Conference Agenda

Session

S 3D: Assembly and Manufacturing

Time:

Tuesday, 16/Sept/2025:

4:35pm - 5:50pm

Location: Makalu

Presentations

A New Carrier Tape for Direct Transfer Bonding (DTB) Process with Ultra-thin Chips

Tomoka Kirihata¹, Masanori Yamagishi¹, Yusuke Fumita¹, Ichiro Sano², Jun Kaneyasu², Shinya Takyu¹

¹LINTEC Corporation, Japan; ²TAZMO CO.,LTD., Japan

Ultra-precise Dispensing for High-resolution Redistribution Layers and 3D Interconnects in Advanced Packaging Applications

Filip Granek, Piotr Kowalczewski

XTPL SA, Poland

Microelectronic Packaging Challenges for Stacked Superconducting Qubit Chips Using Indium Bump Bonding

Andreas Schneider¹, Aswathi Koorikkat¹, John D. Lipp¹, Marcus J. French¹, Narendra Acharya², Kitti Ratter², Vivek Chidambaram², Pawala Ariyathilaka³, Emily Reynolds³

¹Technology, STFC-RAL, United Kingdom; ²National Quantum Computing Centre (NQCC), STFC, United Kingdom; ³Central Laser Facility (CLF), STFC-RAL, United Kingdom