Conference Agenda

Bi–in Segregation in Low-temperature SLID Bonding: Au-in-bi System

Gayathry Thampi, Hoang Vu Nguyen, Knut Eilif Aasmundtveit

University of South Eastern Norway, Norway

Large Area (> 2500mm²) Sintering at Sub 220°C With Micro-scale Copper Flakes

Rohan Ghosh¹, Olaf Rämer², Gomathi Varshini Kanthi Natarajan¹, Sri Krishna Bhogaraju¹

¹CuNex GmbH, Ingolstadt, Germany; ²Technische Universität Berlin, Berlin, Germany

Influence of Total Encapsulation of White-light Mid-power LED Packages Over the Correlated Colour Temperature

Edward André Olivera Apaza, Matthias Hien, Mahmoud Beker, Markus Zankl

THD Technologie Campus Cham, Germany