A Novel Photo-patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-chip Interconnections

Gwang-Mun Choi¹, Jiho Joo¹, Jungho Shin¹, Jin-Hyuk Oh¹, Ki-Seok Jang¹, Chanmi Lee¹, Gyeongmin Park², Hyemi Lee², Hyeryeon Hwang², Ga-Eun Lee¹, Seong-Cheol Kim¹, Jaejun Lee², Kwang-Seong Choi¹, Yong-Sung Eom¹

¹Electronics and Telecommunications Research Institute, Korea, Republic of (South Korea); ²Pusan National University, Korea, Republic of (South Korea)

Femtosecond Laser Drilling Technologies for Through Glass Via (TGV) Fabrication in Customised Glass Interposers

Dimitris Karnakis

Oxford Lasers Ltd, United Kingdom

Integration Technology Development of Chip-Antenna Interface for Short Range mmWave Wireless Communication

Ran Yin¹, Tilo Meister², Mojtaba Sohrabi³, Krzysztof Nieweglowski¹, Franz Alwin Dürrwald², Christian Hoyer², Frank Ellinger², Dirk Plettemeier³, Karlheinz Bock¹

¹Institute of Electronic Packaging Technology, Technische Universität Dresden, Germany; ²Chair for Circuit Design and Network Theory, Technische Universität Dresden, Germany; ³Chair for RF and Photonics Engineering, Technische Universität Dresden, Germany