The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S 2C: System in Package

Time:

Tuesday, 16/Sept/2025:

1:50pm - 3:05pm

Location: Mont Blanc

Presentations

Research on Damage Behaviour of Vertical Interconnection Solder Joints in a RF SiP Module

Hui Xiao, Baojun Qiu, Jiahao Liu, Tao Lu, Xiaodong Chen, Daojun Luo

China Electronic Product Reliability and Environmental Testing Research Institute, China, People's Republic of

A Miniaturized Dual Band (28/39 GHz) AiP Design for Millimeter-Wave 5G Mobile Phone Applications

Sheng-Chi Hsieh

Advanced Semiconductor Engineering, Inc.(ASE group), Taiwan

Development of a 3D Quilt Packaging Method for Implantable Applications

Chloé Bernardoni¹, Ahmad Shah Idil^1,2, Lewis Keeble¹, Timothy Constandinou^1,2

¹Imperial College London, United Kingdom; ²Mint Neurotechnologies Ltd

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