JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organizers at office@empc2025.org.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S 2D: Materials

Time:

Tuesday, 16/Sept/2025:

1:50pm - 3:05pm

Location: Makalu

Presentations

Bi–in Segregation in Low-temperature SLID Bonding: Au-in-bi System

Gayathry Thampi, Hoang Vu Nguyen, Knut Eilif Aasmundtveit

University of South Eastern Norway, Norway

Large Area (> 2500mm²) Sintering at Sub 220°C With Micro-scale Copper Flakes

Rohan Ghosh¹, Olaf Rämer², Gomathi Varshini Kanthi Natarajan¹, Sri Krishna Bhogaraju¹

¹CuNex GmbH, Ingolstadt, Germany; ²Technische Universität Berlin, Berlin, Germany

Influence of Total Encapsulation of White-light Mid-power LED Packages Over the Correlated Colour Temperature

Edward André Olivera Apaza, Matthias Hien, Mahmoud Beker, Markus Zankl

THD Technologie Campus Cham, Germany