Conference Agenda

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Session Overview
Session
S 7D: Inspection and Test
Time:
Thursday, 18/Sept/2025:
9:40am - 10:55am

Location: Makalu


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Presentations

Key Technologies and Design Aspects for Advanced FOCoS Packaging

Cheng Hsin Liu, Yi-Sheng Lin, Yu-Jen Chang, Chen-Chao Wang, Chin-Pin Hung

Advanced Semiconductor Engineering, Taiwan



Lensless Through-silicon Microscopy System for Precise Alignment in Photonic Integration Processes

Aleksandr Vlasov1, Igor Shevkunov2, Karen Egiazarian2, Andrei Gurovich1,4, Denis Rozhkov5, Mikko Närhi3, Jukka Viheriälä1, Mircea Guina1

1Optoelectronic Research Centre, ENS Faculty, Tampere University, Finland; 2Computational Imaging Group, ITC Faculty, Tampere University, FInland; 3Photonics Group, Tampere University, FInland; 4Ampliconyx Oy, Finland; 5TU Ilmenau, Germany



Investigating the Role of Thermal Effects in RF Immunity of MEMS Microphones

Margarita Chizh1, Matthias Schmidt2, Sebastian Kisban2, Bogdan Tanc2, Yogesh Babu3, Gregor Feiertag1, Matthias Winter3, Sushil Bharatan4

1Department of Electrical Engineering, Munich University of Applied Sciences, Munich, Germany; 2TDK Electronics AG, Munich, Germany; 3Centre for Research and Development, Rosenheim University of Applied Sciences, Rosenheim, Germany; 4TDK InvenSense, Boston, USA



 
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