Conference Agenda

Session

S 8D: Materials

Time:

Thursday, 18/Sept/2025:

11:30am - 12:45pm

Location: Makalu

Presentations

Understanding Solder Creepage in Thin Si Devices Through Advanced Traceability Systems

Andrea Albertinetti¹, Reiner Maghirang¹, Chaimaa El Mazyani¹, Abderrahim Kourimy¹, Ismael Tahri²

¹STMicroelectronics, Morocco; ²STMicroelectronics, France

Enhancing the Reliability of Harsh Environment Electronics Through PFAS-free Multilayer ALD + Parylene Coatings

Rakesh Kumar

Specialty Coating Systems, Inc., United States of America

Insulation Materials for Advanced Packaging Applications

Reki Nakano

Ajinomoto Co., Inc., Japan