JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organizers at office@empc2025.org.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session

S 4A: Assembly and Manufacturing

Time:

Wednesday, 17/Sept/2025:

11:00am - 12:15pm

Session Chair: Valérie Volant, STM

Location: Auditorium

Presentations

In-situ Plasma Monitoring Study for Wire Bonding Process Improvements

Nohora Caicedo, Patricia Folio, Valentin Ray, Florence Chevillard, Agnes Baffert

ST Microelectronis, France

Impact and Control of Residual Stress in Ceramic Packages

Markus Eberstein¹, William Kuhblank¹, Rita Cicconi², Dominique de Ligny², Robert Charles Wimpory³, Daniel Apel³, Mirko Boin³

¹ASML Berlin, Germany; ²FAU Erlangen; ³Helmholtz-Zentrum Berlin

Wafer dicing technique for close-butted assemblies

Sarah Renault, Aurélia Plihon, Emerick Lorent, Myriam Tournaire, Nicolas Bresson, Delphine Rolland

CEA Grenoble, France