Conference Time: 27th July 2025, 12:17:11am CEST
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S 1D: Assembly and Manufacturing
Time:
Tuesday, 16/Sept/2025:
11:15am - 12:30pm
Location: Makalu
Presentations
Development of Advanced Screen-printing Technology for Flip-chip Transfer of Electronic Components
David Henry , Daniel Mermin, Rémi Franiatte, Delphine Rolland, Catherine Brunet-Manquat, Thierry Flahaut, Damien Saint-patrice, Bruno Fain, Hélène Lhermet, Jean-Claude Bastien, François Blard, Emmanuel Ollier
CEA, France
Thinning and Dicing Process Integration of High Accuracy Using A Novel Self-assembly Stage for Chip on Wafer
Tadatomo Yamada , Ken Takano, Toshiaki Menjo, Shinya Takyu
LINTEC Corporation, Japan
A Study of 355 nm UV Laser Ablation Process for Singulation of Silicon Wafers
Serguei Stoukatch , Francois Dupont, Jean-Michel Redouté
Microsys lab, Department of Electrical Engineering and Computer Science, University of Liège, Belgium
