Conference Agenda

Session

S 8C: Power Electronics

Time:

Thursday, 18/Sept/2025:

11:30am - 12:45pm

Location: Mont Blanc

Presentations

Measurements at High Temperature for Thermal Resistance of MOSFETs

Corina Ruxandra Mitulescu (Sandulescu), Norocel Codreanu, Ciprian Ionescu, Paul Svasta, Mihai Branzei

National University of Science and Technology POLITEHNICA Bucharest, Romania

Influence of Uneven Chip Solder Layer Thickness on the Reliability of Power Modules

Aylin Aksoy, Florian Wagner, Marcel Sippel

Siemens AG, Germany

Reliability Evaluation of Direct Bonding for SiC Power Devices by Power Cycling Test

Marius Köhler¹, Jens Müller², Ansgar Ramesohl¹, Kurt-Georg Besendörfer², Nicolas Heuck¹

¹Hamm-Lippstadt University of Applied Sciences, Germany; ²Semikron Danfoss Elektronik GmbH & Co. KG, Nuremberg, Germany