JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organizers at office@empc2025.org.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 2A: Design, Modelling and Simulation

Time:

Tuesday, 16/Sept/2025:

1:50pm - 3:05pm

Session Chair: Jeffrey Suhling, Auburn University

Location: Auditorium

Presentations

A Methodology for Modeling Capillary Underfill (CUF) in Advanced Packaging

Dariush Ghaffari Tari¹, Arsia Khanfekr¹, Rong Zhang¹, Jeffrey Grover¹, Ning Liu¹, Kail Shim¹, Manuel Schiel², Matthew Tsai¹, Rossette Guino³

¹Henkel, United States of America; ²Henkel AG & Co. KGaA; ³Henkel Asia Pacific

Simulation-based Analysis of Thermal Effects Induced by RF Interference in MEMS Microphones

Yogesh Babu¹, Sebastian Kisban³, Matthias Winter¹, Matthias Schmidt³, Margarita Chizh², Gregor Feiertag²

¹Rosenheim University of Applied Sciences, Rosenheim, Germany; ²Munich University of Applied Sciences, Munich, Germany; ³TDK Electronics AG, Munich, Germany

Numerical Case Study of Stress and Plastic Strain Distributions in BGA Solder Balls by Comparison of a Novel Inorganic Encapsulation and Conventional Underfill Variants

Alexander Reichel, Falk Naumann, Sandy Klengel

Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle (Saale), Germany

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda