Register New
Login
Conference Time: 7th June 2025, 03:14:01pm CEST
 

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
Authors
 
Session Overview
Session
S 1D: Assembly and Manufacturing
Time:
Tuesday, 16/Sept/2025:
11:15am - 12:30pm

 Location: Makalu

Show help for 'Increase or decrease the abstract text size'
Presentations

Development of Advanced Screen-printing Technology for Flip-chip Transfer of Electronic Components

David Henry, Daniel Mermin, Rémi Franiatte, Delphine Rolland, Catherine Brunet-Manquat, Thierry Flahaut, Damien Saint-patrice, Bruno Fain, Hélène Lhermet, Jean-Claude Bastien, François Blard, Emmanuel Ollier

CEA, France


Thinning and Dicing Process Integration of High Accuracy Using A Novel Self-assembly Stage for Chip on Wafer

Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu

LINTEC Corporation, Japan


A Study of 355 nm UV Laser Ablation Process for Singulation of Silicon Wafers

Serguei Stoukatch, Francois Dupont, Jean-Michel Redouté

Microsys lab, Department of Electrical Engineering and Computer Science, University of Liège, Belgium



 
  Mobile View  Print View  
Contact and Legal Notice · Contact Address:
Privacy Statement · Conference: EMPC 2025		 Conference Software: ConfTool Pro 2.8.106
© 2001–2025 by Dr. H. Weinreich, Hamburg, Germany