The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 6B: Quality and Reliability

Time:

Wednesday, 17/Sept/2025:

3:50pm - 5:05pm

Session Chair: Tobias Schramm, Amkor Technology Euroservices

Location: Kilimandjaro

Presentations

Advanced Techniques for Short Defect Repair to Improve Yield in Packaging Architectures

Adam Ginsburg, Dmitri Burshtyn, Nava Shpaisman

KLA, Israel

Prognostics and Health Monitoring: Case Study of a Light Rail Vehicle Power Converter Assembly

Darshankumar Bhat, Stefan Muench, Mathias Kaeso, Mike Roellig, Constanze Tschoepe, Thomas Haertling

Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany

Optimizing Ag Paste Thickness for Reliable Power Module Packaging

Ran Liu¹, Chuantong Chen¹, Yang Liu¹, Koji S. Nakayama¹, Masahiko Nishijima¹, Minoru Ueshima², Katsuaki Suganuma¹

¹Osaka University, Japan; ²Daicel Corporation, Japan