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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 3D: Assembly and Manufacturing

Time:

Tuesday, 16/Sept/2025:

4:35pm - 5:50pm

Session Chair: Laurent Mendizabal, CEA - LETI

Location: Makalu

Presentations

A New Carrier Tape for Direct Transfer Bonding (DTB) Process with Ultra-thin Chips

Tomoka Kirihata¹, Masanori Yamagishi¹, Yusuke Fumita¹, Ichiro Sano², Jun Kaneyasu², Shinya Takyu¹

¹LINTEC Corporation, Japan; ²TAZMO CO.,LTD., Japan

Ultra-precise Dispensing for High-resolution Redistribution Layers and 3D Interconnects in Advanced Packaging Applications

Filip Granek, Piotr Kowalczewski

XTPL SA, Poland

Microelectronic Packaging Challenges for Stacked Superconducting Qubit Chips Using Indium Bump Bonding

Andreas Schneider¹, Aswathi Koorikkat¹, John D. Lipp¹, Marcus J. French¹, Narendra Acharya², Kitti Ratter², Vivek Chidambaram², Pawala Ariyathilaka³, Emily Reynolds³

¹Technology, STFC-RAL, United Kingdom; ²National Quantum Computing Centre (NQCC), STFC, United Kingdom; ³Central Laser Facility (CLF), STFC-RAL, United Kingdom

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda