Conference Agenda

Session
S 4A: Assembly and Manufacturing
Time:
Wednesday, 17/Sept/2025:
11:00am - 12:15pm

 Location: Amphitheatre

Presentations

In-situ Plasma Monitoring Study for Wire Bonding Process Improvements

Nohora Caicedo, Patricia Folio, Valentin Ray, Florence Chevillard, Agnes Baffert

ST Microelectronis, France


Impact and Control of Residual Stress in Ceramic Packages

Markus Eberstein1, William Kuhblank1, Rita Cicconi2, Dominique de Ligny2, Robert Charles Wimpory3, Daniel Apel3, Mirko Boin3

1ASML Berlin, Germany; 2FAU Erlangen; 3Helmholtz-Zentrum Berlin


Wafer dicing technique for close-butted assemblies

Sarah Renault, Aurélia Plihon, Emerick Lorent, Myriam Tournaire, Nicolas Bresson, Delphine Rolland

CEA Grenoble, France