Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Microstructural Characterization for the Joining Interface of Ag@Si Composite Sinter Joining for SiC Power Device by Scanning Transmission Electron Microscopy
Masahiko Nishijima1, Ran Liu1, Yang Liu1, Koji. S Nakayama1, Cuantong Chen1, Minoru Ueshima2, Katsuaki Suganuma1
1F3D system Integration Lab, SANKEN, Osaka University, Japan; 2Daicel Corporation
Experimental and Numerical Investigation of the Impact of Surface Roughness of Copper Plated through Holes on Thermomechanical Reliability
Janine Conrad1, Martin Schneider-Ramelow1, Olaf Wittler2
