Conference Time: 27th July 2025, 12:20:31am CEST
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S 4C: IC Packagimg
Time:
Wednesday, 17/Sept/2025:
11:00am - 12:15pm
Location: Mont Blanc
Presentations
Impact of PFAS Removal on the Harsh Environment Reliability of Semiconductor Packaging
Pradeep Lall , Padmanava Choudhury, Aathi Pandurangan
Auburn University, United States of America
FC-LGA for Power Devices: Peculiarities and Challenges Compared with Digital Products
Stefano Cacciamani , Cristina Somma, Fabrice De Moro, Laurent Figuiere, Lou Roulon, Jerome Lopez, Ludovic Fourneaud
STMicroelectronics
Modular Integration of Sensor-Chiplets using Rapid Prototyping including Interconnects and Protective Waveguide Packaging
Severin Schweiger , Harshitha Karnam, Sören Köble, Matthias Wambold, Nicolas Lange
Fraunhofer Institute for Photonic Microsystems – IPMS, Germany
