Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
1LINTEC Corporation, Japan; 2TAZMO CO.,LTD., Japan
Ultra-precise Dispensing for High-resolution Redistribution Layers and 3D Interconnects in Advanced Packaging Applications
Filip Granek, Piotr Kowalczewski
XTPL SA, Poland
Microelectronic Packaging Challenges for Stacked Superconducting Qubit Chips Using Indium Bump Bonding
Andreas Schneider1, Aswathi Koorikkat1, John D. Lipp1, Marcus J. French1, Narendra Acharya2, Kitti Ratter2, Vivek Chidambaram2, Pawala Ariyathilaka3, Emily Reynolds3
1Technology, STFC-RAL, United Kingdom; 2National Quantum Computing Centre (NQCC), STFC, United Kingdom; 3Central Laser Facility (CLF), STFC-RAL, United Kingdom
