The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S 4A: Assembly and Manufacturing

Time:

Wednesday, 17/Sept/2025:

11:15am - 12:30pm

Location: Amphitheatre

Presentations

In-situ Plasma Monitoring Study for Wire Bonding Process Improvements

Nohora Caicedo, Patricia Folio, Valentin Ray, Laurence Capellaro, Justin Catania

ST Microelectronis, France

Impact and Control of Residual Stress in Ceramic Packages

Markus Eberstein¹, William Kuhblank¹, Rita Cicconi², Dominique de Ligny², Daniel Apel³, Mirko Boin³

¹ASML Berlin, Germany; ²FAU Erlangen; ³Helmholtz-Zentrum Berlin

Wafer dicing technique for close-butted assemblies

Sarah Renault, Aurélia Plihon, Emerick Lorent, Myriam Tournaire, Nicolas Bresson, Delphine Rolland

CEA Grenoble, France

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