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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 3C: Quality and Reliability

Time:

Tuesday, 16/Sept/2025:

4:35pm - 5:50pm

Session Chair: Gabor Harsanyi, Budapest University of Technology and Economics

Location: Mont Blanc

Presentations

Microstructural Characterization for the Joining Interface of Ag@Si Composite Sinter Joining for SiC Power Device by Scanning Transmission Electron Microscopy

Masahiko Nishijima¹, Ran Liu¹, Yang Liu¹, Koji. S Nakayama¹, Cuantong Chen¹, Minoru Ueshima², Katsuaki Suganuma¹

¹F3D system Integration Lab, SANKEN, Osaka University, Japan; ²Daicel Corporation

Experimental and Numerical Investigation of the Impact of Surface Roughness of Copper Plated through Holes on Thermomechanical Reliability

Janine Conrad¹, Martin Schneider-Ramelow¹, Olaf Wittler²

¹Technische Universität Berlin, Germany; ²Fraunhofer IZM Berlin, Germany

The Impact of Processing Conditions on Bond Reliability in Pressureless Silver Sintering

Rajrupa Paul, Francesca Vita, Corentin Seibert, Reza Soleimanzadeh, Jean-Yves Loisy, Stephan Wirths

Hitachi Energy Ltd., Switzerland

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda