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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 5C: Emerging Technologies

Time:

Wednesday, 17/Sept/2025:

1:35pm - 3:15pm

Session Chair: Tanja Braun, Fraunhofer IZM

Location: Mont Blanc

Presentations

TBM-free Plasma Etch Die Singulation

Partia Naghibi, Aidan Knab

HRL Laboratories, United States of America

Anti-counterfeit Semiconductor Package Using a Unique Identification Mark

Ken Takano¹, Tadatomo Yamada¹, Toshiaki Menjo¹, Sayaka Matsuno¹, Shinya Takyu¹, Naoki Yoshida², Iwaki Miyamoto², Tsutomu Matsumoto³

¹LINTEC corporation; ²Yokohama National University; ³National Institute of Advanced Industrial Science and Technology

Metal Oxide Reduction Using Inline Openair-plasma Process to Enhance Adhesion and Improve Durability in Electronics

Dhia Bensalem¹, Raphael Gehra¹, Shirisha Kulkarni¹, Yaser Hamedi¹, Nico Coenen¹, Daphne Pappas², Magnus Buske¹

¹Plasmatreat GmbH, Steinhagen, Germany; ²Plasmatreat USA, Haward, USA

Thin Film Ring Resonators on Polished LTCC Multilayer for Improved RF Performance

Norayr Nessimian¹, Achraf Sadeddine², Jens Müller¹, Heike Bartsch¹

¹TU Ilmenau, Germany; ²Institut Mines-Télécom, France

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda