The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 2D: Materials

Time:

Tuesday, 16/Sept/2025:

1:50pm - 3:05pm

Session Chair: Tanja Braun, Fraunhofer IZM

Location: Makalu

Presentations

Bi–in Segregation in Low-temperature SLID Bonding: Au-in-bi System

Gayathry Thampi, Hoang-Vu Nguyen, Knut Eilif Aasmundtveit

University of South Eastern Norway, Norway

Large-area (> 1600 mm²) Sintering at 220°C with Micro-Scale Copper Flakes

Olaf Rämer², Rohan Ghosh¹, Gomathi Varshini Kanthi Natarajan¹, Sri Krishna Bhogaraju¹

¹CuNex GmbH, Ingolstadt, Germany; ²Technische Universität Berlin, Berlin, Germany

Influence of Total Encapsulation of White-light Mid-power LED Packages Over the Correlated Colour Temperature

Edward André Olivera Apaza, Matthias Hien, Mahmoud Beker, Markus Zankl

THD Technologie Campus Cham, Germany