The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S 8D: Materials

Time:

Thursday, 18/Sept/2025:

11:30am - 12:45pm

Location: Makalu

Presentations

Understanding Solder Creepage in Thin Si Devices Through Advanced Traceability Systems

Andrea Albertinetti¹, Reiner Maghirang¹, Chaimaa El Mazyani¹, Abderrahim Kourimy¹, Ismael Tahri²

¹STMicroelectronics, Morocco; ²STMicroelectronics, France

Enhancing the Reliability of Harsh Environment Electronics Through PFAS-free Multilayer ALD + Parylene Coatings

Rakesh Kumar

Specialty Coating Systems, Inc., United States of America

Insulation Materials for Advanced Packaging Applications

Reki Nakano

Ajinomoto Co., Inc., Japan

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