Conference Agenda

Bi–in Segregation in Low-temperature SLID Bonding: Au-in-bi System

Gayathry Thampi, Hoang-Vu Nguyen, Knut Eilif Aasmundtveit

University of South Eastern Norway, Norway

Large-area (> 1600 mm²) Sintering at 220°C with Micro-Scale Copper Flakes

Olaf Rämer², Rohan Ghosh¹, Gomathi Varshini Kanthi Natarajan¹, Sri Krishna Bhogaraju¹

¹CuNex GmbH, Ingolstadt, Germany; ²Technische Universität Berlin, Berlin, Germany

Influence of Total Encapsulation of White-light Mid-power LED Packages Over the Correlated Colour Temperature

Edward André Olivera Apaza, Matthias Hien, Mahmoud Beker, Markus Zankl

THD Technologie Campus Cham, Germany