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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 4C: IC Packaging

Time:

Wednesday, 17/Sept/2025:

11:00am - 12:15pm

Session Chair: Tekfouy Lim, Fraunhofer IZM

Location: Mont Blanc

Presentations

Impact of PFAS Removal on the Harsh Environment Reliability of Semiconductor Packaging

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan

Auburn University, United States of America

FC-LGA for Power Devices: Peculiarities and Challenges Compared with Digital Products

Stefano Cacciamani, Cristina Somma, Fabrice De Moro, Laurent Figuiere, Lou Roulon, Jerome Lopez, Ludovic Fourneaud

STMicroelectronics

Modular Integration of Sensor-Chiplets using Rapid Prototyping including Interconnects and Protective Waveguide Packaging

Severin Schweiger, Harshitha Karnam, Sören Köble, Matthias Wambold, Nicolas Lange

Fraunhofer Institute for Photonic Microsystems – IPMS, Germany

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda