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Conference Time: 7th June 2025, 02:29:19pm CEST
 

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Session
S 8C: Power Electronics
Time:
Thursday, 18/Sept/2025:
11:30am - 12:45pm

 Location: Mont Blanc

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Presentations

Measurements at High Temperature for Thermal Resistance of MOSFETs

Corina Ruxandra Mitulescu (Sandulescu), Norocel Codreanu, Ciprian Ionescu, Paul Svasta, Mihai Branzei

National University of Science and Technology POLITEHNICA Bucharest, Romania


Influence of Uneven Chip Solder Layer Thickness on the Reliability of Power Modules

Aylin Aksoy, Florian Wagner, Marcel Sippel

Siemens AG, Germany


Reliability Evaluation of Direct Bonding for SiC Power Devices by Power Cycling Test

Marius Köhler1, Jens Müller2, Ansgar Ramesohl1, Kurt-Georg Besendörfer2, Nicolas Heuck1

1Hamm-Lippstadt University of Applied Sciences, Germany; 2Semikron Danfoss Elektronik GmbH & Co. KG, Nuremberg, Germany



 
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