Conference Agenda

Session

S 8A: Materials

Time:

Thursday, 18/Sept/2025:

11:30am - 12:45pm

Location: Amphitheatre

Presentations

Understanding Solder Creepage in Thin Si Devices Through Advanced Traceability Systems

Andrea Albertinetti¹, Reiner Maghirang¹, Chaimaa El Mazyani¹, Abderrahim Kourimy¹, Ismael Tahri²

¹STMicroelectronics, Morocco; ²STMicroelectronics, France

Enhancing the Reliability of Harsh Environment Electronics Through PFAS-free Multilayer ALD + Parylene Coatings

Rakesh Kumar¹, Shuchi Sawada²

¹Specialty Coating Systems, Inc., United States of America; ²Daisan Kasei Co., Ltd, Japan

Insulation Materials for Advanced Packaging Applications

Reki Nakano

Ajinomoto Co., Inc., Japan