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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 8C: Power Electronics

Time:

Thursday, 18/Sept/2025:

11:30am - 12:45pm

Session Chair: Verena Leitgeb, Materials Center Leoben Forschung GmbH

Location: Mont Blanc

Presentations

Measurements at High Temperature for Thermal Resistance of MOSFETs

Corina Ruxandra Mitulescu (Sandulescu), Norocel Codreanu, Ciprian Ionescu, Paul Svasta, Mihai Branzei, Bianca Enache

National University of Science and Technology POLITEHNICA Bucharest, Romania

Influence of Uneven Chip Solder Layer Thickness on the Reliability of Power Modules

Aylin Aksoy, Florian Wagner, Marcel Sippel

Siemens AG, Germany

Reliability Evaluation of Direct Bonding for SiC Power Devices by Power Cycling Test

Marius Köhler¹, Jens Müller², Ansgar Ramesohl¹, Kurt-Georg Besendörfer², Nicolas Heuck¹

¹Hamm-Lippstadt University of Applied Sciences, Germany; ²Semikron Danfoss Elektronik GmbH & Co. KG, Nuremberg, Germany

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda