Key Technologies and Design Aspects for Advanced FOCoS Packaging

Cheng Hsin Liu, Yi-Sheng Lin, Yu-Jen Chang, Chen-Chao Wang, Chin-Pin Hung, Yen Ting Wang, Po-An Lin

Advanced Semiconductor Engineering, Taiwan

A Novel Photo-patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-chip Interconnections

Gwang-Mun Choi¹, Jiho Joo¹, Jungho Shin¹, Jin-Hyuk Oh¹, Ki-Seok Jang¹, Chanmi Lee¹, Gyeongmin Park², Hyemi Lee², Hyeryeon Hwang², Ga-Eun Lee¹, Seong-Cheol Kim¹, Jaejun Lee², Kwang-Seong Choi¹, Yong-Sung Eom¹

¹Electronics and Telecommunications Research Institute, Korea, Republic of (South Korea); ²Pusan National University, Korea, Republic of (South Korea)

Integration Technology Development of Chip-Antenna Interface for Short Range mmWave Wireless Communication

Ran Yin¹, Tilo Meister², Mojtaba Sohrabi³, Krzysztof Nieweglowski¹, Franz Alwin Dürrwald², Christian Hoyer², Frank Ellinger², Dirk Plettemeier³, Karlheinz Bock¹

¹Institute of Electronic Packaging Technology, Technische Universität Dresden, Germany; ²Chair for Circuit Design and Network Theory, Technische Universität Dresden, Germany; ³Chair for RF and Photonics Engineering, Technische Universität Dresden, Germany