Visualizing Vibrations of Electronic Modules in Test

Artem Ivanov

Landshut University of Applied Sciences, Germany

Lensless Through-silicon Microscopy System for Precise Alignment in Photonic Integration Processes

Aleksandr Vlasov¹, Igor Shevkunov², Karen Egiazarian², Andrei Gurovich^1,4, Denis Rozhkov⁵, Mikko Närhi³, Jukka Viheriälä¹, Mircea Guina¹

¹Optoelectronic Research Centre, ENS Faculty, Tampere University, Finland; ²Computational Imaging Group, ITC Faculty, Tampere University, FInland; ³Photonics Group, Tampere University, FInland; ⁴Ampliconyx Oy, Finland; ⁵TU Ilmenau, Germany

Investigating the Role of Thermal Effects in RF Immunity of MEMS Microphones

Margarita Chizh¹, Matthias Schmidt², Sebastian Kisban², Bogdan Tanc², Yogesh Babu³, Gregor Feiertag¹, Matthias Winter³, Sushil Bharatan⁴

¹Department of Electrical Engineering, Munich University of Applied Sciences, Munich, Germany; ²TDK Electronics AG, Munich, Germany; ³Centre for Research and Development, Rosenheim University of Applied Sciences, Rosenheim, Germany; ⁴TDK InvenSense, Boston, USA