The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S 3C: Qulaity and Reliability

Time:

Tuesday, 16/Sept/2025:

4:35pm - 5:50pm

Location: Mont Blanc

Presentations

The Effect of Solder Die Attach Voids on the Junction-to-case Thermal Resistance of MOSFET Packages

Tao Lu, Baojun Qiu, Xiaodong Chen, Hui Xiao, Daojun Luo

CEPREI Laboratory, China, People's Republic of

Experimental and Numerical Investigation of the Impact of Surface Roughness of Copper Plated through Holes on Thermomechanical Reliability

Janine Conrad¹, Martin Schneider-Ramelow¹, Olaf Wittler²

¹Technische Universität Berlin, Germany; ²Fraunhofer IZM Berlin, Germany

The Impact of Processing Conditions on Bond Reliability in Pressureless Silver Sintering

Rajrupa Paul, Francesca Vita, Corentin Seibert, Reza Soleimanzadeh, Jean-Yves Loisy, Stephan Wirths

Hitachi Energy Ltd., Switzerland

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Privacy Statement · Conference: EMPC 2025

The 25th European Microelectronics & Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)