Development of Advanced Screen-printing Technology for Flip-chip Transfer of Electronic Components

David Henry, Daniel Mermin, Rémi Franiatte, Delphine Rolland, Catherine Brunet-Manquat, Thierry Flahaut, Damien Saint-patrice, Bruno Fain, Hélène Lhermet, Jean-Claude Bastien, François Blard, Emmanuel Ollier

CEA, France

Thinning and Dicing Process Integration of High Accuracy Using A Novel Self-assembly Stage for Chip on Wafer

Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu

LINTEC Corporation, Japan

A Study of 355 nm UV Laser Ablation Process for Singulation of Silicon Wafers

Serguei Stoukatch, Francois Dupont, Jean-Michel Redouté

Microsys lab, Department of Electrical Engineering and Computer Science, University of Liège, Belgium