Conference Time: 27th July 2025, 12:07:50am CEST
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S 2C: Special Topics
Time:
Tuesday, 16/Sept/2025:
1:50pm - 3:05pm
Location: Mont Blanc
Presentations
Advanced Dielectric Films for Fusion Bonded 3D Integration
Taisuke Yamamoto , Hayato Kitagawa, Ryosuke Sato, Ryota Ogata, Fumihiro Inoue
Yokohama National University, Japan
A Miniaturized Dual Band (28/39 GHz) AiP Design for Millimeter-Wave 5G Mobile Phone Applications
Sheng-Chi Hsieh, Yen Ting Wang , Hong-Sheng Huang, Wen-Chun Hsiao, Po-An Lin, Chen-Chao Wang, Chih-Pin Hung
Advanced Semiconductor Engineering, Inc.(ASE group), Taiwan
Development of a 3D Quilt Packaging Method for Implantable Applications
Chloé Bernardoni 1 , Ahmad Shah Idil1,2 , Lewis Keeble1 , Timothy Constandinou1,2
1 Imperial College London, United Kingdom; 2 Mint Neurotechnologies Ltd
