Conference Agenda

Microelectronic Packaging Challenges for Stacked Superconducting Qubit Chips Using Indium Bump Bonding

Andreas Schneider¹, Aswathi Koorikkat¹, John D. Lipp¹, Marcus J. French¹, Narendra Acharya², Kitti Ratter², Vivek Chidambaram², Pawala Ariyathilaka³

¹Technology, STFC-RAL, United Kingdom; ²National Quantum Computing Centre (NQCC), STFC, United Kingdom; ³Central Laser Facility (CLF), STFC-RAL, United Kingdom

Flip-chip Bonded Hybrid Germanium X-ray Detectors Suitable for Operating with Thermal Gradient Between Sensor and ASIC

Andreas Schneider¹, James Hollingham¹, Alexander Dainty¹, Toby G. Brookes¹, John David Lipp¹, Matthew David Wilson¹, Marcus Julian French¹, Marcello Borri², Konrad Sutowski², Daniel Thacker², Matthew Buckland², Andrew Hill², William Helsby²

¹STFC-RAL, United Kingdom; ²STFC-DL, United Kingdom

Thermal Management of an Electronic Module Made by a Solderless Assembly Method

Gaudentiu Varzaru¹, Roxana Tulea¹, Madalin Moise², Mihai Branzei³, Paul Svasta²

¹Syswin Solutions, Romania; ²Electronic Technology & Reliability Department, National University of Science and Technology Politehnica Bucharest, Romania; ³Department of Metallic Materials Sciences, Physical Metallurgy, Faculty of Materials Science and Engineering, National University of Science and Technology Politehnica Bucharest, Romania

Selective Micro Laser Melting: Influence of Scan Speed and Laser Power on Interconnect Morphology and Performance

Arun Kumar Sivakumar, Manish Arora

Indian Institute of Science, Bengaluru, India

Flip Chip Bonding of PMUT Using Adhesives and their Effect on Electrical Performance

Muhammad Hassan Malik, Zhou Da, Rodrigo Tumolin Rocha, Chunlei Xu

Silicon Austria Labs,

Automated Non-destructive Mechanical Testing of Fine Pitch Wirebond Arrays

Lyle Alexander Menk

Sandia National Laboratories, United States of America

Advanced Underfill Developments Enabling Complex AI and HPC Package Designs

Ruud De Wit

Henkel Nederland BV, Netherlands, The

Advanced Dielectric Films for Fusion Bonded 3D Integration

Taisuke Yamamoto, Hayato Kitagawa, Ryosuke Sato, Ryota Ogata, Fumihiro Inoue

Yokohama National University, Japan

Printable non-volatile and volatile memristors based on Lead-Free Perovskites for artificial synapses and neurons emulation

Michalis Loizos, Konstantinos Chatzimanolis, Konstantinos Rogdakis, Emmanuel Kymakis

Hellenic Mediterranean University, Greece

Power modules: Crack and shrinkage phenomenon

Adeline Liger, Vincent Charlot, Jean-Christophe Leroux

PROTAVIC, France

Void inspection using stress field imaging in densely patterned bonded wafers

Zsolt Kovács, Csenge Dobos, Gábor Molnár, Zsolt Kovács, György Nádudvari, Zoltán Kiss

Semilab Co. Ltd., Hungary

Photoresist/polymer removal optimized chemistry with adding hydrogen radical in MEMS process fabrication and other applications with HDRF®

Marc Segers, Giovanni Terenziani, Safia Benkoula

Plasma-Therm Europe, France

Innovative deposition solution for TSV integration and conformal deposition of oxide, nitride, and metal layer with dual frequency pulsed equipment, application of low temperature deposition of dielectric layer

Marc Segers, Pierre-David Szkutnik, Safia Benkoula

Plasma-Therm Europe, France

Temperature Profile Optimization for Vacuum Soldering of Components on Heat Sink

František Steiner¹, Martin Hirman¹, Pavel Rous¹, Václav Wirth²

¹University of West Bohemia, Czech Republic; ²Rohde & Schwarz závod Vimperk, s.r.o., Czech Republic

Investigating the Dynamic Bending Behaviour of Biodegradable Printed Circuit Boards

Oliver Krammer, Patrik Kovács, Attila Géczy

Budapest University of Technology and Economics, Hungary

Stacked and Staggered Vias in FR4 laminate for special application

Aneta Cholaj, Krzysztof Lipiec, Andrzej Kiernich, Dariusz Ostaszewski, Miroslaw Kozlowski, Marek Koscielski, Adam Lipiec, Janusz Borecki

Łukasiewicz Research Network - ITR, Poland

Engineering Dual Alloy Solder Paste Systems to Achieve High Reliability, Energy Savings, Withstand High Junction Temperatures

Karthik Vijay

Indium Corporation

Warpage Reduction of Laminate Substrates Through Metamodel-based Optimization of Material Properties

Fredy John Porathur^1,2, Fabian Huber¹, Eduard Stadler¹, Peter Filipp Fuchs³, Dieter Paul Gruber^2,4

¹CSA R&D ET Packaging Development, Materials and Simulation- ams OSRAM AG, Premstaetten, Austria; ²Institute of Materials Science and Testing of Polymers- Montanuniversität Leoben, Leoben, Austria; ³Simulation and Modeling- Polymer Competence Centre Leoben (PCCL) GmbH, Leoben, Austria; ⁴Surface Testing, Robot Vision and Artificial Intelligence- Polymer Competence Centre Leoben (PCCL) GmbH, Leoben, Austria