Israel



Prognostics and Health Monitoring: Case Study of a Light Rail Vehicle Power Converter Assembly

Darshankumar Bhat, Stefan Muench, Mathias Kaeso, Mike Roellig, Constanze Tschoepe, Thomas Haertling

Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany



Optimizing Ag Paste Thickness for Reliable Power Module Packaging

Ran Liu1, Chuantong Chen1, Yang Liu1, Koji S. Nakayama1, Masahiko Nishijima1, Minoru Ueshima2, Katsuaki Suganuma1

1Osaka University, Japan; 2Daicel Corporation, Japan



 
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