Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
A Methodology for Modeling Capillary Underfill (CUF) in Advanced Packaging
Dariush Ghaffari Tari1, Arsia Khanfekr1, Rong Zhang1, Jeffrey Grover1, Ning Liu1, Kail Shim1, Manuel Schiel2, Matthew Tsai1, Rossette Guino3
1Henkel, United States of America; 2Henkel AG & Co. KGaA; 3Henkel Asia Pacific
Simulation-based Analysis of Thermal Effects Induced by RF Interference in MEMS Microphones
Yogesh Babu1, Sebastian Kisban3, Matthias Winter1, Matthias Schmidt3, Margarita Chizh2, Gregor Feiertag2
1Rosenheim University of Applied Sciences, Rosenheim, Germany; 2Munich University of Applied Sciences, Munich, Germany; 3TDK Electronics AG, Munich, Germany
Numerical Case Study of Stress and Plastic Strain Distributions in BGA Solder Balls by Comparison of a Novel Inorganic Encapsulation and Conventional Underfill Variants
Alexander Reichel, Falk Naumann, Sandy Klengel
Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle (Saale), Germany
