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Conference Time: 7th June 2025, 03:14:01pm CEST
 

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Session
S 4C: IC Packagimg
Time:
Wednesday, 17/Sept/2025:
11:15am - 12:30pm

 Location: Mont Blanc

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Presentations

Impact of PFAS Removal on the Harsh Environment Reliability of Semiconductor Packaging

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan

Auburn University, United States of America


FC-LGA for Power Devices: Peculiarities and Challenges Compared with Digital Products

Stefano Cacciamani, Cristina Somma, Fabrice De Moro, Laurent Figuiere, Lou Roulon, Jerome Lopez, Ludovic Fourneaud

STMicroelectronics


Modular Integration of Sensor-Chiplets using Rapid Prototyping including Interconnects and Protective Waveguide Packaging

Severin Schweiger, Harshitha Karnam, Sören Köble, Matthias Wambold, Nicolas Lange

Fraunhofer Institute for Photonic Microsystems – IPMS, Germany



 
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