TBM-free Plasma Etch Die Singulation

Partia Naghibi, Aidan Knab

HRL Laboratories, United States of America

Anti-counterfeit Semiconductor Package Using a Unique Identification Mark

Ken Takano¹, Tadatomo Yamada¹, Toshiaki Menjo¹, Sayaka Matsuno¹, Shinya Takyu¹, Naoki Yoshida², Iwaki Miyamoto², Tsutomu Matsumoto³

¹LINTEC corporation; ²Yokohama National University; ³National Institute of Advanced Industrial Science and Technology

Metal Oxide Reduction Using Inline Openair-plasma Process to Enhance Adhesion and Improve Durability in Electronics

Shirisha Kulkarni¹, Yaser Hamedi¹, Nico Coenen¹, Daphne Pappas², Dhia Bensalem¹

¹Plasmatreat GmbH, Steinhagen, Germany; ²Plasmatreat USA, Haward, USA

Surface Conditioning of LTCC Substrates for Improved RF Signal Propagation

Norayr Nessimian¹, Achraf Sadeddine², Jens Müller¹, Heike Bartsch¹

¹TU Ilmenau, Germany; ²Institut Mines-Télécom, France