Conference Agenda

Thermomechanical Study for Stress-management of Silicon Photonics Interposers

Céline Feautrier, Benoit Saudet, Jean Charbonnier, Edouard Deschaseaux, Damien Saint-Patrice, Rémi Vélard, Myriam Assous

Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France

Study on the Influence of Reflow Soldering on the Reliability of Mixed Solder Joints

Xiaodong Chen, Baojun Qiu, Zengxiong Zheng, Hui Xiao, Jiang Xie, Tao Lu, Daojun Luo

China CEPREI Laboratory, China, People's Republic of

Reusing SMD Components on E-textiles: An Ageing Study by Combination of Corrosive Gases and Washing

Martin Hirman, Jiri Navratil, Andrea Benesova, Frantisek Steiner

University of West Bohemia, Faculty of Electrical Engineering, Czech Republic

A Comparative Study of Silver Sintering Pastes for Die-attach Applications: Microstructure, Mechanical Properties, and Reliability

Jiri Hlina, Martin Hirman, David Michal, Martin Janda

University of West Bohemia, Czech Republic

Design and Evaluation of a Perforated Dielectric Flat Lens Antenna Array for D-band Applications

Yen Ting Wang, Po-An Lin, Huei-Shyong Cho, Shih-wen Lu, Wei-Tung Chang

Advanced Semiconductor Engineering, Inc., Taiwan

A High Gain Antenna-in-Package (AiP) with Horn Structure for D-band Applications

Po-An Lin, Shao-En Hsu, Shih-Wen Lu, Yu-Chang Chen, Jen-Chieh Kao

Advanced Semiconductor Engineering, Inc. (ASE), Taiwan

Fine-pitch Flip-chip Bonding Process with Laser Non-conductive Paste (NCP) and Laser-assisted Bonding (LAB) for High-reliability

Ki-Seok Jang, Yong-Sung Eom, Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Chan-Mi Lee, Ga-Eun Lee, Seong-Cheol Kim, Kwang-Seong Choi

ETRI, Korea, Republic of (South Korea)

Electrochemical Analysis Reveals Effective Grain Refinement in Copper Electroplating

Rui-Zhe Wu, Tzu-Hsing Chiang, Chen-Chao Wang, Chin-Pin Hung

Advanced Semiconductor Engineering, Inc., Taiwan

Indium as the Superconducting Interconnect for Quantum Chiplets

Jowesh Avisheik Goundar¹, Mai Thi Ngoc La², Yugi Otake², Hideo Kosaka¹, Fumihiro Inoue³

¹Institute of Advanced Sciences, Yokohama National University, Japan; ²Graduate School of Engineering, Yokohama National University, Japan; ³Faculty of Engineering, Yokohama National University, Japan

Test Equipment for Sensor Interfaces Emulated by Generic Electronic Control Unit

Nicolae Ioan Gross, Paul Svasta

National University of Sciences and Technologies Politehnica, Bucharest, Romania

Visualizing Vibrations of Electronic Modules in Test

Artem Ivanov

Landshut University of Applied Sciences, Germany

Grain Orientation Analysis for Thermal Cycling Evaluation of Die-attach Solder Joints

Hiroaki Tatsumi¹, Yujiro Hayashi^2,3, Jaemyung Kim², Makina Yabashi^2,3, Hiroshi Nishikawa¹

¹The University of Osaka, Japan; ²RIKEN SPring-8 Center, Japan; ³Japan Synchrotron Radiation Research Institute, Japan

Thermal Fatigue Resistance Improvement of New Al Bonding Wire

Motoki Eto¹, Noritoshi Araki¹, Daizo Oda¹, Sandy Klengel², Robert Klengel², Tomohiro Uno³

¹Nippon Micrometal Corporation, Japan; ²Fraunhofer-Institute for Microstructure of Materials and Systems IMWS; ³Nippon Steel Corporation

Thermal Analysis of Power Electronic Modules with Parametric Model Order Reduction

Sheikh Hassan¹, Mark Sherriff², Pearl Agyakwa², Paul Evans², Stoyan Stoyanov¹

¹School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom; ²Department of Electrical and Electronic Engineering, University of Nottingham, Nottingham, United Kingdom