The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 6C: Materials

Time:

Wednesday, 17/Sept/2025:

3:50pm - 5:05pm

Session Chair: Oliver Chyan, University of North Texas

Location: Mont Blanc

Presentations

Ag-nodule Mediated Bonding Using Liquid Quenched Ag-Si Alloy

Koji S. Nakayama¹, Masahiko Nishijima¹, Yicheng Zhang¹, Chuantong Chen¹, Minoru Ueshima², Katsuaki Suganuma¹

¹Osaka University, Japan; ²Daicel Corporation, Japan

Thermal Characterization of Electrically Conductive Adhesives and Pressureless Sinter Pastes – Comparison of Data Sheet and Real Application

Antje Steller¹, Moritz Schwengber¹, Ömer Faruk Yildiz², Jörg Franke³

¹Baker Hughes Inteq GmbH, Germany; ²Novicos GmbH; ³Faculty of Electrical Engineering and Information Technology, Technical University Chemnitz

Characterisation and Modelling of Sintered Joints Used in Power Electronics

Laurent Vivet

Valeo, France