The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organizers at office@empc2025.org.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 4A: Assembly and Manufacturing

Time:

Wednesday, 17/Sept/2025:

11:00am - 12:15pm

Location: Amphitheatre

Presentations

In-situ Plasma Monitoring Study for Wire Bonding Process Improvements

Nohora Caicedo, Patricia Folio, Valentin Ray, Florence Chevillard, Agnes Baffert

ST Microelectronis, France

Impact and Control of Residual Stress in Ceramic Packages

Markus Eberstein¹, William Kuhblank¹, Rita Cicconi², Dominique de Ligny², Robert Charles Wimpory³, Daniel Apel³, Mirko Boin³

¹ASML Berlin, Germany; ²FAU Erlangen; ³Helmholtz-Zentrum Berlin

Wafer dicing technique for close-butted assemblies

Sarah Renault, Aurélia Plihon, Emerick Lorent, Myriam Tournaire, Nicolas Bresson, Delphine Rolland

CEA Grenoble, France

Mobile View Print View

Contact and Legal Notice · Contact Address:

office{at}empc2025 dot

dot

org

Privacy Statement · Conference: EMPC 2025

Conference Software: ConfTool Pro 2.8.106
© 2001–2025 by Dr. H. Weinreich, Hamburg, Germany