The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 2C: Special Topics

Time:

Tuesday, 16/Sept/2025:

1:50pm - 3:05pm

Session Chair: Wilfrid Aklamavo, SERMA MICROELECTRONICS

Location: Mont Blanc

Presentations

Advanced Dielectric Films for Fusion Bonded 3D Integration

Taisuke Yamamoto, Hayato Kitagawa, Ryosuke Sato, Ryota Ogata, Fumihiro Inoue

Yokohama National University, Japan

A Miniaturized Dual Band (28/39 GHz) AiP Design for Millimeter-Wave 5G Mobile Phone Applications

Sheng-Chi Hsieh, Yen Ting Wang, Hong-Sheng Huang, Wen-Chun Hsiao, Po-An Lin, Chen-Chao Wang, Chih-Pin Hung

Advanced Semiconductor Engineering, Inc.(ASE group), Taiwan

Chip-Scale 3D Quilt Packaging for Modular Neural Implants

Chloé Bernardoni¹, Ahmad Shah Idil^1,2, Lewis Keeble¹, Timothy Constandinou^1,2

¹Imperial College London, United Kingdom; ²Mint Neurotechnologies Ltd