Conference Time: 26th July 2025, 02:41:05pm CEST
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S 8C: Power Electronics
Time:
Thursday, 18/Sept/2025:
11:30am - 12:45pm
Location: Mont Blanc
Presentations
Measurements at High Temperature for Thermal Resistance of MOSFETs
Corina Ruxandra Mitulescu (Sandulescu) , Norocel Codreanu, Ciprian Ionescu, Paul Svasta, Mihai Branzei, Bianca Enache
National University of Science and Technology POLITEHNICA Bucharest, Romania
Influence of Uneven Chip Solder Layer Thickness on the Reliability of Power Modules
Aylin Aksoy , Florian Wagner, Marcel Sippel
Siemens AG, Germany
Reliability Evaluation of Direct Bonding for SiC Power Devices by Power Cycling Test
Marius Köhler 1 , Jens Müller2 , Ansgar Ramesohl1 , Kurt-Georg Besendörfer2 , Nicolas Heuck1
1 Hamm-Lippstadt University of Applied Sciences, Germany; 2 Semikron Danfoss Elektronik GmbH & Co. KG, Nuremberg, Germany
